이 특허에 인용된 특허 (613)

1. Konecke, Jeffery A., "One-device" system for testing constituents in fluids.

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2. Mizuta Masaharu,JPX, Abrasive member and cleaning device for probe needle for probe card.

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3. Barker, Delmar L.; Owens, William R., Acoustic crystal sonoluminescent cavitation devices and IR/THz sources.

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4. Cotteverte, Jean-Charles J. C.; Eid, Bernard A.; Renvaze, Christophe F. P., Active photonic crystal waveguide device.

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5. Cruciani Andrea,ITX, Adapter for integrated circuit cards for cellular telephones.

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6. Hayakawa Tomihiro (Sayama JPX), Adapter for integrated circuit device, and data transmission system using the same.

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7. Klatt Dieter,DEX ; Pelke Bernhard,DEX, Adaptor for contacting card-shaped supports.

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8. Bates ; III Charles Linsday, Adaptor for smart card.

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9. Fielding, Victor, Adaptor to allow apparatus with non-scart connectors to connectors to connect to apparatus with scart connectors.

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10. Wong, Jacob Y., Advanced magnetic stripe bridge (AMSB).

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11. Bernstein David (Sykesville MD), Agglutination assay.

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12. Dieckert Joseph C. (Bryan TX) Anderson Swiki A. (College Station TX), Air flow control equipment in chemical laboratory buildings.

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13. Denise Clark ; Pedro Haddock, Analyte test strip.

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14. Wong, Jacob Y.; Anderson, Roy L., Anonymous electronic card for generating personal coupons useful in commercial and security transactions.

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15. Moosbrugger, Peter J.; Stutzke, Nathan A.; Erickson, Jennifer L.; Johnson, Andrea K., Antenna system with integrated circuit package integrated radiators.

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16. Muraca,Patrick J., Antibody protein analysis chip.

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17. Barker,Delmar L.; Owens,William R., Apparatus and method for controlling transmission through a photonic band gap crystal.

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18. Burkart Axel E. (Utting DEX), Apparatus having a smart card accomodated by a diskette frame containing processor memory and battery power for interfac.

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19. Choi, Youngshin; Jeong, Kikwon, Apparatuses and methods for fabricating semiconductor packages.

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20. DiGiovanni David John ; Vengsarkar Ashish Madhukar ; Wagener Jefferson Lynn ; Windeler Robert Scott, Article comprising a micro-structured optical fiber, and method of making such fiber.

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21. Liao, Dave; Edelson, Steven Donald, Assembly of SIM card and RFID antenna.

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22. Duthaler Gregg M. ; Kazlas Peter T. ; Drzaic Paul S., Assembly of microencapsulated electronic displays.

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23. Miller,Robert O., Asymmetric photonic crystal waveguide element having symmetric mode fields.

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24. Deo Vinay ; Seidensticker Robert B. ; Simon Daniel R., Authentication system and method for smart card transactions.

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25. Klatt, Dieter, Authentication system for PC cards.

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26. Chen, Chii-Chang; Chien, Hung-Ta; Luan, Pi-Gang, Beamsplitter utilizing a periodic dielectric structure.

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27. Fadler Norman L. (St. Louis County MO) Kirchner Jack R. (St. Charles MO) Jones Paul W. (St. Charles MO), Biochemical card for use with an automated microbial identification machine.

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28. Staples John (Florissant MO) Tegeler Garry (Hazelwood MO) O\Bear Raymond (Granite City IL), Biochemical test card.

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29. Aoki, Youichi, Blood testing chip.

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30. Boutaghou Zine-Eddine ; Schaenzer Mark James ; Liners William Omar ; Hoehn Joel William ; Polycarpou Andreas Argyros, Burnishing head with fly height control spacer.

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31. David F. Bolognia ; Everett R. Salinas ; Sung-Hsia Jim Kuo ; David A. McAfee, Cable management system for use with rack mounted devices.

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32. Sippola, Ken; Schmidt, Julian; Skelding, Dori, Card.

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33. Sippola, Ken; Schmidt, Julian; Skelding, Dori, Card.

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34. Sippola, Ken; Schmidt, Julian; Skelding, Dori, Card.

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35. Yamada Siyouhachi (Machida JA) Nakatsubo Reigi (Tokyo JA), Card and card reader apparatus therefor.

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36. Xiao, Shi-Xin; Chen, Chung-Yuan; Chen, Long-Fong, Card assembly and electronic device thereof.

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37. Guion, Christian; Catte, Etienne, Card comprising electrical contacts.

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38. Landau, Steven; Corey, David, Card configured to receive separate battery.

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39. Lin, Chih-Chiang; Yu, Ta-Chih, Card holder.

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40. Tasaki Hisashi (Kyoto JPX) Endo Kimikazu (Kyoto JPX) Miyagi Ichiro (Takatsuki JPX) Tsunemi Shinichiro (Takatsuki JPX) Saida Yuichi (Kameoka JPX) Nakagaki Katsuo (Takatsuki JPX), Card identifying method and apparatus.

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41. Ruat, Ludovic; Ferrand, Olivier; Gailhard, Bruno, Card reader comprising an energy-saving system.

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42. Iwasaki Hiroshi,JPX, Card type memory device and a method for manufacturing the same.

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43. Collins,Richard J.; Montgomery, Jr.,R. Bruce; Kendle,Allen, Card with increased gripability.

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44. Hoppe, Joachim; Haghiri-Tehrani, Yahya, Carrier element for IC-modules.

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45. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Carrier element for an IC-module.

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46. Haghiri-Tehrani Yahya (Mnchen DEX) Barak Rene-Lucia (Unterhaching DEX), Carrier element to be incorporated into an identity card.

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47. Wallace Jack E. (San Antonio TX) Blum Kenneth (San Antonio TX), Carrier for detecting drug abuse compounds.

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48. Cardy Donald Leonard Nicholas,GBX, Carrier for samples or reagents.

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49. Cardy Donald Leonard Nicholas,GBX, Carrier for samples or reagents.

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50. Cao, Weidong; Hasson, Kenton C.; Knight, Ivor T.; Hanagata, Takayoshi, Cartridge assembly.

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51. Shim Jin Seop,KRX, Charge coupled device with stripe layers corresponding to CCD regions.

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52. Haghiri-Tehrani Yahya (Munchen DEX), Chip card and a method for producing it.

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53. Kreft Hans-Diedrich,DEX, Chip card capable of both contact and contactless operation including a contact block.

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54. Carpier, Roland; Lauvernier, Christine; Le Loc'h, Alain, Chip card equipped with a loop antenna, and associated micromodule.

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55. Noda, Chie; Murase, Atsushi; Ishikawa, Hidetoshi, Chip card of reduced size with backward compatibility and adapter for a reduced size chip card.

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56. Albaret Thierry,FRX, Chip card reader with fast transmission protocol.

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57. Gloton Jean-Pierre (Aix en Provence FRX) Coiton Grard (Venelles FRX), Chip card structure.

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58. Stampka, Peter; Puschner, Frank; Heinemann, Erik; Binder, Birgit, Chip module and chip card.

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59. Huber Michael,DEX ; Stampka Peter,DEX, Chip module for semiconductor chips having arbitrary footprints.

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60. Cady, James W.; Wilder, James; Roper, David L.; Wehrly, Jr., James Douglas; Dowden, Julian; Buchle, Jeff, Chip scale stacking system and method.

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61. Kleineidam Gerhard,DEX, Chipcard.

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62. Mundigl Josef (Nittendorf DEX) Kirschbauer Josef (Blaibach DEX), Chipcard module.

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63. Oppermann Hans-Hermann,DEX ; Zakel Elke,DEX ; Azdasht Ghassem,DEX ; Kasulke Paul,DEX, Chips arranged in plurality of planes and electrically connected to one another.

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64. Iwasaki,Shota; Inaba,Takehito, Circuit board.

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65. Kato, Noboru, Circuit board.

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66. Watanabe Masamichi (Miyagi JPX) Watanabe Yasushi (Miyagi JPX), Circuit board.

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67. Ishizawa, Taku; Kawate, Hiroyuki; Kodama, Hidetoshi, Circuit board for an ink cartridge.

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68. Bhakta,Jayesh R.; Yu,Enchao; Chen,Chi She; Flaig,Richard E., Circuit card with flexible connection for memory module with heat spreader.

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69. Subat, Bradford Kyle, Circuit cooling.

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70. Tiwari,Nachiketa; Subat,Bradford Kyle; Powers,Benjamin G., Circuit cooling.

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71. Szewerenko,Leland; Partridge,Julian; Orris,Ron, Circuit module having force resistant construction.

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72. August Melvin C. (Chippewa Falls WI) Williams John T. (Chippewa Falls WI), Circuit module with enhanced heat transfer and distribution.

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73. August Melvin C. (Chippewa Falls WI) Williams John T. (Chippewa Falls WI), Circuit module with enhanced heat transfer and distribution.

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74. Matsumura Hiroshi,JPX, Circuit substrate including printed circuit board having heat-shielding portion.

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75. Smayling, Michael C.; Becker, Scott T., Coarse grid design methods and structures.

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76. Kenneth S. Suslick ; Neal A. Rakow, Colorimetric artificial nose having an array of dyes and method for artificial olfaction.

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77. Lim, Sung H.; Musto, Christopher J.; Feng, Liang; Kemling, Jonathan W.; Suslick, Kenneth S., Colorimetric sensor arrays based on nanoporous pigments.

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78. Klatt Dieter,DEX ; Pelke Bernhard,DEX, Combination chip card reader.

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79. Furuta, Toru, Combination substrate.

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80. Babu, Surendra Chitti; Patel, Satish I.; Fransen, Robert E., Communication connector having plug interface contacts of varying thickness and/or multiple layers.

