Anti-fungal seed treatment formulations, treated seeds, and methods
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A01N-059/00
A01N-059/20
C05G-003/02
C05D-009/02
A01N-025/00
출원번호
US-0878704
(2018-01-24)
등록번호
US-10233134
(2019-03-19)
발명자
/ 주소
Krolikowski, Dale Allan
Cross, David
Tang, Eugenia
출원인 / 주소
GERMAINS SEED TECHNOLOGY, INC.
대리인 / 주소
Frost Brown Todd LLC
인용정보
피인용 횟수 :
0인용 특허 :
14
초록▼
A coated seed comprises a seed and a coating at least partially surrounding the seed. The coating comprises a fungicide, a micronutrient metal, and a chelating agent, the fungicide comprising copper (II) hydroxide, wherein the amount of copper (II) hydroxide is from about 0.05 mg/seed to about 0.21
A coated seed comprises a seed and a coating at least partially surrounding the seed. The coating comprises a fungicide, a micronutrient metal, and a chelating agent, the fungicide comprising copper (II) hydroxide, wherein the amount of copper (II) hydroxide is from about 0.05 mg/seed to about 0.21 mg/seed. A method for applying a seed treatment to a seed or a population of seeds comprises distributing on the surface of the seed or the population of seeds a seed treatment formulation comprising a fungicide, a micronutrient metal, and a chelating agent. The fungicide comprises copper (II) hydroxide in an amount ranging from about 2 wt. % to about 20 wt. % of the total seed treatment formulation.
대표청구항▼
1. A coated seed comprising: a seed anda coating at least partially surrounding the seed,wherein the coating comprises a fungicide, a micronutrient metal, and a chelating agent, the fungicide comprising copper (II) hydroxide, wherein the amount of copper (II) hydroxide is from about 0.12 mg/seed to
1. A coated seed comprising: a seed anda coating at least partially surrounding the seed,wherein the coating comprises a fungicide, a micronutrient metal, and a chelating agent, the fungicide comprising copper (II) hydroxide, wherein the amount of copper (II) hydroxide is from about 0.12 mg/seed to about 0.21 mg/seed; wherein the micronutrient metal comprises zinc; and wherein the chelating agent comprises zeolite. 2. The coated seed of claim 1, wherein the micronutrient further comprises a metal selected from manganese, iron, boron, chromium, cobalt, copper, and salts thereof. 3. The coated seed of claim 1, wherein the micronutrient comprises one or more zinc salt. 4. The coated seed of claim 1, wherein the chelating agent is selected from the group consisting of zeolite and EDTA. 5. The coated seed of claim 1, wherein the coating further comprises a binding agent. 6. The coated seed of claim 5, wherein the binding agent is selected from the group consisting of a fiber gum and polyvinyl alcohol. 7. The coated seed of claim 1, wherein the coating further comprises humic acid. 8. The coated seed of claim 1, wherein the coating is substantially free of added fulvic acid. 9. The coated seed of claim 1, wherein the coating further comprises a soil conditioner. 10. The coated seed of claim 1, wherein the coating further comprises a bactericide. 11. The coated seed of claim 1, wherein the coating has a pH in the range of 6.0 to 6.4. 12. The coated seed of claim 1, wherein the coating encapsulates the seed. 13. The coated seed of claim 1, wherein the seed is a spinach, pea, or corn seed. 14. A method for applying a seed treatment to a seed or a population of seeds, the method comprising: distributing on the surface of the seed or the population of seeds a seed treatment formulation comprising a fungicide, a micronutrient metal, and a chelating agent, anddrying the seed treatment formulation to form a coating, wherein the fungicide comprises copper (II) hydroxide in an amount anging from about 9 wt. % to about 20 wt. % of the total seed treatment formulation. 15. The method of claim 14, wherein the seed treatment formulation is a liquid slurry. 16. The method of claim 14, wherein the seed treatment formulation further comprises a coloring agent. 17. A method of protecting an emerging root system from fungal infection, the method comprising providing at least one seed,coating the at least one seed with a seed treatment formulation comprising fungicide, a micronutrient metal, and a chelating agent,drying the seed treatment formulation to form a coating, andplanting the coated seed under conditions suitable for germination, wherein the fungicide comprises copper (II) hydroxide wherein the amount of copper (II) hydroxide comprises at least about 9 wt. % and no more than about 20 wt. % of the total seed treatment formulation. 18. The method of claim 17, wherein the coated seed comprises a spinach, pea, or corn seed. 19. The method of claim 17, wherein the coating is effective to protect the emerging root system from fungal infection for at least 5 days. 20. The method of claim 17, wherein the conditions are an organic growing medium.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (14)
Göhlich, Frank; Kraus, Anton; Wachendorff-Neumann, Ulrike, Active compound combinations.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.