An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed wit
An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor.
대표청구항▼
1. An electrical connector comprising: an insulative housing having a surface;a signal conductor disposed on the surface of the insulative housing having a first contact end, a second contact end, and an intermediate portion between the first contact end and the second contact end, the intermediate
1. An electrical connector comprising: an insulative housing having a surface;a signal conductor disposed on the surface of the insulative housing having a first contact end, a second contact end, and an intermediate portion between the first contact end and the second contact end, the intermediate portion having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment; anda film layer disposed on at least a portion of the first signal conductor segment and at least a portion of the second signal conductor segment. 2. The electrical connector of claim 1, wherein the film layer has a resistance. 3. The electrical connector of claim 1, wherein the film layer is further disposed on a portion of the surface of the insulative housing and the portion of the surface of the insulative housing is roughened or grooved to facilitate a connection between the film layer and the insulative housing. 4. The electrical connector of claim 1, wherein a surface of the portions of the first and second signal conductor segments are roughened or grooved to facilitate a connection between the film layer and the portion of the first and second signal conductor segments. 5. The electrical connector of claim 1, wherein the film layer comprises a thick film layer. 6. A method of forming an electrical connector comprising: providing an insulative housing having a surface;providing a signal conductor on the surface of the insulative housing, the signal conductor having a first contact end, a second contact end, and an intermediate portion between the first contact end and the second contact end, the intermediate portion having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment; anddepositing a film layer on at least a portion of the first signal conductor segment and at least a portion of the second signal conductor segment. 7. The method of claim 6, wherein providing the signal conductor comprises insert molding the signal conductor into the insulative housing. 8. The method of claim 6, wherein the film layer has a resistance. 9. The method of claim 6, further comprising: preparing a portion of the surface of the insulative housing; anddepositing the film layer on the portion of the surface of the insulative housing. 10. The method of claim 9, wherein preparing the portion of the surface comprises roughening or grooving the portion of the surface to facilitate a connection between the film layer and the insulative housing. 11. The method of claim 6, further comprising: preparing surfaces of the at least a portion of the first and second signal conductor segments to facilitate a connection between the film layer and the at least a portion of the first and second signal conductor segments. 12. The method of claim 11, wherein preparing the surfaces comprises roughening or grooving the surfaces. 13. The method of claim 6, wherein the film layer comprises a thick film layer. 14. The method of claim 6, further comprising: depositing a second film layer on top of the film layer. 15. The method of claim 6, wherein the film layer has a conductivity ranging from about 1:100 and about 1:1,000,000 of that of standard pure copper. 16. The method of claim 6, wherein the film layer is a lossy dielectric, a lossy polymer resin, or a lossy magnetic material. 17. The method of claim 6, wherein the film layer is a lossy magnetic material comprising one of a ferrite and a ferrite-particle-filled polymer resin matrix. 18. The method of claim 6, further comprising: etching at least a portion of the film layer to achieve a desired level of electrical resistance. 19. The electrical connector of claim 1, further comprising a second film layer disposed on top of the film layer. 20. The electrical connector of claim 1, wherein the film layer has a conductivity ranging from about 1:100 and about 1:1,000,000 of that of standard pure copper. 21. The electrical connector of claim 1, wherein the film layer is a lossy dielectric, a lossy polymer resin, or a lossy magnetic material. 22. The electrical connector of claim 1, wherein the film layer is a lossy magnetic material comprising one of a ferrite and a ferrite-particle-filled polymer resin matrix. 23. The electrical connector of claim 1, wherein at least a portion of the film layer is etched to achieve a desired level of electrical resistance. 24. The electrical connector of claim 1, further comprising a second film layer deposited on said film layer. 25. The electrical connector of claim 1, wherein the film layer comprises a dielectric. 26. The method ofclaim 6, wherein the film layer comprises a dielectric. 