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81. Wallace Robert F. ; Harari Eliyahou, Compact mechanism for removable insertion of multiple integrated circuit cards into portable and other electronic device.

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82. Kurosawa Toshiharu,JPX, Compact optical waveguide.

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83. Neuhaus, Herbert J.; Wernle, Michael E.; Blum, Frederick A.; Kober, Michael, Component and antennae assembly in radio frequency identification devices.

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84. Johnson Steven G. ; Fan Shanhui ; Villeneuve Pierre R. ; Kolodziejski Leslie ; Joannopoulos John D., Composite photonic crystals.

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85. Poidomani, Mark; Ziegler, Joan; Foo, Eric; Alon, Ziv; McGuire, Charles; Routhenstein, Lawrence, Conducting a transaction with an electronic card.

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86. De Lustrac, André; Mahdjoubi, Kouroch; Tarot, Anne Claude; Boutayeb, Halim; Terret, Claude, Configurable and orientable antenna and corresponding base station.

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87. Matsuura, Naomi; Ruda, Harry E.; Yacobi, Ben G., Configurable photonic device.

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88. Iwasaki Hiroshi,JPX ; Yajima Toshio,JPX, Connecting apparatus, and information processing apparatus.

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89. Matsushita Tsuyoshi (Shizuoka JPX), Connecting structure for connecting a memory unit to a memory unit controller.

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90. Gloton Jean-Pierre (Aix En Provence FRX), Connecting terminal for chip cards.

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91. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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92. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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93. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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94. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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95. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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96. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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97. Gloton Jean-Pierre (Aix en Provence FRX), Connecting terminal for chip cards.

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98. Joel Turin FR, Connecting terminal for chip cards.

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99. Merlin Pierre,FRX ; Elbaz Didier,FRX ; Ayala Stephane,FRX, Connecting terminal for chip cards.

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100. Washino,Kiyoshi; Kihira,Satoru; Fukami,Tsuyoshi, Connector for SIM.

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101. Kaneshige Akira (Musashino JPX) Miyazawa Junichi (Yokohama JPX) Akiyama Shigeru (Machida JPX) Yamaguchi Masato (Yokohama JPX) Enokido Kazuhiro (Yokohama JPX), Connector for miniature circuit card.

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102. Pieterse Rob,NLX ; Hopman Remco Jack Bernhard,NLX, Connector formed as a sleeve pushed over a standard chip card.

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103. Saitou,Tomihisa; Yoshida,Harunobu; Wakisaka,Masahide; Kitaoka,Masaki, Contact image sensor and methods for aligning a light element array substrate thereof.

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104. Borza Stephen J.,CAX, Contact imaging device.

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105. Klatt, Dieter, Contacting unit.

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106. Klatt Dieter,DEX ; Backer Arnd,DEX, Contacting unit for card-shaped support elements for electronic components.

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107. Wilson, Carol J.; Sigalas, Mihail M.; Flory, Curt Alan, Continuously tunable photonic crystal drop filter.

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108. Doerr, Christopher; Swanson, Eric, Coupling of fiber optics to planar grating couplers.

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109. Wu, Kuo-Tai, Cover apparatus for dissipating heat and shielding electromagnetic interference.

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110. Lauder, Andrew; Rohrbach, Matthew D.; Coster, Daniel J.; Stringer, Christopher J.; Ow, Florence W.; Ai, Jiang; Ive, Jonathan P.; Kibiti, Elvis M.; Ternus, John P.; Lubner, Sean D., Cover for an electric device.

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111. Haffenden Ian David,GBX ; Smith David,GBX, Data card connector.

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112. Haghiri-Tehrani Yahya (Munich DEX), Data carrier having an integrated circuit and a method for producing the same.

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113. Haghiri-Tehrani Yahya (Winzerer Str. 98 8000 Mnchen 40 DEX) Hoppe Joachim (Breisacher Str. 1 8000 Mnchen 80 DEX), Data carrier having an integrated circuit and method for producing same.

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114. Haghiri-Tehrani Yahya (Munich DEX) Hoppe Joachim (Munich DEX), Data carrier with an IC module and a method for producing such a data carrier.

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115. Houdeau Detlef,DEX ; Kirschbauer Josef,DEX ; Filser Christoph,DEX, Data medium in card form and lead frame for use in such a data medium.

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116. Cedar, Yoram; Holtzman, Micky; Pinto, Yosi, Data storage device with host-accessible indicator.

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117. Bashan, Oded; Itay, Nehemya; Gilboa, Ronnie; Aduk, Moshe, Data transaction card and method of manufacture thereof.

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118. Wang Ynjiun P. (Fort Myers FL) Ju Paul P. (Fort Myers FL), Dataform readers having controlled and overlapped exposure integration periods.

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119. Oliveira ; Robert J., Detecting system.

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120. Cottingham Hugh V., Device and method for DNA amplification and assay.

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121. Romagnoli,Marco; Tormen,Maurizio; Bonati,Camilla, Device for crossing optical beams, in particular in an integrated optical circuit.

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122. Ozouf Ren (Le Bourget FRX) Seguin Jean-Michel (Asnieres s/Seine FRX), Device for housing a smart card.

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123. Cheng Yin-Shiang,TWX ; Sun Hsueh-Wen,TWX ; Pan Long-Jyh,TWX, Device for receiving a SIM card for portable telephone set.

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124. Christopher A. White, Device for tuning the propagation of electromagnetic energy.

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125. Lepp, James Randolph Winter; Los, Oleg, Device smart card.

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126. Lepp, James Randolph Winter; Los, Oleg, Device smart card.

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127. Huang, Lotien Richard; Barber, Thomas A.; Carvalho, Bruce L.; Kapur, Ravi; Vernucci, Paul; Toner, Mehmet; Wang, Zihua, Devices and method for enrichment and alteration of cells and other particles.

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128. Perreault, George, Devices using a metal layer with an array of vias to reduce degradation.

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129. Friedman Stephen B. (Claremont CA) Riley Mel J. (Covina CA), Diagnostic test card.

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130. Tuan Hung Pham, Diagnostic test card.

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131. Tuan Hung Pham, Diagnostic test card.

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132. Tuan Hung Pham, Diagnostic test card.

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133. Tuan Hung Pham, Diagnostic test card.

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134. Gerber Jan (23 ; Bartokhof ; NL-2402 GC Alphen ad/Rijn NLX), Diagnostic testing material.

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135. Caillouette,James C., Digital type color comparisons in vaginal moisture pH determination.

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136. Booth Richard B. (Williamson County TX) Gaynes Michael A. (Broome County NY) Murco Robert M. (Broome County NY) Puligandla Viswanadham (Travis County TX) Roldan Judith M. (Westchester County NY) Sara, Direct chip attachment (DCA) with electrically conductive adhesives.

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137. Hosomi, Kazuhiko; Katsuyama, Toshio; Lee, Young-kun; Ojima, Masahiro, Dispersion compensator and optical transmission system using same.

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138. Phelan, Kieran, Display screen with icon.

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139. Vantalon, Luc; Siccardo, Paolo, Distributed TV access system.

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140. Chall, Louis Edmund; Serson, John Bradley; Roberts, Philip Arnold; Hutchins, Cecil Eugene, Distributed computing.

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141. Houston, Theodore W.; Soper, Robert A.; Aton, Thomas J., Double pattern and etch of poly with hard mask.

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142. Siegel, Philip I., Dual chip smart card and method for using same.

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143. Puente Baliarda, Carles; Anguera Pros, Jaime; Borja Borau, Carmen, Dual-band dual-polarized antenna array.

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144. Becker,Scott T.; Smayling,Michael C., Dynamic array architecture.

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145. Mullen, Jeffrey David, Dynamic credit card with magnetic stripe and embedded encoder and methods for using the same to provide a copy-proof credit card.

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146. Vinciarelli, Patrizio; LaFleur, Michael B., Electric terminal.

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147. Vinciarelli, Patrizio; LaFleur, Michael B., Electric terminal.

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148. Barcley, Tina P., Electrical assemblage and method for removing heat locally generated therefrom.

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149. Sedio, Stephen; Chuang, Shun-Jung; Huang, Chia-Ching, Electrical card.

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150. Biernath Rolf W., Electrical connector assembly with interleaved multilayer structure and fabrication method.

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151. Wilcox, Russell J.; Whitesides, Thomas H.; Amundson, Karl Raymond; Danner, Guy M.; Webber, Richard M.; Honeyman, Charles Howie; Cao, Lan; Paolini, Jr., Richard J.; Chebiyam, Rajesh, Electro-optic displays with reduced remnant voltage.

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152. Moore Ricky Lamar (Smyrna GA) Kesler Morris Philip (Douglasville GA) Maloney James Geoffrey (Marietta GA) Shirley Brian Leon (Marietta GA), Electromagnetic antenna and transmission line utilizing photonic bandgap material.

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153. DePaula, Andrew; Aamodt, Larry; Vyhmeister, Ronald, Electronic assemblies and methods of forming electronic assemblies.

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154. Singh,Kuljeet; Wells,Kevin E.; Delino,Julius, Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts.

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155. Bender, Jason F., Electronic card.

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156. Poidomani, Mark; Ziegler, Joan; Foo, Eric; Alon, Ziv; McGuire, Charles; Routhenstein, Lawrence, Electronic cards and methods for making same.

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157. Gloton Jean-Pierre (Aix en Provence FRX) Peres Philippe (Gardanne FRX), Electronic component support for memory card and product obtained thereby.

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158. Schuster David C. ; Stinauer ; II Robert J. ; Laursen Tobin C., Electronic device with dual card reader employing a drawer.

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159. Kondo, Manabu, Electronic device, electronic apparatus, moving object, and method for manufacturing electronic device.

