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An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element

An electronic module includes a circuit board, a first component, and a socket element with a first surface and a second surface opposite the first surface. The first surface lies on a surface of the circuit board and is fixed to the circuit board. A second component is secured to the socket element and is electrically connected to the circuit board via the socket element. A protective compound is arranged on the surface of the circuit board and encapsulates the first component. The socket element is partly embedded into the protective compound such that lateral flanks of the socket element are covered by the protective compound, and the second surface of the socket element protrudes out of the protective compound. Connection elements of the socket element and connections of the second component are connected via a welding connection. Second components are attachable to the circuit board in a reliable manner.

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1. An electronic module, comprising: a circuit board;a first component arranged on a surface of the circuit board and fastened thereon;a base element, which has a first surface and a second surface opposite the latter, and which is arranged with the first surface lying on the surface of the circuit

1. An electronic module, comprising: a circuit board;a first component arranged on a surface of the circuit board and fastened thereon;a base element, which has a first surface and a second surface opposite the latter, and which is arranged with the first surface lying on the surface of the circuit board and fastened thereon;a second component, which is fastened on the base element and is electrically connected via the base element to the circuit board; anda protective compound, which is arranged on the surface of the circuit board and encapsulates the first component,wherein the base element is partially embedded in the protective compound in such a way that lateral faces of the base element are covered by the protective compound and the second surface of the base element protrudes in an exposed fashion from the protective compound,wherein the second component has electrical terminals,wherein the base element has electrical terminal elements which are electrically connected to electrically conductive structures on the circuit board,wherein the electrical terminals are electrically connected to the electrical terminal elements, andwherein the electrical terminals are welded to the electrical terminal elements. 2. The electronic module as claimed in claim 1, wherein the base element is a part that is surface-mounted on the circuit board. 3. The electronic module as claimed in claim 1, wherein the first component and the base element have similar sizes such that the first component and the base element are configured to be fitted on the circuit board by one and the same applicator machine. 4. The electronic module as claimed in claim 1, wherein the second component is a sensor, a plug, or a further module having terminal contacts. 5. The electronic module as claimed in claim 1, wherein the protective compound is a coating, an encapsulation compound, a molding compound, or a resin. 6. The electronic module as claimed in claim 5, wherein the protective compound consists of a thermosetting material. 7. An electronic module, comprising: a circuit board;a first component arranged on a surface of the circuit board and fastened thereon;a base element, which has a first surface and a second surface opposite the latter, and which is arranged with the first surface lying on the surface of the circuit board and fastened thereon;a second component, which is fastened on the base element and is electrically connected via the base element to the circuit board; anda protective compound, which is arranged on the surface of the circuit board and encapsulates the first component,wherein the base element is partially embedded in the protective compound in such a way that lateral faces of the base element are covered by the protective compound and the second surface of the base element protrudes in an exposed fashion from the protective compound,wherein the second component has electrical terminals,wherein the base element has electrical terminal elements which are electrically connected to electrically conductive structures on the circuit board,wherein the electrical terminals are electrically connected to the electrical terminal elements, andwherein a connection position, at which the electrical terminals are connected to the electrical terminal elements, is encapsulated. 8. The electronic module as claimed in claim 7, wherein the base element is a part that is surface-mounted on the circuit board. 9. The electronic module as claimed in claim 7, wherein the first component and the base element have similar sizes such that the first component and the base element are configured to be fitted on the circuit board by one and the same applicator machine. 10. The electronic module as claimed in claim 7, wherein the second component is a sensor, a plug, or a further module having terminal contacts. 11. The electronic module as claimed in claim 7, wherein the protective compound is a coating, an encapsulation compound, a molding compound, or a resin. 12. A method for producing an electronic module, comprising: arranging a first component on a surface of a circuit board;arranging a base element, which has a first surface and a second surface opposite the first surface, with the first surface on the surface of the circuit board;arranging a second component on the base element; andembedding the first component into a protective compound in such a way that the first component is encapsulated in the protective compound,wherein, with the embedding of the first component, the base element is also partially embedded into the protective compound in such a way that lateral faces of the base element are covered by the protective compound and the second surface of the base element protrudes in an exposed fashion from the protective compound,wherein the second component has electrical terminals,wherein the base element has electrical terminal elements which are electrically connected to electrically conductive structures on the circuit board, andwherein the electrical terminals are welded to the electrical terminal elements. 13. The method as claimed in claim 12, wherein the embedding is carried out by a dispensing process. 14. The method as claimed in claim 12, wherein the base element and the second electrical component are mechanically fastened to one another irreversibly. 15. The method as claimed in claim 14, wherein the base element and the second electrical component are mechanically fastened to one another irreversibly by one or more of adhesive bonding, hot caulking, and a compression connection.