27. An electrical connector comprising: an insulative housing having a surface;a signal conductor disposed on the surface of the insulative housing, said signal conductor having a first signal conductor segment and a second signal conductor segment spatially separated from the first signal conductor segment; anda film layer disposed on at least a portion of the first signal conductor segment and at least a portion of the second signal conductor segment. 28. The electrical connector of claim 27, wherein the film layer has a resistance. 29. The electrical connector of claim 27, wherein the film layer is further disposed on a portion of the surface of the insulative housing and the portion of the surface of the insulative housing is roughened or grooved to facilitate a connection between the film layer and the insulative housing. 30. The electrical connector of claim 27, wherein a surface of the portions of the first and second signal conductor segments are roughened or grooved to facilitate a connection between the film layer and the portion of the first and second signal conductor segments. 31. The electrical connector of claim 27, wherein the film layer comprises a thick film layer. 32. The electrical connector of claim 27, further comprising a second film layer disposed on top of the film layer. 33. The electrical connector of claim 27, wherein the film layer has a conductivity ranging from about 1:100 and about 1:1,000,000 of that of standard pure copper. 34. The electrical connector of claim 27, wherein the film layer is a lossy dielectric, a lossy polymer resin, or a lossy magnetic material. 35. The electrical connector of claim 27, wherein the film layer is a lossy magnetic material comprising one of a ferrite and a ferrite-particle-filled polymer resin matrix. 36. The electrical connector of claim 27, wherein at least a portion of the film layer is etched to achieve a desired level of electrical resistance. 37. The electrical connector of claim 27, further comprising a second film layer deposited on said film layer. 38. The electrical connector of claim 27, wherein the film layer comprises a dielectric. 39. An electrical connector comprising an insulative housing; a signal conductor disposed on the insulative housing, said signal conductor having, a first signal conductor segment and a second signal conductor segment separated from the first signal conductor segment;anda film layer disposed on at least a portion of the first signal conductor segment and at least a portion of the second signal conductor segment. 40. The electrical connector of claim 39, wherein the film layer has a resistance. 41. The electrical connector of claim 39, wherein the film layer is further disposed on a portion of the insulative housing and a surface of the insulative housing is roughened or grooved to facilitate a connection between the film layer and the insulative housing. 42. The electrical connector of claim 39, wherein a surface of the portions of the first and second signal conductor segments are roughened or grooved to facilitate a connection between the film layer and the portion of the first and second signal conductor segments. 43. The electrical connector of claim 39, wherein the film layer comprises a thick film layer.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (62)
Rothermel, Brent Ryan; Morgan, Chad William; Sharf, Alex Michael; Helster, David Wayne, Active wafer for improved gigabit signal recovery, in a serial point-to-point architecture.
Preputnick George ; Fedder James Lee ; Mickievicz Scott Keith ; Whyne Richard Nicholas, Connector assembly with shielded modules and method of making same.
Morlion Danny (St. Amandsberg BEX) Jonckheere Luc (Louvain BEX) van Koetsem Jan P. K. (Zwijnrecht BEX), Connector for a cable for high frequency signals.
Winings, Clifford L.; Shuey, Joseph B.; Sercu, Stefaan Hendrik Josef; Smith, Stephen B., Cross-talk canceling technique for high speed electrical connectors.
Cravens David M. (Etters PA) Denlinger Keith R. (Lancaster PA) Myer John M. (Millersville PA) Hopkins John R. (Cambridge MD), Filter insert for connectors and cable.
Goodman Joseph R. (Lake City PA) Woratyla John A. (Camp Hill PA) Zell Dale R. (Elizabethtown PA), Insulation displacing connector with programmable ground bussing feature.
Mraz James E. (Lindenhurst IL) Schwartz Martin T. (Glenview IL) Kemp James M. (Libertyville IL) Schotanus Joel M. (Wildwood IL) Schwarz Donald P. (Wheeling IL), Process for making insert molded circuit.
Weber Ronald M. (Lebanon PA) Swengel ; Jr. Robert C. (York PA) Weidler Charles H. (Lancaster PA) Wise James H. (Palmyra PA), Programmable modular connector assembly.
Rostoker Michael D. (San Jose CA) Ley Tom (Santa Clara CA), Semiconductor device package with solder bump electrical connections on an external surface of the package.
McNamara David M. (Lyndeborough NH) Provencher Daniel B. (Weare NH) Stokoe Philip T. (Attleboro MA) Howard William E. (New Boston NH) Gailus Mark W. (Somerville MA), Shielded electrical connector.
Kennedy ; III Robert M. ; Korony Gheorghe ; Liu Donghang ; Mevissen Jeffrey P. ; Heistand ; II Robert H., Ultra-small resistor-capacitor thin film network for inverted mounting to a surface.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.