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160. Robert F. Wallace ; Robert C. Miller, Electronic memory card.

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161. Hara Kazuya (Tokyo JPX) Rikuna Kenji (Tokyo JPX), Electronic memory card and method of manufacturing same.

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162. Fushimoto Hideo (Kawasaki JPX), Electronic memory device.

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163. Champagne Daniel (Septeuil FRX) Le Loc\h Alain (Versailles FRX), Electronic microcircuit card and method for its manufacture.

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164. Amit, Gadi; Clifton, Daniel J.; Eremenko, Paul; Etgar, Inbal; McKinney, Susan Elizabeth, Electronic module.

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165. DePaula, Andrew; Aamodt, Larry; Vyhmeister, Ronald, Electronic storage devices, programming methods, and device manufacturing methods.

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166. Mabboux Henri (Saint Martin le Vinoux FRX) Mermet-Guyennet Michel (Saint Egreve FRX), Encased electronic circuit with chip on a grid zone of conductive contacts.

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167. Kurz Arthur A. (Wildlife Run New Vernon NJ 07976), Enclosure for personal computer card GPT.

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168. Montanaro, Achille; Mori, Luigi; Pilati, Luciano; Turolla, Maura, Encoded audio-video streams remultiplexing equipment.

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169. Anthony, Anthony A.; Anthony, William M., Energy conditioning circuit arrangement for integrated circuit.

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170. Kornachuk, Stephen; Mali, Jim; Lambert, Carole; Becker, Scott T., Enforcement of semiconductor structure regularity for localized transistors and interconnect.

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171. Tuli Raja Singh,CAX ITX L5B1M3, Enhancement methods and devices for reading a fingerprint image.

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172. Iwasaki Hiroshi,JPX, External storage device.

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173. Conn, Robert O., Fiber optic field programmable gate array integrated circuit packaging.

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174. Taillaert,Dirk; Baets,Roel, Fiber-to-waveguide coupler.

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175. Setlak,Dale R.; Salatino,Matthew M.; Spletter,Philip J.; Rao,Yang, Finger sensing with enhanced mounting and associated methods.

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176. Sparrow Malcolm K. (127 Linton Road Loose ; Maidstone ; Kent GB2 ME15 OAL), Fingerprint recognition and retrieval system.

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177. Day,Christina Mei Chien; Galat,Peter; Miller,Robert C., Flash memory card with translucent cover.

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178. Ugon Michel (Plaisir FRX), Flat package for integrated circuit devices.

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179. Mikado, Yukinobu; Sagisaka, Katsumi; Kawaguchi, Katsuo; Muraki, Tetsuya, Flex-rigid wiring board and manufacturing method thereof.

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180. Champagne Daniel (Septeuil FRX) Le Loc\h Alain (Versailles FRX) Lefort Olivier (Vernon FRX), Flexible printed circuit.

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181. Haba, Belgacem; Crisp, Richard Dewitt; Zohni, Wael, Flip-chip, face-up and face-down centerbond memory wirebond assemblies.

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182. Benisty,Henri; Schwoob,Emilie, Frequency-selective light coupler-decoupler device.

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183. Esch Victor H. (10717 Stanmore Dr. Potomac MD 20854) Fristrom Robert M. (10610 Mantz Rd. Silver Spring MD 20403), Hazardous atmosphere badge.

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184. Barker, Delmar L.; Owens, William R., Heat transfer devices based on thermodynamic cycling of a photonic crystal with coupled resonant defect cavities.

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185. Hill, Randy W.; Young, Abram G.; Bergfield, Justin P., High bandwidth communication system and method.

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186. Villeneuve Pierre R. ; Fan Shanhui ; Joannopoulos John D. ; Haus Hermann A., High efficiency channel drop filter.

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187. Fan Shanhui ; Villeneuve Pierre R. ; Joannopoulos John D. ; Little Brent E. ; Haus Hermann A., High efficiency channel drop filter with absorption induced on/off switching and modulation.

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188. Wiedemer John D. (Houston TX), High security pay television system.

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189. Chaney, John William; Deiss, Michael S.; Beyers, Billy W., High speed signal processing smart card.

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190. Brown Elliott R. (Billerica MA), Highly efficient planar antenna on a periodic dielectric structure.

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191. Leighton Keith, Hot lamination process for the manufacture of a combination contact/contactless smart card and product resulting therefrom.

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192. Kayner Andrew H., Hot-pluggable/interchangeable circuit module and universal guide system having a standard form factor.

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193. Hitoshi Ebihara JP; Naoki Tomaru JP; Yoshiyuki Wasada JP; Tetsuya Ito JP; Hideki Kato JP; Tomohiro Igarashi JP; Hideki Yoda JP, Hybird integrated circuit board.

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194. Martin Philippe,FRX, Hybrid device with flush-mounted contacts for generating acoustic signals, and method for making same.

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195. Chen, Ie Sen; Chen, Chih Nung; Huang, Wei Chia, IC card.

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196. Hara Kazuya (Tokyo JPX) Rikuna Kenji (Tokyo JPX) Nakano Harumi (Tokyo JPX), IC card.

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197. Iwasaki Hiroshi,JPX, IC card.

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198. Kobayashi Makoto (Sanda JPX) Kodai Syojiro (Itami JPX) Ochi Katsunori (Itami JPX), IC card.

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199. Maruyama, Terutaka; Nakagawa, Mitsuru, IC card.

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200. Nishizawa, Hirotaka; Ishihara, Haruji; Shiraishi, Atsushi; Kanemoto, Kouichi; Yukawa, Yousuke, IC card.

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201. Shino Katsuhide (Nara JPX), IC card.

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202. Uenishi Mitsuaki (Takatsuki JPX) Takase Yoshihisa (Higashiosaka JPX) Fujii Takashi (Katano JPX), IC card and a method for the manufacture of the same.

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203. Saito Tamio (Tokyo JPX) Ohuchi Masayuki (Tokyo JPX) Oodaira Hirosi (Chigasaki JPX) Fukumoto Yoshikatsu (Tokyo JPX) Hiranuma Shuji (Kawasaki JPX) Kishida Ko (Nara JPX) Kisaka Takanori (Yao JPX), IC card and method for manufacturing the same.

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204. Iguchi Shinichi,JPX ; Hirata Yoshihito,JPX, IC card for portable type electronic apparatus and card insertion method.

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205. Atsumi Shiro (Tokyo JPX), IC card having a built-in semiconductor integrated circuit device.

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206. Haghiri-Tehrani Yahya (Munich DEX), IC card having severable mini chip card.

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207. Imura Shigeru (Tokyo JPX), IC card reader.

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208. Sugimoto Yasuki,JPX, IC card reader.

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209. Takemura Hisao,JPX, IC card reader/writer.

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210. Rovin George H. (Ojai Valley School ; 723 El Paseo Rd. Ojai CA 93023), IC card system with removable IC modules.

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211. Sekiguchi Kouji (Kawasaki JPX), IC card with additional terminals and method of controlling the IC card.

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212. Bates ; III Charles Linsday, IC card with fingerprint sensor.

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213. Nakamura,Yutaka, IC memory card.

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214. Nakamura,Yutaka, IC memory card.

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215. Ishihara Tomiaki (Yokohama JPX), IC module.

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216. Ishihara Tomiaki (Yokohama JPX), IC module.

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217. Ishihara Tomiaki (Yokohoma JPX), IC module.

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218. Ishihara Tomiaki,JPX, IC module.

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219. Shinada Satoshi,JPX, IC module.

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220. Okita,Yoshitaka; Nishikawa,Masataka, IC module and IC card.

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221. Susumu Emori JP; Hidemi Nakajima JP; Susumu Igarashi JP; Kazuo Kobayashi JP, IC module and smart card.

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222. Hoppe Joachim (Munich DEX) Haghiri-Tehrani Yahya (Munich DEX), Identification card having an IC module.

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223. Hoppe Joachim (Munich DEX) Haghiri-Tehrani Yahya (Munich DEX), Identification card with IC chip and a method for manufacturing the same.

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224. Hofmann-Cerfontaine Hellmut W. (Nuremberg DEX), Identification device.

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225. Liu, Rong; Vinogradov, Igor, Illumination apparatus for an imaging-based bar code system.

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226. Iwafuchi, Toshiaki; Oohata, Toyoharu; Doi, Masato, Image display unit and method of producing image display unit.

     상세보기
227. Fujimoto Hisayoshi,JPX ; Onishi Hiroaki,JPX ; Takakura Toshihiko,JPX ; Imamura Norihiro,JPX, Image reading apparatus and image sensor chip thererfor.

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228. Kiyohara Satoru,JPX ; Muraji Kunio,JPX, Image scanning apparatus, method of scanning images, and recording medium for realizing the method.

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229. Fujimoto Hisayoshi,JPX ; Onishi Hiroaki,JPX ; Takakura Toshihiko,JPX ; Imamura Norihiro,JPX, Image sensor and image reading apparatus.

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230. Brunker David L. ; Harwath Frank A. ; Scheer Dennis K., Impedance and inductance control in electrical connectors and including reduced crosstalk.

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231. Roberson, Mark W., Impedance control devices for use in the transition regions of electromagnetic and optical circuitry and methods for using the same.

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232. Koops Hans W. P.,DEX ; Meltz Gerald, In-fiber photonic crystals and systems.

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233. Schumacher,Richard A., Inductor or transformer having a ferromagnetic core that is formed on a printed circuit board.

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234. Wood,Frederick F.; Yavid,Dmitriy, Inertial drive scanning arrangement and method.

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235. Kohama Kyoichi,JPX ; Takasugi Wasao,JPX ; Daido Kazuhiko,JPX, Information carrier and process for producing same.

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236. Sawada, Takeshi, Information storage medium with a rotatably mounted camera.

