IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0807670
(2017-11-09)
|
등록번호 |
US-10199585
(2019-02-05)
|
우선권정보 |
JP-2014-219135 (2014-10-28) |
발명자
/ 주소 |
- Hiroki, Masaaki
- Endo, Akio
|
출원인 / 주소 |
- Semiconductor Energy Laboratory Co., Ltd.
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
0 인용 특허 :
16 |
초록
▼
A highly portable and highly browsable light-emitting device is provided. A light-emitting device that is less likely to be broken is provided. The light-emitting device has a strip-like region having high flexibility and a strip-like region having low flexibility that are arranged alternately. In t
A highly portable and highly browsable light-emitting device is provided. A light-emitting device that is less likely to be broken is provided. The light-emitting device has a strip-like region having high flexibility and a strip-like region having low flexibility that are arranged alternately. In the region having high flexibility, a light-emitting panel and a plurality of spacers overlap with each other. In the region having low flexibility, the light-emitting panel and a support overlap with each other. When the region having high flexibility is bent, the angle between normals of facing planes of the two adjacent spacers changes according to the bending of the light-emitting panel; thus, a neutral plane can be formed in the light-emitting panel or in the vicinity of the light-emitting panel.
대표청구항
▼
1. A semiconductor device comprising: a panel comprising a first region, a second region, and a third region, the first region being between the second region and the third region;a first spacer and a second spacer which is adjacent to the first spacer, the first spacer and the second spacer overlap
1. A semiconductor device comprising: a panel comprising a first region, a second region, and a third region, the first region being between the second region and the third region;a first spacer and a second spacer which is adjacent to the first spacer, the first spacer and the second spacer overlapping with the first region;a first support overlapping with the second region; anda second support overlapping with the third region,wherein the panel comprises a pixel portion in the first region, the second region, and the third region,wherein the first spacer and the second spacer each comprise an opening,wherein the first spacer and the second spacer are connected to each other through an elastic body in the openings,wherein the elastic body is configured to connect the first support and the second support, andwherein an angle between normals of facing planes of the first spacer and the second spacer changes according to bending of the first region. 2. The semiconductor device according to claim 1, wherein the first spacer and the second spacer are in contact with the panel. 3. The semiconductor device according to claim 1, further comprising a protective layer in contact with the panel in the first region, wherein the first spacer and the second spacer are in contact with the protective layer. 4. The semiconductor device according to claim 1, wherein a width of a first surface of each of the first spacer and the second spacer on a panel side is larger than a width of a second surface of each of the first spacer and the second spacer on a side opposite to the panel side. 5. The semiconductor device according to claim 1, wherein the pixel portion comprises a light-emitting element. 6. The semiconductor device according to claim 1, wherein the elastic body is a spring or rubber. 7. A semiconductor device comprising: a panel comprising a first region, a second region, and a third region, the first region being between the second region and the third region;a connection portion overlapping with the first region;a first support overlapping with the second region; anda second support overlapping with the third region,wherein the panel comprises a pixel portion in the first region, the second region, and the third region,wherein the connection portion comprises an elastic body and a plurality of spacers,wherein the elastic body is configured to connect the first support and the second support,wherein the plurality of spacers each comprise an opening,wherein the plurality of spacers are connected to each other through the elastic body in the openings, andwherein the panel can be bent in the first region. 8. The semiconductor device according to claim 7, wherein the plurality of spacers are in contact with the panel. 9. The semiconductor device according to claim 7, further comprising a protective layer, wherein the connection portion overlaps with the panel with the protective layer positioned therebetween,wherein the panel overlaps with the first support with the protective layer positioned therebetween, andwherein the panel overlaps with the second support with the protective layer positioned therebetween. 10. The semiconductor device according to claim 7, wherein a width of a first surface of each of the plurality of spacers on a panel side is larger than a width of a second surface of each of the plurality of spacers on a side opposite to the panel side. 11. The semiconductor device according to claim 7, wherein the pixel portion comprises a light-emitting element. 12. The semiconductor device according to claim 7, wherein the elastic body is a spring or rubber. 13. A semiconductor device comprising: a panel comprising a first region, a second region, a third region, a fourth region, and a fifth region, the first region being between the second region and the third region, and the fourth region being between the third region and the fifth region;a first connection portion overlapping with the first region;a second connection portion overlapping with the fourth region;a first support overlapping with the second region;a second support overlapping with the third region, anda third support overlapping with the fifth region,wherein the panel comprises a pixel portion in the first region, the second region, the third region, the fourth region, and the fifth region,wherein the first connection portion and the second connection portion each comprise an elastic body and a plurality of spacers,wherein the elastic body of the first connection portion is configured to connect the first support and the second support,wherein the elastic body of the second connection portion is configured to connect the second support and the third support,wherein the plurality of spacers each comprise an opening,wherein the plurality of spacers are connected to each other through the elastic body in the openings, andwherein the panel can be bent in the first region and the fourth region. 14. The semiconductor device according to claim 13, wherein the plurality of spacers are in contact with the panel. 15. The semiconductor device according to claim 13, further comprising a protective layer, wherein the first connection portion overlaps with the panel with the protective layer positioned therebetween,wherein the panel overlaps with the first support with the protective layer positioned therebetween, andwherein the panel overlaps with the second support with the protective layer positioned therebetween. 16. The semiconductor device according to claim 13, wherein a width of a first surface of each of the plurality of spacers on a panel side is larger than a width of a second surface of each of the plurality of spacers on a side opposite to the panel side. 17. The semiconductor device according to claim 13, wherein the pixel portion comprises a light-emitting element. 18. The semiconductor device according to claim 13, wherein the elastic body is a spring or rubber.
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