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[미국특허] Cooling systems and methods using two cooling circuits 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
  • F25B-029/00
출원번호 US-0520322 (2014-10-21)
등록번호 US-10254021 (2019-04-09)
발명자 / 주소
  • McDonnell, Gerald
  • Zhang, Ming
  • Costakis, John
  • Keisling, Earl
출원인 / 주소
  • Inertech IP LLC
대리인 / 주소
    Weber Rosselli & Cannon LLP
인용정보 피인용 횟수 : 0  인용 특허 : 68

초록

The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

대표청구항

1. A cooling system comprising: a first evaporator coil in thermal communication with an air intake flow from a heat load;a first liquid refrigerant distribution unit coupled to the first evaporator coil to form a first fluid circuit;a second evaporator coil disposed in series with the first evapora

이 특허에 인용된 특허 (68) 인용/피인용 타임라인 분석

  1. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Apparatus and method for facilitating dissipation of heat from a liquid-cooled electronics rack.
  2. Archibald, Matthew R.; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Schmidt, Roger R., Apparatus and method for simulating one or more operational characteristics of an electronics rack.
  3. Husain Matloob (Wheaton IL) Lai Ban-Yen (Willowbrook IL) Schmitt Richard L. (Batavia IL), Apparatus and methods of cooling a hot fluid stream.
  4. Roberto, Trecate, Chilling unit with "free-cooling", designed to operate also with variable flow rate; system and process.
  5. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Combined power and cooling rack supporting an electronics rack(S).
  6. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Combined power and cooling rack supporting an electronics rack(s).
  7. Lin, Tai-Wei, Container data center.
  8. Arimilli, Ravi K.; Ellsworth, Jr., Michael J.; Seminaro, Edward J., Convergence of air water cooling of an electronics rack and a computer room in a single unit.
  9. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Coolant-buffered, vapor-compression refrigeration with thermal storage and compressor cycling.
  10. Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K., Cooling of data centers.
  11. Patel, Chandrakant D.; Bash, Cullen E., Cooling system.
  12. Chu,Richard C.; Ellsworth, Jr.,Michael J.; Schmidt,Roger R.; Simons,Robert E.; Zoodsma,Randy J., Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems.
  13. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooling system and method minimizing power consumption in cooling liquid-cooled electronics racks.
  14. Lipp, Robert J.; Hughes, Phillip P., Cooling system for contact cooled electronic modules.
  15. Kashirajima, Yasuhiro; Kikuchi, Hiroshige; Sugiura, Takumi; Watanabe, Koji; Nakashima, Kenichi, Cooling system for electronic equipment.
  16. Kashirajima, Yasuhiro; Kikuchi, Hiroshige; Sugiura, Takumi; Watanabe, Koji; Nakashima, Kenichi, Cooling system for electronic equipment.
  17. Kashirajima, Yasuhiro; Kikuchi, Hiroshige; Sugiura, Takumi; Watanabe, Koji; Nakashima, Kenichi, Cooling system for electronic equipment.
  18. Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
  19. Fink, James R.; Bean, John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  20. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  21. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  22. Fink, James R.; Bean, Jr., John H.; Held, Stephen F.; Johnson, Richard J.; Johnson, Rollie R., Data center cooling.
  23. Fink,James R.; Bean, Jr.,John H.; Held,Stephen F.; Johnson,Richard J.; Johnson,Rollie R., Data center cooling.
  24. Fink,James R.; Bean, Jr.,John H.; Held,Stephen F.; Johnson,Richard J.; Johnson,Rollie R., Data center cooling.
  25. Donald J. Schumacher ; William C. Beckman, Data center cooling system.
  26. Fink, James, Data center cooling system.
  27. Fink, James, Data center cooling system.
  28. Tozer, Robert; Bash, Cullen; Patel, Chandrakant, Data centers.
  29. Gardner, Brock R., Datacenter with angled hot aisle venting.
  30. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack.
  31. Hebert Thomas H., Dual evaporator for indoor units and method therefor.
  32. Schmidt, Roger R; Takayoshi, Jyunji; Tsukamoto, Takeshi; Funatsu, Masayoshi; Onai, Minoru; Imai, Masaaki; Inoue, Yoshinori, Facilitating cooling of an electronics rack employing water vapor compression system.