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237. Tang, Xiaoxian, Ink cartridge chip.

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238. Richard A. Murray, Ink jet cartridge with two jet plates.

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239. James Harold Powers ; Carl Edmond Sullivan, Ink jet printheads and methods therefor.

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240. Shin,Seung joo; Oh,Yong soo; Shin,Su ho; Kim,Min soo; Lim,Hyung taek; Lee,Chang seung; Lee,You seop; Kuk,Keon, Ink-jet printhead.

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241. Kobayashi Takao,JPX ; Kanaya Munehide,JPX ; Usui Minoru,JPX ; Hiraide Shoichi,JPX ; Koshino Kazuo,JPX, Ink-jet recording apparatus for ink cartridge.

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242. Barrett Paul (Worcester Park GBX) Eisele Raymund (Idstein DEX), Insertable element for a disk station of EDP equipment with connections to external components.

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243. Jigour Robin J. ; Wong David K., Insertable/removable digital memory apparatus and methods of operation thereof.

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244. Takahashi Hideki (Fukuoka JPX), Insulated gate semiconductor device with a buried gapped semiconductor region.

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245. Seki Junji (Ebina JPX), Integrated circuit card.

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246. Fidalgo, JeanChristophe; Dossetto, Lucile, Integrated circuit card comprising an interface terminal strip and method for making same.

     상세보기
247. Everett David Barrington,GBX ; Miller Stuart James,GBX ; Peacham Anthony David,GBX ; Simmons Ian Stephen,GBX ; Richards Timothy Philip,GBX ; Viner John Charles,GBX, Integrated circuit card with application history list.

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248. Hamada Yoshitaka (Kawasaki JPX), Integrated circuit card with increased number of connecting terminals.

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249. Sutoh Shigeru (Urawa JPX), Integrated circuit card with magnetic reader strip and keyboard and display.

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250. Suto Shigeru (Urawa JPX), Integrated circuit card with magnetic reading strip and keyboard and display.

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251. Luu, Lu Vinh, Integrated circuit card with multiple integral electronic modules.

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252. Harari Eliyahou, Integrated circuit chips made bendable by forming indentations in their back surfaces flexible packages thereof and meth.

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253. Kikuchi Tatsuro (booth of Hirakata JPX) Uenishi Yoshitsugu (booth of Hirakata JPX), Integrated circuit device and manufacturing method thereof.

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254. Tan, Chip King, Integrated circuit package.

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255. Khan, Rezaur Rahman; Wang, Ken Jian Ming, Integrated circuit package with etched leadframe for package-on-package interconnects.

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256. Eide, Andrew; Greene, Jr., Thomas Edwin, Integrated energy management system.

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257. Koops Hans Wilfried,DEX ; Dultz Wolfgang,DEX, Integrated optical circuit.

     상세보기
258. Dridi,Kim Hakim; Mattsson,Kent Erik, Integrated photonic crystal structure and method of producing same.

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259. Harris, Scott C., Intelligent credit card system.

     상세보기
260. Harris,Scott C., Intelligent credit card system.

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261. Lessin Arlen R. (New York NY) Gruppuso Frank M. (Commack NY) Harrison Shelley A. (Dix Hills NY), Intelligent portable interactive personal data system.

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262. Mullen, Jeffrey D.; Nicklaus, Eric R., Interactive electronic card with display and buttons.

     상세보기
263. Khandros Igor Y. ; Pedersen David V. ; Eldridge Benjamin N. ; Roy Richard S. ; Mathieu Gaetan, Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device.

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264. Puente Baliarda, Carles, Interlaced multiband antenna arrays.

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265. Achsaf, Nitzan; Raines, Moshe; Zeigler, Alon; Pomerantz, Itzhakl, Internal UFD.

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266. Dick, Stefan O.; Robertson, Andrew J.; Martin, Michelle B., Irreversible humidity indicator cards.

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267. Kwon Young S. (Inchon-jikal KRX) Ahn Seung H. (Suwon KRX), J-leaded semiconductor package having a plurality of stacked ball grid array packages.

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268. Duffield,David Jay; Schulz,Mark Alan; Deiss,Michael Scott, Key transport tamper protection.

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269. Shiba ; Hiroshi ; Kani ; Kenji, Large-scale semiconductor integrated circuit device.

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270. Hayase Shinichi,JPX ; Ohtomo Fumio,JPX, Laser remote command system and targets therefor.

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271. Ong,Adrian E., Layout and use of bond pads and probe pads for testing of integrated circuits devices.

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272. Fukshima, Hiroshi; Tanaka, Ken'ichiro; Masaki, Yasufumi; Takano, Hitomichi; Yoshino, Katsumi, Light-beam deflecting device with photonic crystal, optical switch using the same, and light-beam deflecting method.

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273. Saito, Shunichi; Sugano, Toshio; Hiraishi, Atsushi; Osanai, Fumiyuki; Nakamura, Masayuki; Fujisawa, Hiroki, Load reduced memory module and memory system including the same.

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274. Al-hemyari, Kadhair; Youtsey, Christopher T., Localized thermal tuning of ring resonators.

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275. Jacobsen Jeffrey ; Fan John C. C. ; Pombo Stephen A. ; Zavracky Matthew ; Bumgardner Rodney ; Richard Alan ; Chern Wen-Foo, Low power active display system.

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276. Upadhyayula, Suresh; Miller, Robert C.; Takiar, Hem; Sprouse, Steven; Yung, Ka Ian, Low profile wire bonded USB device.

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277. Brommer Karl (Box 53 Hampton Falls NH 03844) Mullaney Henry (271 Chestnut Hill Rd. Amherst NH 03031) Meade Robert (54 Berkeley St. Somerville MA 02143) Rappe Andrew (5133 Briarwood Dr. Macungie PA 18, Low-loss dielectric resonator having a lattice structure with a resonant defect.

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278. Doi Keiichiro (Osaka JPX), Magnetic card for microwave oven.

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279. Landau, Steven; Taylor, Teresa, Mailing apparatus for powered cards.

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280. Heinemann,Erik; Pueschner,Frank, Making contact with semiconductor chips in chip cards.

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281. Ayala, Stéphane; Carre, Lionel; Curty, Jari-Pascal, Manufacturing method for a dual interface card.

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282. Cappelletti,Paolo Giuseppe; Maurelli,Alfonso; Zabberoni,Paola, Manufacturing method for non-active electrically structures in order to optimize the definition of active electrically structures in an electronic circuit integrated on a semiconductor substrate and .

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283. Katoh, Ikuo; Kondoh, Hitoshi; Hayakawa, Kunio; Morita, Mitsunobu; Tsutsui, Kyohji; Okada, Takashi, Marking ink composition and display medium using the same.

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284. Kudelski, André; Sasselli, Marco, Mechanism of matching between a receiver and a security module.

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285. Florek, Miroslav; Mihályová, Tatiana, Memory card.

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286. Wallace, Robert F.; Miller, Robert C., Memory card.

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287. Yu, Gordon; Wen, Forli; Chang, Tony, Memory card.

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288. Ye, Ning; Miller, Robert C.; Yu, Cheemen; Takiar, Hem; McKenzie, Andre, Memory card fabricated using SiP/SMT hybrid technology.

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289. Le Roux Jean-Yves (Bouc Bel Air FRX), Memory card having a recessed portion with contacts connected to an access card.

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290. Le Roux Jean-Yves (Domaine de la Cyprire FRX), Memory card having a recessed portion with contacts connected to an access card.

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291. Takeda Masahiro (Ohmiya JPX), Memory card having static electricity protection.

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292. Hook, Charles Moana; Tu, Loc; Thein, Nyi Nyi; Cardosa, James Floyd; Myers, Ian Arthur, Memory card test interface.

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293. Chen, Tien-Tzu, Memory card with a static electricity conducting board.

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294. Takiar,Hem P.; Miller,Robert, Memory card with and without enclosure.

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295. Skorski Serge,FRX, Memory card with capacity-independent 3-line addressing system.

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296. Wada,Tamaki; Nishizawa,Hirotaka; Masuda,Masachika; Osawa,Kenji; Osako,Junichiro; Hatakeyama,Satoshi; Ishihara,Haruji; Yoshizaki,Kazuo; Furusawa,Kazunori, Memory card with connecting portions for connection to an adapter.

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297. Kang, JinTae; Kim, Kisun; Lee, Dongyang; Kong, Doil; Lee, Sunghoon, Memory cards and electronic machines.

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298. Harari,Eliyahou; Cedar,Yoram; Brewer,Wesley G.; Pinto,Yosi; Elhamias,Reuven; Holtzman,Micky, Memory cards including a standard security function.

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299. Djordjevic, Srdjan, Memory module having buffer and memory ranks addressable by respective selection signal.

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300. Poechmueller,Peter, Memory module having memory chips protected from excessive heat.

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301. Steinberger, Daniela, Memory or chip card.

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302. Paurus Floyd G. (Boulder CO) Szerlip Stanley R. (Longmont CO), Memory stack with an integrated interconnect and mounting structure.

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303. Odom, Teri W.; Henzie, Joel A.; Kwak, Eun-Soo; Lee, Min Hyung, Mesoscale pyramids, hole arrays and methods of preparation.

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304. Young Nigel D.,GB2, Method and apparatus for a touch sensing device having a thin film insulation layer about the periphery of each sensing.

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305. Candelore, Brant L., Method and apparatus for descrambling content.

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306. Wang, Ynjiun P.; Deng, Shulan, Method and apparatus for operating indicia reading terminal including parameter determination.

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307. Behringer, Fredrich; Aubrecht, Sarka; Selinfreund, Richard H.; Vig, Rakesh, Method and apparatus for portable product authentication.

