Flexible protective housing for electronic devices
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-001/16
H05K-005/00
H05K-007/00
H05K-005/03
출원번호
US-0446623
(2017-03-01)
등록번호
US-10237989
(2019-03-19)
발명자
/ 주소
Peters, David Eric
Taussig, Carl Philip
Cheng, Shan
Srinivas, Vikram
출원인 / 주소
Amazon Technologies, Inc.
대리인 / 주소
Eversheds Sutherland (US) LLP
인용정보
피인용 횟수 :
0인용 특허 :
3
초록▼
A flexible housing for a flexible electronic device is coupled to a cover lens for enclosing components disposed between the flexible housing and the cover lens. The flexible housing includes a flexible polymer substrate. A first metal layer covering at least a portion of the flexible polymer substr
A flexible housing for a flexible electronic device is coupled to a cover lens for enclosing components disposed between the flexible housing and the cover lens. The flexible housing includes a flexible polymer substrate. A first metal layer covering at least a portion of the flexible polymer substrate. A second metal layer is disposed on the first metal layer. A protective coating covers the second metal layer.
대표청구항▼
1. A flexible electronic device, comprising: a flexible housing having a recessed region in which to receive components of the flexible electronic device, the flexible housing comprising: a flexible polymer substrate having a first surface and one or more side surfaces forming the recessed region, a
1. A flexible electronic device, comprising: a flexible housing having a recessed region in which to receive components of the flexible electronic device, the flexible housing comprising: a flexible polymer substrate having a first surface and one or more side surfaces forming the recessed region, and a second surface opposite the first surface;a first metal layer disposed on at least a portion of the second surface of the flexible polymer substrate;a second metal layer disposed on the first metal layer; anda protective coating disposed on the second metal layer; anda flexible cover lens positioned over the recessed region and coupled to the flexible housing. 2. The flexible electronic device of claim 1, wherein the flexible polymer substrate comprises a flexible thermoplastic elastomer (TPE) substrate. 3. The flexible electronic device of claim 2, wherein the flexible TPE substrate comprises one of: a styrenic block copolymer, a thermoplastic olefin, an elastomeric alloy, a thermoplastic polyurethane, a thermoplastic copolyester, a thermoplastic polyamide, or a silicone material. 4. The flexible electronic device of claim 1, wherein the flexible polymer substrate includes a laser direct structuring (LDS) additive material. 5. The flexible electronic device of claim 1, further comprising a promoting layer disposed on the flexible polymer substrate, wherein the first metal layer is disposed on the promoting layer. 6. The flexible electronic device of claim 1, further comprising a transitional material layer disposed on the second metal layer and positioned between the second metal layer and the protective coating. 7. The flexible display device of claim 1, wherein the first metal layer comprises one of: copper and nickel, and the second metal layer comprises one of: nanocrystalline cobalt, aluminum, gold, silver, platinum, or palladium. 8. The flexible display device of claim 1, further comprising a transitional material layer disposed on the second metal layer and positioned between the second metal layer and the protective coating, the transitional material layer comprising a metal oxide material or a metal nitride material, and the protective coating comprises an anti-fingerprint (AFP) material. 9. The flexible display device of claim 8, further comprising a primer material layer disposed between the transitional material layer and the protective coating. 10. The flexible display device of claim 1, wherein the one or more side surfaces contact the flexible cover lens. 11. A flexible electronic device, comprising: a flexible housing, comprising: a flexible polymer substrate having a first surface at least partially forming a recessed region and a second surface opposing the first surface;a first metal layer covering at least a portion of the second surface of the flexible polymer substrate;a second metal layer disposed on the first metal layer; anda protective coating covering the second metal layer. 12. The flexible electronic device of claim 11, wherein the flexible polymer substrate comprises a flexible thermoplastic elastomer (TPE) substrate and a laser direct structuring (LDS) additive material blended with the TPE substrate. 13. The flexible electronic device of claim 11, wherein the first metal layer comprises one of: copper or nickel and the second metal layer comprises one of: nanocrystalline cobalt, aluminum, gold, silver, platinum, or palladium. 14. The flexible electronic device of claim 11, further comprising a transitional material layer disposed on the second metal layer and positioned between the second metal layer and the protective coating. 15. The flexible electronic device of claim 14, further comprising a primer material layer disposed between the transitional material layer and the protective coating. 16. The flexible electronic device of claim 11, wherein the recessed region is configured to receive components of the flexible electronic device, the flexible electronic device further comprising a flexible cover lens positioned over the recessed region and coupled to the flexible housing.
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이 특허에 인용된 특허 (3)
Rayner, Gary; Popa, III, George, Housing for encasing a mobile device.
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