  33. Goettert, Carsten; Huels, Harald; Kraemer, Hans-Guenter; Ries, Manfred; Schaefer, Rolf, Heat exchange system for blade server systems and method.
  34. Harvey, Thomas E., Heat exchanger and method for use in precision cooling systems.
  35. Bean, Jr., John H.; Niemann, John Christopher, Hot aisle containment cooling system and method.
  36. Bean, Jr., John H.; Dong, Zhihai Gordon, Hot aisle containment cooling unit and method for cooling.
  37. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center.
  38. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center.
  39. Bean, Jr.,John H., IT equipment cooling.
  40. Spearing, Ian G.; Schrader, Timothy J, Liquid cooling systems for server applications.
  41. Copeland, David W.; Masto, Andrew R.; Vogel, Marlin R., Liquid-cooled rack with pre-cooler and post-cooler heat exchangers used for EMI shielding.
  42. Baer, Daniel B, Method and apparatus for cooling electronic enclosures.
  43. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations.
  44. Clidaras, Jimmy; Whitted, William; Hamburgen, William; Sykora, Montgomery; Leung, Winnie; Aigner, Gerald; Beaty, Donald L., Modular computing environments.
  45. Clidaras, Jimmy; Whitted, William; Hamburgen, William; Sykora, Montgomery; Leung, Winnie; Aigner, Gerald; Beaty, Donald L., Modular computing environments.
  46. Clidaras, Jimmy; Hamburgen, William; Leung, Winnie; Stiver, David W.; Carlson, Andrew B.; Chow, Steven T. Y.; Beck, Jonathan D., Modular data center cooling.
  47. Hamburgen, William; Clidaras, Jimmy; Leung, Winnie; Stiver, David W.; Beck, Jonathan D.; Carlson, Andrew B.; Chow, Steven T. Y.; Imwalle, Gregory P.; Michael, Amir M., Modular data center cooling.
  48. Novotny, Shlomo D.; Menoche, John P.; Roden, David W., Modular scalable coolant distribution unit.
  49. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly method with shared cooling unit.
  50. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling apparatus.
  51. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling apparatus.
  52. Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-rack assembly with shared cooling unit.
  53. Goth, Gary F.; Kostenko, William P.; Mullady, Robert K.; Vandeventer, Allan C., Multimodal cooling apparatus for an electronic system.
  54. Claassen, Alan; Eckberg, Eric Alan; Hansen, Dennis John; Kamath, Vinod; Iyengar, Madhusudan K.; Mahaney, Jr., Howard Victor; Miller, Michael Sven; Mroz, Stephen Peter, Rack with integrated rear-door heat exchanger.
  55. Tölle, Hans Jürgen; Vogel, Reinhard; Wengler, Peter, Redundant cooling system with two cooling circuits for an electric motor.
  56. van der Walt Nicholas R. ; Unger Reuven Z., Refrigeration circuit having series evaporators and modulatable compressor.
  57. Bash, Cullen E.; Beitelmal, Abdlmonem; Sharma, Ratnesh K.; Patel, Chandrakant D., Refrigeration system with serial evaporators.
  58. Patel, Chandrakant D.; Bash, Cullen E.; Beitelmal, Abdlmonem H., Smart cooling of data centers.
  59. Bean,John H.; Lomas,Jonathan M., Sub-cooling unit for cooling system and method.
  60. Patel, Chandrakant; Bash, Cullen E.; Sharma, Ratnesh K., System and method for cooling an electronic device.
  61. Patel, Chandrakant; Bash, Cullen E.; Sharma, Ratnesh K., System and method for cooling an electronic device.
  62. Zien, Herbert B., System and method for efficient utilization of energy generated by a utility plant.
  63. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., System and method for facilitating parallel cooling of liquid-cooled electronics racks.
  64. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., System and method for standby mode cooling of a liquid-cooled electronics rack.
  65. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Schmidt, Roger R.; Simons, Robert E., System of facilitating cooling of electronics racks of a data center employing multiple cooling stations.
  66. Whitted, William H., Systems and methods for close coupled cooling.
  67. Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Thermoelectric-enhanced, vapor-compression refrigeration apparatus facilitating cooling of an electronic component.
  68. Carlson, Andrew B.; Clidaras, Jimmy; Hamburgen, William, Warm floor data center.

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