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308. Albarella, James P.; Noell, J. Oakey; Pugia, Michael J., Method and apparatus for producing visual results using colorimetric strips.

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309. Worrell,Charles William; Vayl,Yefim, Method and apparatus for supporting two different types of integrated circuit cards with a single connector.

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310. Klocek, Paul; Florence, James M., Method and apparatus for switching optical signals with a photon band gap device.

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311. Aref Chowdhury ; Leon McCaughan, Method and apparatus for wavelength conversion and switching.

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312. Jackowski George,CAX, Method and device for diagnosing and distinguishing chest pain in early onset thereof.

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313. Hennige Hartmut (23 Packman Lane ; Home Green Kirk Ella Hull HU10 7TH N. Humberside GB3), Method and device for simplifying the use of a plurality of credit cards, or the like.

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314. Dubroeucq, Gilles; Vigarie, Jean-Pierre, Method and system for conditional access applied to protection of content.

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315. Pomerantz, Itzhak; Yairi, Rahav; Ponte, Gad, Method and system for printing graphical content onto a plurality of memory devices and for providing a visually distinguishable memory device.

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316. Hildebrand, John G; Gonzalez, Francisco; Fahrny, James; Seiden, Joshua, Method and system of providing signals.

     상세보기
317. Dehaine Grard (Chatillon FRX) Peytavy Alain (Versailles FRX), Method for assembling an integrated circuit with raised contacts on a substrate, device thereby produced and an electron.

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318. Wong,Jacob Y., Method for authenticating an individual by use of fingerprint data.

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319. Foo, Eric; Weng, Wong Chee; Chang, Liu, Method for broadcasting a magnetic stripe data packet from an electronic smart card.

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320. Foo, Eric; Ziegler, Joan; Poidomani, Mark; Routhenstein, Lawrence; Alon, Ziv; McGuire, Charles, Method for broadcasting a magnetic stripe data packet from an electronic smart card.

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321. Sugita,Mitsuro; Yonehara,Takao, Method for fabrication of optical element, and optical element having three-dimensional laminated structure.

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322. Yui, Chen-Hua; Shih, Tsu, Method for forming patterned features at a semiconductor wafer periphery to prevent metal peeling.

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323. Lee, Jeon Kyu, Method for forming patterns of semiconductor device by using mixed assist feature system.

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324. Romagnoli,Marco; Tormen,Maurizio; Bonati,Camilla, Method for guiding an electromagnetic radiation, in particular in an integrated optical device.

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325. LeMaire Gerard (26 ; Bd. Jean Jaures Nancy FRX) LeMaire Philippe (Av. Armee Patton Nancy FRX 54000), Method for making a credit card containing a microprocessor chip.

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326. Reed,Paul, Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces.

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327. Tada Noburu (Yamatokoriyama JPX), Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by mat.

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328. Haghiri-Tehrani Yahya (Mnchen DEX) Barak Rene-Lucia (Unterhaching DEX), Method for manufacturing an encapsulated semiconductor package using an adhesive barrier frame.

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329. Bouchez, Francoise; Launay, Francois; Loubly, Pierre; Venambre, Jacques, Method for mounting a microcircuit in a cavity of a card forming a support and resulting card.

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330. Cunningham,Brian T.; Qiu,Jean, Method for producing a colorimetric resonant reflection biosensor on rigid surfaces.

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331. Hohmann Arno,DEX ; Hoppe Joachim,DEX ; Haghiri-Tehrani Yahya,DEX, Method for producing data carriers.

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332. Hoppe Joachim (Munich DEX) Hohmann Arno (Munich DEX), Method for producing identity cards.

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333. Ahmet Mursit Eskicioglu, Method for protecting the audio/visual data across the NRSS interface.

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334. Ho,Chun Hsin, Method for providing additional service based on dual UICC.

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335. Tallaksen Kent A. (Fountain CO), Method of assembling a module for a smart card.

     상세보기
336. Nelson Bradley H. (Austin TX), Method of assembling stacks of integrated circuit dies.

     상세보기
337. Sakata Toshio (Kawasaki JPX) Yuda Takashi (Kawasaki JPX) Kasahara Shinichi (Kawasaki JPX) Sukeda Toshiaki (Kawasaki JPX) Watanabe Hiromichi (Kawasaki JPX) Maruyama Yoshiaki (Kawasaki JPX) Nittoh Eiji, Method of connecting a pressure-connector terminal of a device with a terminal electrode of a substrate.

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338. Wu, Tsung-Yeh; Lin, Chin-Lung; Fan, Yao-Jen; Chien, Wei-Han; Tsai, Chia-Chun, Method of correcting assist feature.

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339. Francois Bouchez FR; Jerome Bouvard FR; Francois Launay FR; Pierre Loubly FR, Method of fabricating a microcircuit card.

     상세보기
340. Chen, Fucheng, Method of inserting dummy patterns.

     상세보기
341. Spletter Philip J. (Cedar Park TX) Mackay Colin A. (Austin TX) Galanakis Claire T. (Austin TX) Parker John C. (Round Rock TX), Method of laser bonding for gold, gold coated and gold alloy coated electrical members.

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342. Inoue, Michio; Takada, Yorio, Method of layout of pattern.

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343. Tonucci Ronald J. (Temple Hills MD) Justus Brian L. (Springfield VA), Method of making a semiconductor device by forming a nanochannel mask.

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344. Sugimoto, Keiichi; Nakagawa, Mitsuru, Method of making an electronic circuit device.

     상세보기
345. Adelman Jeffrey T. (Columbus NE) Veik Thomas L. (Columbus NE) Zwick Scott D. (Columbus NE), Method of making an electronic thick film component multiple terminal.

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346. Juan Alain (Chzard CHX) Vuilleumier Jean-Claude (Cressier CHX), Method of manufacture of electronic modules for cards with microcircuits.

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347. Takahashi, Yoshimi; Amagai, Masazumi, Method of manufacturing a semiconductor device.

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348. Kochergin,Vladimir; Swinehart,Philip, Method of manufacturing a spectral filter for green and longer wavelengths.

     상세보기
349. Takiar,Hem; Bhagath,Shrikar; Chiu,Chin Tien, Method of manufacturing flash memory cards.

     상세보기
350. Elarde Vito D. (San Diego CA), Method of manufacturing injection molded printed circuit boards in a common planar array.

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351. Watanabe, Keiji, Method of manufacturing liquid ejection head substrate.

     상세보기
352. Fumio Miyajima JP, Method of manufacturing semiconductor devices and resin molding machine.

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353. Stampfli Jean-Marcel (Le Landeron CHX), Method of producing a tape for providing electronic modules, and tape obtained by this method.

     상세보기
354. Trueggelmann Uwe,DEX, Method of producing data carriers.

     상세보기
355. Nishioka Tadashi (Hyogo JPX) Yasue Takao (Hyogo JPX), Method of using scanning probe microscope allowing cleaning of probe tip in ambient atmosphere.

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356. Nelson Keith A. ; Joannopoulos John, Methods and systems for introducing electromagnetic radiation into photonic crystals.

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357. Hutchinson, Donald P.; Richards, Roger K., Micro-laser.

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358. Vilhelmsson Kennet J. A. (Oceanside CA) Lock Tomas E. (Carlsbad CA), Micro-optical building block system and method of making same.

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359. Amiot, Lucien; Mosteller, Barry, Microcircuit card attached to an adapter base, card base and manufacturing method.

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360. Le Garrec, Loïc; Duval, Agnès; Launay, François, Microcircuit device including means for amplifying the gain of an antenna.

     상세보기
361. Haba, Belgacem; Beroz, Masud; Kang, Teck-Gyu; Kubota, Yoichi; Krishnan, Sridhar; Riley, III, John B.; Mohammed, Ilyas, Microelectonic packages and methods therefor.

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362. Olsson, Roy H.; El-Kady, Ihab F.; McCormick, Frederick; Fleming, James G.; Fleming, legal representative, Carol, Microfabricated bulk wave acoustic bandgap device.

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363. Handique, Kalyan, Microfluidic cartridge and method of making same.

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364. Spaid, Michael; Chow, Andrea W.; Wang, Benjamin N.; Chien, Ring-Ling; Parce, J. Wallace; Kopf-Sill, Anne R., Microfluidic viscometer.

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365. Cunanan Chris, Microplate scanning read head.

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366. Valencia Donald W. (El Dorado Hills CA), Microscope slide with confirming wells.

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367. Frank V. Bright ; Brett R. Wenner ; Meagan A. Doody ; Gary A. Baker, Microsensor arrays and method of using same for detecting analytes.

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368. De Los Santos Hector J., Microwave active notch filter and operating method with photonic bandgap crystal feedback loop.

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369. Rowe David A. (Redondo Beach CA) Lao Binneg Y. (Rancho Palos Verdes CA) Dietterle Robert E. (Fullerton CA), Microwave multiport multilayered integrated circuit chip carrier.

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370. Onishi, Masayoshi; Wakizaka, Yasuaki; Matsuda, Yoshitaka; Ozaki, Koichi, Mini card adapter.

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371. Reignoux, Yves; Nerot, Dorothée; Roussel, François, Mini-plug SIM card with improved positioning capability.

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372. Narendra, Siva G.; Chakraborty, Saurav; Tadepalli, Prabhakar, Mobile payment device with small inductive device powered by a host device.

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373. Watanabe, Yousuke, Mobile terminal device and method for radiating heat therefrom.

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374. January Kister ; Jean-Michel Jurin FR; Isabelle George FR, Modulated space transformer for high density buckling beam probe and method for making the same.

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375. Park, Sung-Joo; So, Byung-Se; Lee, Jung-Joon, Module having test architecture for facilitating the testing of ball grid array packages, and test method using the same.

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376. Ikeda,Hidetaka, Module with built-in integrated circuits for use with IC cards.

