Method of manufacturing a sensor for sensing analytes
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61B-005/15
A61B-005/00
A61B-005/145
A61B-005/1486
A61M-037/00
C12Q-001/00
G01N-027/327
A61B-005/1495
A61M-025/00
출원번호
US-0379955
(2016-12-15)
등록번호
US-10173042
(2019-01-08)
발명자
/ 주소
Pushpala, Ashwin
Szmodis, Alan
Chapman, Matthew
Hall, Weldon
Miller, Scott
Hafezi, Hooman
출원인 / 주소
Sano Intelligence, Inc.
대리인 / 주소
Schox, Jeffrey
인용정보
피인용 횟수 :
0인용 특허 :
14
초록▼
A microsensor and method of manufacture for a microsensor, comprising an array of filaments, wherein each filament of the array of filaments comprises a substrate and a conductive layer coupled to the substrate and configured to facilitate analyte detection. Each filament of the array of filaments c
A microsensor and method of manufacture for a microsensor, comprising an array of filaments, wherein each filament of the array of filaments comprises a substrate and a conductive layer coupled to the substrate and configured to facilitate analyte detection. Each filament of the array of filaments can further comprise an insulating layer configured to isolate regions defined by the conductive layer for analyte detection, a sensing layer coupled to the conductive layer, configured to enable transduction of an ionic concentration to an electronic voltage, and a selective coating coupled to the sensing layer, configured to facilitate detection of specific target analytes/ions. The microsensor facilitates detection of at least one analyte present in a body fluid of a user interfacing with the microsensor.
대표청구항▼
1. A method of manufacturing a sensor for sensing analytes, the method comprising: with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate;forming an insulating layer coupled to exposed surfaces of the array of colum
1. A method of manufacturing a sensor for sensing analytes, the method comprising: with a dicing saw, removing material from a substrate, thereby forming an array of columnar protrusions at a first surface of the substrate;forming an insulating layer coupled to exposed surfaces of the array of columnar protrusions;with the dicing saw, removing material from a distal end of each columnar protrusion in the array of columnar protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each columnar protrusion in the array of columnar protrusions; andcoupling a conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions. 2. The method of claim 1, wherein at least one of forming the array of columnar protrusions and defining the sharp tip at the distal end of each columnar protrusion in the array of columnar protrusions comprises passing the dicing saw in a first direction and in a second direction perpendicular to the first direction. 3. The method of claim 2, wherein removing material from the distal end of each columnar protrusion in the array of columnar protrusions comprises passing an angled blade of the dicing saw across the distal end of each columnar protrusion of the array of columnar protrusions. 4. The method of claim 1, wherein forming the array of columnar protrusions comprises forming the array with a density of 100 columnar protrusions per cm2. 5. The method of claim 1, wherein forming the insulating layer comprises chemical vapor deposition of an oxide at exposed surfaces of the array of columnar protrusions. 6. The method of claim 1, wherein coupling the conductive layer to the sharp tip of each columnar protrusion in the array of columnar protrusions comprises coupling a titanium-platinum composition to the sharp tip of each columnar protrusion in the array of columnar protrusions. 7. The method of claim 6, wherein coupling the titanium-platinum composition to the sharp tip of each columnar protrusion in the array of columnar protrusions comprises evaporating the titanium-platinum composition onto the sharp tip of each columnar protrusion in the array of columnar protrusions. 8. The method of claim 1, further comprising coupling a contact pad to the substrate, the contact pad operable to interface the substrate with electronics components during operation of the sensor. 9. The method of claim 1, further comprising coupling at least one of a sensing layer and a selective layer to the conductive layer, wherein coupling at least one of the sensing layer and the selective layer comprises coupling a polymer material to the conductive layer of each columnar protrusion of the array of columnar protrusions. 10. The method of claim 9, further wherein coupling the polymer material comprises coupling a polyvinyl alcohol material proximal to at least one of the sharp tip and another portion of each columnar protrusion of the array of columnar protrusions. 11. The method of claim 10, wherein coupling the polymer material comprises coupling the sensing layer, characterized by reversible redox reaction behavior, superficial to the conductive layer of the sensor and coupling the selective layer, comprising a distribution of molecules complementary to a target analyte, superficial to the sensing layer of the sensor. 12. The method of claim 1, further comprising forming a set of subarrays from the array of columnar protrusions. 13. A method of manufacturing a sensor for sensing analytes, the method comprising: with a dicing saw, removing material from a substrate, thereby forming an array of protrusions at a first surface of the substrate;forming an insulating layer coupled to exposed surfaces of the array of protrusions;with the dicing saw, removing material from a distal end of each protrusion in the array of protrusions, thereby defining a sharp tip, uncovered by the insulating layer, at the distal end of each protrusion in the array of protrusions;coupling a conductive layer to the sharp tip of each protrusion in the array of protrusions; andcoupling a contact pad to the substrate, the contact pad operable to interface the substrate with electronics components during operation of the sensor. 14. The method of claim 13, wherein at least one of forming the array of protrusions and defining the sharp tip at the distal end of each protrusion in the array of protrusions comprises passing the dicing saw in a first direction and in a second direction perpendicular to the first direction, and wherein removing material from the distal end of each protrusion in the array of protrusions comprises passing an angled blade of the dicing saw across the distal end of each protrusion of the array of protrusions. 15. The method of claim 14, wherein forming the insulating layer comprises chemical vapor deposition of an oxide at exposed surfaces of the array of protrusions. 16. The method of claim 14, wherein coupling the conductive layer to the sharp tip of each protrusion in the array of protrusions comprises evaporating a titanium-platinum composition to the sharp tip of each protrusion in the array of protrusions. 17. The method of claim 16, further comprising: 1) coupling a sensing layer, characterized by reversible redox reaction behavior, superficial to the conductive layer of the sensor and 2) coupling a selective layer, comprising a distribution of molecules complementary to a target analyte, superficial to the sensing layer of the sensor. 18. The method of claim 17, wherein coupling at least one of the sensing layer and the selective layer comprises a coating process. 19. The method of claim 17, further comprising coupling an intermediate protective layer, including a functional compound, superficial to the sensing layer of the sensor and deeper than the selective layer of the sensor, wherein coupling the intermediate protective layer includes coupling at least one of polytetrafluoroethylene, a chlorinated polymer, a tetrafluoroethylene-based fluoropolymer-copolymer, and polyethylene glycol, and wherein the functional compound includes at least one of a lipid and a charged chemical specie. 20. The method of claim 13, further including defining a notch at the sharp tip of at least at one protrusion of the array of protrusions, and performing at least one of: isolating a portion of the sensing layer within the notch, depositing a calibration material within the notch, and depositing a therapeutic substance within the notch.
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