Laser processing of sapphire substrate and related applications
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-003/00
C03B-033/02
B32B-017/06
B23K-026/53
B23K-026/55
B23K-026/06
B23K-026/073
B23K-026/00
B23K-026/0622
B23K-026/40
B23K-103/00
출원번호
US-0585305
(2017-05-03)
등록번호
US-10179748
(2019-01-15)
발명자
/ 주소
Marjanovic, Sasha
Piech, Garrett Andrew
Tsuda, Sergio
Wagner, Robert Stephen
출원인 / 주소
Corning Incorporated
대리인 / 주소
Bray, Kevin L.
인용정보
피인용 횟수 :
0인용 특허 :
113
초록▼
A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, th
A method of laser processing a material to form a separated part. The method includes focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction, directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a hole or fault line along the laser beam focal line within the material, and directing a defocused carbon dioxide (CO2) laser from a distal edge of the material over the plurality of holes to a proximal edge of the material.
대표청구항▼
1. A method of laser cutting a material comprising: focusing a pulsed laser beam into a laser beam focal line, the laser beam focal line having a length in a range between about 0.1 mm and 100 mm;directing the laser beam focal line into the material, the laser beam focal line generating an induced a
1. A method of laser cutting a material comprising: focusing a pulsed laser beam into a laser beam focal line, the laser beam focal line having a length in a range between about 0.1 mm and 100 mm;directing the laser beam focal line into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;translating the material or the laser beam relative to one another, thereby forming a plurality of defect lines in the material with the laser; anddirecting an IR laser beam over the plurality of defect lines. 2. The method of claim 1, wherein the material is sapphire. 3. The method of claim 1, wherein a pulse duration of the pulsed laser beam is in a range of between greater than about 1 picosecond and less than about 100 picoseconds. 4. The method of claim 3, wherein the pulse duration of the pulsed laser beam is in a range of between greater than about 5 picoseconds and less than about 20 picoseconds. 5. The method of claim 1, wherein a repetition rate of the pulsed laser beam is in a range of between 1 kHz and 2 MHz. 6. The method of claim 5, wherein the repetition rate of the pulsed laser beam is in a range of between 10 kHz and 650 kHz. 7. The method of claim 1, wherein the pulsed laser beam has an average laser power measured at the material greater than 40μJ per mm thickness of material. 8. The method of claim 1, wherein the pulses are produced in bursts of at least two pulses separated by a duration in a range of between 1 nsec and 50 nsec, and the burst repetition frequency is in a range of between about 1 kHz and about 2000 kHz. 9. The method of claim 8, wherein the pulses are separated by a duration in a range of between 10 nsec and 30 nsec. 10. The method of claim 1, wherein the pulsed laser beam has a wavelength and the material is substantially transparent at the wavelength. 11. The method of claim 1, wherein the laser beam focal line has a length in a range of between about 0.1 mm and about 10 mm. 12. The method of claim 1, wherein the laser beam focal line has an average spot diameter in a range of between about 0.1 μm and about 5 μm. 13. The method of claim 1, further comprising directing the IR laser from a proximal edge of the material to a tangential edge of the part, thereby separating a part from the material. 14. The method of claim 1, wherein directing the IR laser beam comprises directing a CO2 laser beam. 15. The method of claim 1, wherein the IR laser beam is defocused to a spot size in a range of between about 2 mm and about 20 mm. 16. The method of claim 1, wherein directing the IR laser beam includes directing the IR laser beam from a distal edge of the material to a proximal edge of the material. 17. A method of laser cutting a material comprising: (i) focusing a pulsed laser beam into a laser beam focal line, the laser beam focal line having a length in a range between about 0.1 mm and 100 mm;ii) directing the laser beam focal line into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material;(iii) repeatedly performing (i) and (ii) to form a fault line within the material, the fault line including a plurality of the defect lines; and(iv) directing an IR laser beam over the fault line. 18. The method of claim 17, wherein the fault line is curved. 19. The method of claim 17, wherein the fault line is circular. 20. The method of claim 17, wherein the fault line is linear. 21. The method of claim 17, wherein the directing the IR laser beam fractures the material along the fault line. 22. The method of claim 1, wherein the pulsed laser beam is non-diffractive. 23. The method of claim 22, wherein the pulsed laser beam is a Bessel beam, an Airy beam, a Weber beams or a Mathieu beam. 24. The method of claim 1, wherein the pulsed laser beam is donut-shaped. 25. The method of claim 1, wherein the focusing a pulsed laser beam comprises passing the pulsed laser beam through an axicon. 26. The method of claim 17, wherein the pulsed laser beam is non-diffractive. 27. The method of claim 26, wherein the pulsed laser beam is a Bessel beam, an Airy beam, a Weber beams or a Mathieu beam. 28. The method of claim 17, wherein the pulsed laser beam is donut-shaped. 29. The method of claim 17, wherein the focusing a pulsed laser beam comprises passing the pulsed laser beam through an axicon.
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