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377. Murphy James V. (Warwick RI) Murphy Michael J. (East Greenwich RI), Molded-in lead frames.

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378. Leland Lester ; David Iglehart ; Larry W. Coons ; Michael Duncan, Mousepad telephone.

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379. Ramachandran,Natarajan, Multi-account card with magnetic stripe data and electronic ink display being changeable to correspond to a selected account.

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380. Le Roux Jean-Yves (La Ciotat FRX), Multi-applications portable card for personal computer.

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381. Toney, James E., Multi-barrier photonic heterostructures.

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382. Akram Salman ; Hembree David R. ; Wark James M., Multi-chip module system and method of fabrication.

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383. Bardsley Thomas J. ; Eastman Jed R., Multi-chip module with accessible test pads.

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384. Gertiser, Kevin M.; Ripple, Richard A.; Lowry, Michael J.; Schten, Karl A.; Shearer, Ronald M.; Spall, Jim M., Multi-layer electrically isolated thermal conduction structure for a circuit board assembly.

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385. Hara Kazuya (Tokyo JPX) Rikuna Kenji (Tokyo JPX), Multi-layered electronic card carrying integrated circuit pellet and having two-pad layered structure for electrical con.

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386. Candelore,Brant L., Multi-process descrambler.

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387. Uo Junko (Kyoto JPX) Nishimura Masaji (Kyoto JPX) Horiguchi Kazuo (Kyoto JPX) Nakanishi Setsuko (Kyoto JPX) Kaku Shigeru (Kyoto JPX), Multi-spot enzyme immunoassay method.

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388. Fukiharu Eiichi,JPX, Multichip module.

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389. Crepeau Philip C. (San Diego CA), Multilayer printed circuit board.

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390. Hara Kazuya (Tokyo JPX), Multiple application electronic card-like apparatus.

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391. Hartwick, David Joseph; Batra, Gautam, Multiple layer card circuit boards.

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392. Kennedy Colin B., Multiplexed microfluidic devices and systems.

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393. Tonucci Ronald J. (Temple Hills MD) Justus Brian L. (Springfield VA), Nanochannel glass matrix used in making mesoscopic structures.

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394. De Los Santos Hector J., Noise-reduction systems and methods using photonic bandgap crystals.

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395. Chandler Howard M.,CAX, Opposable-element assay devices, kits, and methods employing them.

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396. Terada Yosuke,JPX ; Hachiki Shigeo,JPX ; Saito Hachiro,JPX ; Nishikawa Seiichi,JPX ; Azuma Yoshihiro,JPX, Optical card with a built-in IC module technical field.

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397. Sakai,Atsushi; Katoh,Ikuo; Baba,Toshihiko, Optical control device.

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398. Doerr, Christopher R., Optical coupler.

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399. Parker, Gregory J.; Charlton, Martin D. B.; Zoorob, Majd, Optical delay device.

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400. Parker, Gregory J.; Charlton, Martin; Zoorob, Majd, Optical delay device.

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401. Zoorob, Majd, Optical device.

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402. Covey, John Luther, Optical device and circuit using phase modulation and related methods.

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403. Suzuki,Akiko, Optical element assembly and method of making the same.

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404. Koops Hans,DEX, Optical multi-channel separating filter with electrically adjustable photon crystals.

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405. Ronald J. Tonucci ; Armand Rosenberg ; Horn B. Lin ; Anthony J. Campillo, Optical notch filters based on two-dimensional photonic band-gap materials.

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406. Charlton, Martin David Brian; Parker, Gregory Jason, Optical photonic band gap devices and methods of fabrication thereof.

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407. Walt David R. (Lexington MA) Kauer John S. (Weston MA), Optical sensor, optical sensing apparatus, and methods for detecting an analyte of interest using spectral recognition p.

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408. Johnson Steven G. ; Fan Shanhui ; Villeneuve Pierre R. ; Manolatou Christina,GRX ; Haus Hermann A. ; Joannopoulos John D., Optical waveguide crossings.

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409. Wang, Min; Ferolito, Philip Arnold; Rajan, Suresh Natarajan; Smith, Michael John Sebastian, Optimal channel design for memory devices for providing a high-speed memory interface.

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410. Kornachuk, Stephen; Lambert, Carole; Mali, James; Reed, Brian; Becker, Scott T., Optimizing layout of irregular structures in regular layout context.

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411. Meade Robert (Somerville MA) Joannopoulos John (Belmont MA) Alerhand Oscar L. (Marlboro NJ), Optoelectronic integrated circuits and method of fabricating and reducing losses using same.

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412. Iwasaki, Tatsuya; Den, Tohru, Optoelectronic substrate.

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413. Dieter Klatt DE; Arnd Backer DE, PC-card chip-card reader.

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414. Karl Erik Stahl SE, PCMCIA smart card reader.

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415. Nakamura, Akihiro; Akaike, Kazuo; Ono, Kozo; Ishii, Takaaki, PLL-controlled oscillator.

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416. Petsch, Carsten, Pad arrangement of a circuit module.

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417. Pastore John R. (Leander TX) Nomi Victor K. (Round Rock TX) Wilson Howard P. (Austin TX), Pad array semiconductor device with thermal conductor and process for making the same.

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418. Murphy James V. (Warwick RI), Panel board for integrated circuit packages.

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419. Cunningham, Brian T.; Dobbs, Dennis W., Passive and active photonic crystal structures and devices.

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420. Thompson Kenneth, Peel off coupon redemption card with microprocessor chip and tracking system.

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421. Mo, Yi-Lung; Yan, Yiqun, Periodic material-based seismic isolation system.

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422. Chan, Vanessa Z. H.; Thomas, Edwin L.; Lee, Victor Y.; Miller, Robert D.; Avgeropoulos, Apostolos; Hadjichristidis, Nikos, Periodic porous and relief nanostructured articles.

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423. Takiar, Hem, Peripheral card with sloped edges.

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424. Weiss Kenneth P. (Newton MA) Howard Sheldon (Canoga Park CA), Personal security system.

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425. Yoshioka, Yoshimasa; Misaka, Akio; Irie, Shigeo; Sakaue, Hiroshi; Sasago, Masaru, Photo mask and method for forming pattern using the same.

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426. De Los Santos Hector J., Photonic bandgap crystal frequency multiplexers and a pulse blanking filter for use therewith.

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427. Spillane,Sean M.; Beausoleil,Raymond G.; Li,Zhiyong; Stewart,Duncan, Photonic crystal Raman sensors and methods including the same.

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428. Tomaru, Tatsuya, Photonic crystal and photonic-crystal waveguide.

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429. Katoh,Yoshimichi; Okumura,Toshiyuki, Photonic crystal and producing method thereof.

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430. Liu, Xinbing; Li, Ming, Photonic crystal formed by laser machining and having holes with sub-wavelength pitch.

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431. Wang,Shih Yuan; Islam,M. Saif; Bratkovski,Alex; Beausoleil,Ray, Photonic crystal laser sensors and methods.

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432. Axel Scherer ; Jelena Vuckovic ; Marko Longcar ; Hideo Mabuchi, Photonic crystal microcavities for strong coupling between an atom and the cavity field and method of fabricating the same.

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433. Pervez, Nadia; Kymissis, Ioannis; Jia, Zhang; Cox, Marshall, Photonic crystal spectrometer.

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434. Roberts Kim Byron,CAX, Photonic crystal waveguide arrays.

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435. Kim,Ji deog; Lee,Suk han, Photonic crystal-based resonant cavity and resonator.

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436. Miller, Robert O.; Tsu, David, Photonic crystals and devices having tunability and switchability.

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437. Beausoleil,Raymond G.; Kuekes,Philip J.; Munro,William J.; Spiller,Timothy P.; Williams,Richard S.; Barrett,Sean D., Photonic interconnect system.

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438. Kikushima, Masayuki, Piezoelectric device and method for manufacture thereof.

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439. Chappell, William Johnson; Katehi, Linda P. B.; Little, Matthew Patrick, Planar filters having periodic electromagnetic bandgap substrates.

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440. Langille, Babette, Plastic diagnostic card.

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441. Iwasaki Hiroshi (Yokohama JPX), Plate-shaped external storage device and method of producing the same.

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442. Iwasaki Hiroshi,JPX, Plate-shaped external storage device and method of producing the same.

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443. Medina, Raul, Pluggable transceiver module with extended release and removal lever.

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444. Pitroda, Satyan G.; Patel, Merul, Point of sale adapter for electronic transaction device.

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445. Vedder, Klaus; Barak, Renee-Lucia, Portable data support with a break-off mini-chip card.

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446. Naim, Ari, Portable device using a smart card to receive and decrypt digital data.

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447. Tsuchimoto,Yuuji, Portable electronic device.

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448. Iijima Yasuo (Yokohama JPX), Portable electronic device with plural memory areas.

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449. Dreifus Henry N. (Narberth PA), Portable electronic transaction device and system therefor.

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450. Goris, Andrew C, Portable memory card system.

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451. Lee Young-man,KRX ; Cho Chan-dong,KRX, Portable recording/reproducing device, IC memory card recording format, and recording/reproducing mehtod.

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452. Monnier, Michel J.; Monneraye, Marc A.; Foucher, Claude; Le Marchant, Pierre, Portable, identifying element constructed as a lamination of sheets.

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453. Prajuckamol, Atapol; Chew, Chee Hiong; Yao, Yushuang, Power device package.

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454. Lassmann, Wilfried; Büttner, Christian, Printed circuit board and control device for a vehicle transmission comprising the printed circuit board.

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455. Katchmar Roman (Ottawa CAX), Printed circuit boards and heat sink structures.

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456. Okuaki Hiroshi (Tokyo JPX), Printed circuit devices using thermoplastic resin cover plate.

