초록 ▼

A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the m

A module mount interposer may include one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to the interposer. The module mount interposer may also include a core configured to electrically couple with the module, wherein each of the fastener receivers are mechanically coupled to the core. The module mount interposer may additionally include a solder layer electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module.

대표청구항 ▼

1. A module mount interposer comprising: one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to an interposer;a core configured to electrically couple with the module, wherein each of the fastener receiver

1. A module mount interposer comprising: one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically and electrically couple a module to an interposer;a core configured to electrically couple with the module, wherein each of the fastener receivers is mechanically coupled to a first face of the core; anda solder layer including: a plurality of electrical connections electrically coupled to the core and configured to electrically couple with a printed circuit board (PCB) so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module; anda plurality of solder ball connectors mechanically coupled to a second face of the core, the plurality of solder ball connectors located directly opposite the fastener receivers. 2. The module mount interposer of claim 1, further comprising one or more alignment pins configured to align the module when the module is mechanically and electrically coupled to the interposer. 3. A module mount mechanism including the module mount interposer of claim 1 and one or more fasteners. 4. The module mount mechanism of claim 3, wherein each of the fasteners include a head and each of the fasteners pass through a corresponding hole defined by the module, wherein the head of the fasteners are oversized compared to the corresponding holes defined by the module and the heads urge the module towards the interposer. 5. The module mount mechanism of claim 3, wherein each of the fasteners comprises a bolt and the each of the fastener receivers comprises a nut. 6. The module mount mechanism of claim 5, wherein each of the nuts comprises a surface mount technology (SMT) nut. 7. The module mount mechanism of claim 3, wherein each of the fasteners and nuts are electrically coupled to a ground plane in the core which is electrically coupled to a ground plane in the PCB. 8. The module mount interposer of claim 1, wherein the core is configured as a square and the fastener receivers comprise four fastener receivers located at different corners of the core. 9. The module mount interposer of claim 1 wherein the core is configured to electrically couple with the module through a beam grid when the module is mechanically and electrically coupled to the interposer. 10. A module mount frame system comprising: a frame including one or more fastener receivers mechanically coupled to a first face of the frame, the one or more fastener receivers configured to mechanically couple with one or more fasteners so as to mechanically couple a module to a frame;a medial board comprising a core configured to electrically couple with the module; anda solder layer including: a plurality of electrical connections electrically coupled to the core and configured to electrically couple with a PCB so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module; anda plurality of solder ball connectors mechanically coupled to a second face of the frame, the plurality of solder ball connectors located directly opposite the fastener receivers. 11. The module mount frame system of claim 10, further comprising one or more alignment pins configured to align the module when the module is mechanically coupled to the frame. 12. A module mount mechanism including the module mount frame system of claim 10 and one or more fasteners. 13. The module mount mechanism of claim 12, wherein each of the fasteners include a head and each of the fasteners pass through a corresponding hole defined by the module, wherein the heads of the fasteners are oversized compared to the corresponding holes defined by the module and the heads urge the module towards the frame and the medial board. 14. The module mount frame system of claim 10, wherein the frame comprises a PCB frame. 15. The module mount frame system of claim 10, wherein the frame comprises a plastic fame. 16. The module mount frame system of claim 10, wherein the core is configured to electrically couple with the module through a beam grid when the module is mechanically coupled to the frame, wherein the frame substantially surrounds the medial board around an outside edge of the medial board without substantially covering a top surface or a bottom surface of the medial board. 17. A module comprising: a housing of a module defining a plurality of holes; anda module mount mechanism comprising: one or more fasteners; andan interposer comprising: one or more fastener receivers configured to mechanically couple with the fasteners so as to mechanically couple the housing and electrically couple the module to the interposer;a beam grid configured to electrically couple with the module when the module is mechanically and electrically coupled to the interposer;a core electrically coupled to the beam grid, wherein the fastener receivers are mechanically coupled to a first face of the core; anda solder layer including: a plurality of electrical connections electrically coupled to the core and configured to electrically couple with a PCB so as to provide an electrical signal from the module to the PCB and to provide an electrical signal from the PCB to the module; anda plurality of solder ball connectors mechanically coupled to a second face of the core, the plurality of solder ball connectors located directly opposite the fastener receivers. 18. The module of claim 17, wherein the interposer further comprises one or more alignment pins configured to align the housing of the module when the module is mechanically and electrically coupled to the interposer. 19. The module of claim 17, wherein each of the fasteners include a head and each of the fasteners pass through a corresponding hole defined by the housing of the module, wherein the heads of the fasteners are oversized compared to the corresponding holes defined by the housing of the module and the heads urge the housing of the module towards the interposer. 20. The module of claim 17, wherein each of the fasteners comprises a bolt and each of the fastener receivers comprises a nut.