초록 ▼

The invention relates to a method for measuring the temperature of at least one electronic component (2) using a sensor (4) that supplies a temperature-dependent voltage. The method comprises the following steps in which: a signal representative of the voltage delivered by the sensor (4) is made to

The invention relates to a method for measuring the temperature of at least one electronic component (2) using a sensor (4) that supplies a temperature-dependent voltage. The method comprises the following steps in which: a signal representative of the voltage delivered by the sensor (4) is made to pass through an isolated differential amplifier (13), and the signal output from said isolated differential amplifier (13) is used to determine the temperature measured by the sensor (4).

대표청구항 ▼

1. A method of measuring a temperature of at least one electronic component using a sensor delivering a voltage according to said temperature, comprising: passing a signal representative of the voltage delivered by the sensor through an isolated differential amplifier, the isolated differential ampl

1. A method of measuring a temperature of at least one electronic component using a sensor delivering a voltage according to said temperature, comprising: passing a signal representative of the voltage delivered by the sensor through an isolated differential amplifier, the isolated differential amplifier comprising a galvanic isolation barrier traversed by said signal;determining, based on the output signal from the isolated differential amplifier, the temperature of the electronic component; andlinearizing a relationship between the voltage delivered by the sensor and the temperature of the electronic component upstream of the isolated differential amplifier,wherein linearizing is caused by a resistance bridge mounted between a ground and a voltage source of the sensor. 2. The method as claimed in claim 1, wherein the output signal from the isolated differential amplifier is received as the input of a ground-referenced comparator. 3. The method as claimed in claim 2, wherein the output signal from the comparator is received as the input to a processing stage. 4. The method as claimed in claim 3, wherein the processing stage includes an analog/digital converter and a digital processing unit. 5. The method as claimed in claim 1, wherein the galvanic isolation provided by the isolated differential amplifier is of the capacitive or inductive type. 6. The method as claimed in claim 5, wherein the sensor and the isolated differential amplifier are installed on a same printed circuit board. 7. The method as claimed in claim 6, the printed circuit board further comprising the electronic component or components the temperature of which is measured, each of said components having a nominal power greater than or equal to 1 kW. 8. The method as claimed in claim 1, wherein, for determining the temperature of the electronic component, a measurement circuit is used of which the part upstream of the isolated differential amplifier input is in a high voltage environment and of which the part downstream of the isolated differential amplifier output is in a low voltage environment. 9. The method as claimed in claim 1, wherein linearizing the relationship includes imposing a resistance value of the sensor on a resistor at a terminal of the sensor. 10. A circuit for measuring temperature from the voltage delivered by a temperature sensor, the circuit comprising: an isolated differential amplifier, receiving as input a voltage representative of the temperature measured by the sensor; anda processing stage configured for determining the temperature measured according to the output signal from the isolated differential amplifier, whereinthe isolated differential amplifier comprising a galvanic isolation barrier between its input and its output,the relationship between the voltage delivered by the sensor and the temperature of an electronic component measured by the temperature sensor is linearized upstream of the isolated differential amplifier in the circuit, andthe linearization is caused by a resistance bridge mounted between a ground and a voltage source of the sensor. 11. A system, including: the circuit as claimed in claim 10; anda temperature sensor. 12. The circuit as claimed in claim 10, wherein the linearization includes imposing a resistance value of the sensor on a resistor at a terminal of the sensor.