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457. Nakanishi, Tsukasa; Nakamura, Atsushi; Matsumoto, Takayuki, Printed wiring board and method of manufacturing printed wiring board.

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458. Nakanishi Chiaki (Ogaki) Hiroi Atsushi (Ogaki) Yanagawa Yoji (Ogaki JPX), Printed wiring board for IC cards.

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459. Tani Okie (Tokyo JPX) Nanzai Takashi (Fujisawa JPX), Printer system for printing circuit patterns or like on base board.

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460. Hobbs Douglas S., Process for modulating interferometric lithography patterns to record selected discrete patterns in photoresist.

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461. Cowcher, Paul Randle, Processor card arrangement.

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462. Shalev Matti, Programmable system for controlling, regulating, and adjusting flow of animal-feed material from a material storage ves.

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463. Wallerstein Robert S., Programmable transaction card.

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464. Yu, Yunbo; Zhu, Shan, Radio frequency IC card device with very high frequency.

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465. Hillman Robert S. (Cupertino CA), Reagent cartridge for blood analysis.

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466. Gratacap Regis ; Slattery William, Receipts and dispatch timing of transport packets in a video program bearing stream remultiplexer.

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467. Wang, Chien-Chiung; Zhang, Xue-Liang; Wu, Jiang-Hong; Zhu, Qing-Man, Receptacle connector having contact modules and plug connector having a paddle board.

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468. Yu, Gordon; Cheng, Tsung-Kan; Wen, Forli, Removable electronic card.

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469. Yu, Gordon; Wen, Forli; Liu, Ping-Chang, Removable electronic card.

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470. Ecker, Mario E.; Olson, Leonard T., Repairable multi-level overlay system for semiconductor device.

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471. Suzuya Nobuhito,JPX ; Ikemizu Morihiko,JPX ; Takano Terunari,JPX ; Uehara Kenji,JPX ; Yoshida Akito,JPX, Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin.

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472. Joannopoulos John D. ; Meade Robert D., Resonant cavities employing two dimensionally periodic dielectric materials.

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473. Powell Ken R., Retail store having a system of receiving electronic coupon information from a portable card and sending the received co.

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474. Su, Ying; Huang, Wei; Chiang, I-Hsien, Retaining apparatus for a flexible printed circuit board.

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475. Yoshikawa, Yoshishige; Miyashita, Norihiro, SIM card IC module and SIM card.

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476. Zheng, Qisheng; Du, Shaoping; Chen, Bo, SIM card connector.

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477. Bleier Robert,DEX ; Reichardt Manfred,DEX, SMT reader for SIM-card and standard cards.

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478. Battrell, C. Frederick; Sprague, Isaac; Bragd, Matthew Scott; Capodanno, Jason, Sample-to-answer microfluidic cartridge.

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479. Li,Gongling, Secure credit card having daily changed security number.

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480. Miks,Jeffrey Alan, Secure digital memory card using land grid array structure.

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481. Lane William F. (Wilson NC), Self-authenticating identification card with fingerprint identification.

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482. Kosaka Hideo,JPX ; Kawakami Shojiro,JPX, Self-waveguide optical circuit.

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483. Soeno, Akitaka, Semiconductor apparatus with improved efficiency of thermal radiation.

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484. David J. Corisis ; Todd O. Bolken, Semiconductor card and method of fabrication.

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485. Hwang, Hyong-ryol; Lee, Ho-cheol; Na, Byong-wook, Semiconductor chip, stack module, and memory card.

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486. Yoshikawa, Yasuhiro; Suwa, Motoo; Sakata, Kazuyuki, Semiconductor device.

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487. Nishizawa,Hirotaka; Wada,Tamaki; Osawa,Kenji; Osako,Junichiro; Sugiyama,Michiaki, Semiconductor device and a method for manufacturing the same.

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488. Abe, Hiroko; Yukawa, Mikio; Nomura, Ryoji; Seo, Satoshi; Yamazaki, Shunpei, Semiconductor device and manufacturing method thereof.

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489. Negishi,Mikio; Noto,Hiroki; Yamada,Tomio; Endoh,Tsuneo, Semiconductor device and manufacturing the same.

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490. Terashima Kazuhiko,JPX, Semiconductor device and method of fabricating the same.

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491. Yamaguchi, Yoshihiro, Semiconductor device and method of manufacturing the same.

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492. Miyamoto Keiji (Ibaragi JPX) Nakamura Atsushi (Kokubunji JPX) Satoh Tsuneo (Tachikawa JPX) Kojima Kazuo (Tokorozawa JPX) Morita Masayuki (Tokyo JPX), Semiconductor device and method of manufacturing thereof.

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493. Ishihara, Masamichi, Semiconductor device and process for fabricating the same.

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494. Hikita, Junichi; Mochida, Hiroo, Semiconductor device and semiconductor chip for use therein.

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495. Lin Paul T. (Austin TX) McShane Michael B. (Austin TX) Wilson Howard P. (Austin TX), Semiconductor device having a pad array carrier package.

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496. Kuroda, Kenichi; Watanabe, Kozo; Yamamoto, Hirohiko, Semiconductor device with an active region and plural dummy regions.

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497. Nishiuma Masahiko (Ohme JPX) Nakazato Norio (Chiba JPX) Takahashi Hiroyuki (Tachikawa JPX) Kamada Chiyoshi (Kokubunji JPX) Suwa Motoo (Koganei JPX), Semiconductor integrated circuit device and fabrication method thereof.

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498. Uchiyama,Hiroyuki; Chakihara,Hiraku; Ichise,Teruhisa; Kaminaga,Michimoto, Semiconductor integrated circuit device including dummy patterns located to reduce dishing.

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499. Inoue, Akira; Sorada, Haruyuki; Kawashima, Yoshio; Takagi, Takeshi, Semiconductor manufacturing method and semiconductor device.

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500. Okada, Takashi, Semiconductor memory card.

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501. Okada, Takashi, Semiconductor memory card.

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502. Yu, Hak-Soo; Choi, Joo-Sun; Hwan, Hong-Sun, Semiconductor memory device storing memory characteristic information, memory module and memory system having the same, and operating method thereof.

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503. Lambrecht, Frank, Semiconductor module with micro-buffers.

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504. Iwasaki Hiroshi,JPX ; Aoki Hideo,JPX, Semiconductor package and fabrication method.

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505. Song Chi J. (Daejon KRX) Cha Gi B. (Choongchungbook-Do KRX), Semiconductor package and method for manufacturing the same.

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506. Cha Gi Bon (Euiwang KRX), Semiconductor package for a semiconductor chip having centrally located bottom bond pads.

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507. Kim, Donghan; Choi, Kiwon, Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same.

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508. Lavchiev, Ventsislav; Grille, Thomas; Hedenig, Ursula; Jakoby, Bernhard, Sensing systems and methods using a coupling structure.

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509. Wilson Jerrell, Set top box for receiving and decryption and descrambling a plurality of satellite television signals.

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510. Takeda, Mitsunori; Igarashi, Eiichi; Yoshida, Hideyo, Sheet-framed IC carrier and method for producing the same.

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511. Nishikawa Seiichi (Tokyo JPX) Harima Hiroshi (Tokyo JPX) Irisawa Kazuyoshi (Tokyo JPX) Takahashi Jun (Tokyo JPX) Moriyama Akiko (Tokyo JPX) Inada Mayumi (Tokyo JPX) Fukushima Yoshikazu (Tokyo JPX) Wa, Sheet-framed IC carrier, method for producing the same, and IC carrier case.

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512. Seiichi Nishikawa JP; Hiroshi Harima JP; Kazuyoshi Irisawa JP; Jun Takahashi JP; Akiko Moriyama JP; Mayumi Inada JP; Yoshikazu Fukushima JP; Masaki Wakamatsu JP, Sheet-framed IC carrier, method for producing the same, and IC carrier case.

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513. Barry, Aguibou Mountaga, Smart card and mobile communication device comprising the smart card.

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514. Huber Michael,DEX ; Stampka Peter,DEX ; Houdeau Detlef,DEX, Smart card and semiconductor chip for use in a smart card.

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515. Knights Anthony John, Smart card computer adaptor.

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516. Reichardt Manfred,DEX, Smart card connector.

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517. Beals, William Michael; Goupil, Hervé, Smart card interface.

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518. Beals, William Michael; Goupil, Hervé, Smart card interface.

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519. Beals, William Michael; Goupil, Hervé, Smart card interface.

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520. Beals, William Michael; Goupil, Hervé, Smart card interface.

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521. Beals, William Michael; Goupil, Hervé, Smart card interface.

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522. Beals, William Michael; Goupil, Hervé, Smart card interface.

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523. Houdeau Detlef,DEX ; Mundigl Josef,DEX ; Pueschner Frank,DEX ; Stampka Peter,DEX ; Huber Michael,DEX ; Heitzer Josef,DEX, Smart card module and smart card including a smart card module.

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524. Fries, Manfred; Fischer, J?rgen; Houdeau, Detlef, Smart card module for biometric sensors.

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525. Teicher Mordechai,ILX ; Townend Robin,GBX, Smart card pin system, card, and reader.

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526. Jachimowicz Karen E. ; Novis Scott R. ; Barry Dennis ; Jiang Wenbin ; Lebby Michael S., Smart card with contactless optical interface.

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527. Gaumet Michel (Saint Denis En Val FRX), Smart card with plural external contact regions.

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528. Chaney John William, Smart-card based access control system with improved security.

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529. Musial, Pawel; Slikkerveer, Peter Jan, Smartcard and a method of operating a smartcard.

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530. Narendra, Siva G.; Chakraborty, Saurav; Tadepalli, Prabhakar, Smartcard performance enhancement circuits and systems.

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531. Maus, Christopher; Maus, Brandon, Smartcard with iChip contact pad.

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532. David Bickar, Solid solventless protein assay with standards.

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533. Song Kwang B. (Seoul KRX) Kim Sung K. (Seoul KRX) Shim Jin S. (Kyungki-do KRX), Solid state image sensing element.

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534. Munk ; Benedikt A., Space filter.

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535. Sherwin Cynthia R. (Montville NJ) Oksman Norman H. (Mt. Vernon NY), Specimen-collection pad for occult-blood detection.

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536. Moden Walter L. ; Corisis David J. ; Mess Leonard E. ; Kinsman Larry D., Stackable ceramic FBGA for high thermal applications.

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537. Levardo, Melvin N., Stacked microelectronic packages.

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538. Tarui, Yukinobu; Yamaguchi, Kazuhiro; Mitani, Jun, Stacked radio-frequency module.

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539. Jun Ohmori JP, Stacked semiconductor device and semiconductor system.

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540. Moon, Ow Chee; Koon, Eng Meow, Stacked-die assemblies with a plurality of microelectronic devices and methods of manufacture.

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541. Eun, Hyung Lae, Stacked-type semiconductor device package.

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542. Hasan Altaf (Chandler AZ) Wilson J. D. (Phoenix AZ) Natarajan Siva (Gilbert AZ), Staggered land pad pattern on substrate for tab interconnection.

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543. Garcia Andres,ESX, Standard card having an embedded mini chip card.

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544. Battles Donald R., Sterilization indicators and methods.

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545. Farhan, Munif M.; Utz, James R., Storage devices including different sets of contacts.

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546. Aoki, Yoshitaka; Sogabe, Takashi; Komatani, Shinjiro, Storage medium.

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547. Flory, Curt A.; Sigalas, Mihail M., Stub-tuned photonic crystal waveguide.

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548. Matsumoto, Manabu; Ozawa, Isao, Substrate for an electronic circuit.

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549. Matsumoto, Manabu; Ozawa, Isao, Substrate for an electronic circuit.

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550. Matsumoto, Manabu; Ozawa, Isao, Substrate for an electronic circuit.

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551. Matsumoto, Manabu; Ozawa, Isao, Substrate for an electronic circuit.

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552. Matsumoto, Manabu; Ozawa, Isao, Substrate for an electronic circuit.

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553. Morikawa, Makoto; Ogata, Toshifumi; Sugiura, Kenji; Tanimoto, Noriyasu; Abe, Masumi; Minamihata, Ryo, Substrate for light source of light emitting diode.

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554. Urasaki Naoyuki,JPX ; Simada Yasusi,JPX ; Tsuru Yoshiyuki,JPX ; Nakaso Akishi,JPX ; Watanabe Itsuo,JPX, Substrate for mounting semiconductor chips.

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555. Kushima Hidekiyo (Kanagawa JPX), Surge absorption apparatus.

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556. Bando,Hideaki, System and method for data bus communication system between external card connection device and host device.

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557. Lawson, Lance P.; Miller, Marla; Fullerton, Larry W.; Roberts, Mark D., System and method for data card emulation.

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558. Liu, Patrick Chung-You, System and method to access and address high-speed interface converter devices.

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559. Angell Larry D. ; Krivy Andrew J., System for cleaning semiconductor device probe.

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560. Shi, Shouyun; Chen, Caihua; Sharkawy, Ahmed; Prather, Dennis W., System for efficient coupling to photonic crystal waveguides.

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561. Chaney John William, System for processing a video signal via series-connected high speed signal processing smart cards.

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562. Simon, Jonathan, Systems and methods for altering the propagation of optical signals within optical media.

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563. Cloutier, Bruce S.; Mullen, Jeffrey D., Systems and methods for detection mechanisms for magnetic cards and devices.

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564. Krause Arthur A., Systems for authenticating the use of transaction cards having a magnetic stripe.

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565. Lee, Si-Hoon; Song, Eun-Seok, Tape wiring substrate and chip-on-film package using the same.

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566. Chung, Yechung; Kim, Chulwoo; Song, Eunseok; Choi, Kyoungsei, Tape wiring substrates and packages including the same.

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567. Filkins, Robert John; Lorraine, Peter William, Technique for quasi-phase matching.

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568. Bck Joseph (Vorderdrofstrasse 725 CH-9427 Wolfhalden CHX), Telephone.

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569. Martin, Jean-Claude; Dubugnon, Dominique, Telephone watch including a SIM card in its housing.

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570. Wakabayashi Kenichi (Suwa JPX) Takayama Chitoshi (Suwa JPX) Shiozaki Tadashi (Suwa JPX), Temperature control for add-on electronic devices.

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571. Tanaka, Yoshikatsu; Arai, Masaaki, Temperature-compensated crystal oscillator.

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572. Haghiri-Tehrani Yahya (Munich DEX), Terminal arrangement for integrated circuit device.

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573. Burns Mark A. ; Johnson Brian N. ; Chen Michael,SGX, Thermal microvalves in a fluid flow method.

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574. Barker,Delmar L.; Owens,William R.; Rosenwald,Ross D.; Shah,Nitesh N.; Xin,Hao, Thermally powered terahertz radiation source using photonic crystals.

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575. Ueda Tetsuya (Itami JPX), Thin semiconductor card.

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576. Ohmori Jun,JPX ; Iwasaki Hiroshi,JPX, Thin type semiconductor package.

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577. Nicewarner ; Jr. Earl R. ; Frinak Steven L., Three-dimensional flexible assembly of integrated circuits.

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578. Kuga Kaeko,JPX ; Uemura Takuzo,JPX, Three-dimensional image reproducing apparatus.

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579. Hayden Warren (Redondo Beach CA) Uyemura David K. (Torrance CA) Burney Richard E. (Long Beach CA) Schreiber Christopher M. (Lake Elsinore CA) Linder Jacques F. (Palos Verdes CA), Three-dimensional integrated circuit stacking.

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580. Kamperman Franciscus L.A.J.,NLX, Time-shifted conditional access.

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581. Poznansky, Amir; Yahalom, Asher; Cohen, Haim, Transaction card with improved security features.

     상세보기
582. Zbinden, Eric; Musser, Randall; Verdiell, Jean-Marc André; Mongold, John; Vicich, Brian; Guetig, Keith, Transceiver and interface for IC package.

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583. Mattia John Paul, Transistor utilizing photonic band-gap material and integrated circuit devices comprising same.

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584. Landis, Howard S., Trimming of dummy fill shapes holes to affect near-neighbor dummy fill shapes with built-in optical proximity corrections for semiconductor applications.

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585. Noda,Susumu; Asano,Takashi; Song,Bong Shik; Takayama,Seiichi, Two-dimensional photonic crystal and optical function element using the same.

     상세보기
586. Bourelle, Emmanuel, Two-dimensional photonic crystal device.

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587. Sigalas, Mihail M.; Grot, Annette; Mirkarimi, Laura W.; Flory, Curt, Two-dimensional photonic crystal slab waveguide.

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588. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.

     상세보기
589. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.

     상세보기
590. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.

     상세보기
591. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus.

     상세보기
592. Lepp, James Randolph Winter; Cormier, Jean-Philippe Paul; Schwandt, Sheldon Terry; Los, Oleg; Braun, Petra, UICC apparatus and related methods.

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593. Pavlov Leonidas P. (Colorado Springs CO) Aba-Jbara Nabil M. (Colorado Springs CO), Unitary, self-contained card verification and validation system and method.

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594. Cooper J. Carl, Universal credit card apparatus and method.

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595. Cooper, J. Carl, Universal credit card apparatus and method.

     상세보기
596. Cooper, J. Carl, Universal credit card apparatus and method.

     상세보기
597. Cooper, J. Carl, Universal credit card apparatus and method.

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598. Schwandt, Sheldon Terry; Dehmoubed, Farzin; Infanti, James Carl; Lepp, James Randolph Winter; Los, Oleg, Universal integrated circuit card apparatus and related methods.

     상세보기
599. Ross Andrew C., Universal package and method of forming the same.

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600. Wallace,Robert F.; Brewer,Wesley G.; Pinto,Yosi, Use of small electronic circuit cards with different interfaces in an electronic system.

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601. Bonneau, Jr., Walter C.; Macklin, Jon D., Variable thickness data card body.

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602. Brent E. Little ; Wugen Pan JP; Yasuo Kokubun JP; Sai T. Chu, Vertically coupled optical resonator devices over a cross-grid waveguide architecture.

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603. Manning,John Palmer, Video image formatting technique.

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604. Kano Isao,JPX, Wafer having a plurality of IC chips having different sizes formed thereon.

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605. Lee, Chang hwan, Wafer type probe card, method for fabricating the same, and semiconductor test apparatus having the same.

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606. Farnworth, Warren M.; McDonald, Steven M., Wafer-level testing apparatus and method.

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607. Nordin, Gregory P.; Kim, Seunghyun; Cai, Jingbo; Jiang, Jianhua, Waveguide including at least one photonic crystal region for directing signals propagating therethrough.

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608. Sigalas, Mihail M.; Chow, Kai Cheung, Waveguides in two dimensional slab photonic crystals with noncircular holes.

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609. Toney, James E., Wavelength separation devices incorporating multi-barrier photonic heterostructures.

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610. Wang,Shih Yuan; Islam,M. Saif; Li,Zhiyong, Wavelength-tunable excitation radiation amplifying structure and method.

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611. Hugunin,Derick, Wireless mobile communication device having a speaker vibration alert and method of using same.

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612. Ishihara, Teruyuki; Noguchi, Hidetoshi; Futamura, Hirofumi, Wiring board and method for manufacturing the same.

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613. Nakagawa, Kazuyuki, Wiring substrate for a semiconductor device having differential signal paths.

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