[미국특허]
Patterning graphene with a hard mask coating
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-029/16
H01L-021/02
H01L-021/027
H01L-021/311
출원번호
15623279
(2017-06-14)
등록번호
10903319
(2021-01-26)
발명자
/ 주소
Pan, Deng
Goldsmith, Brett
출원인 / 주소
Nanomedical Diagnostics, Inc.
대리인 / 주소
Kunzler Bean & Adamson
인용정보
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0인용 특허 :
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초록▼
Embodiments of the disclosed technology include patterning a graphene sheet for biosensor and electronic applications using lithographic patterning techniques. More specifically, the present disclosure is directed towards the method of patterning a graphene sheet with a hard mask metal layer. The ha
Embodiments of the disclosed technology include patterning a graphene sheet for biosensor and electronic applications using lithographic patterning techniques. More specifically, the present disclosure is directed towards the method of patterning a graphene sheet with a hard mask metal layer. The hard mask metal layer may include an inert metal, which may protect the graphene sheet from being contaminated or damaged during the patterning process.
대표청구항▼
1. A method for patterning a graphene-based device in graphene, the method comprising: placing a graphene sheet on a wafer;depositing a temporary protective metal layer on the graphene sheet;depositing a photoresist layer on the temporary protective metal layer;exposing the photoresist layer to a ra
1. A method for patterning a graphene-based device in graphene, the method comprising: placing a graphene sheet on a wafer;depositing a temporary protective metal layer on the graphene sheet;depositing a photoresist layer on the temporary protective metal layer;exposing the photoresist layer to a radiation source in accordance with a pattern, the pattern comprising etching areas and mask areas, wherein the mask areas are configured to protect masked portions of the graphene sheet from contamination during packaging process of the graphene-based device, and wherein the etching areas are configured to expose portions of the temporary protective metal layer, and the graphene sheet;etching away the etching areas of the temporary protective metal layer, and the graphene sheet;packaging the graphene-based device, wherein the packaging comprises epoxy curing, or encapsulating the graphene-based device; andafter the packaging, removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. 2. The method of claim 1, further comprising removing a masked portion of the photoresist layer as a process step that directly precedes a next process step, the next process step being the removing the masked portions of the temporary protective metal layer that protected the masked portions of the graphene sheet during packaging. 3. The method of claim 1, wherein removing the masked portions of the temporary protective metal layer comprises washing the masked portions of the temporary protective metal layer with a potassium iodide solution. 4. The method of claim 3, further comprising removing a portion of the graphene sheet previously covered by the portion of the temporary protective metal layer. 5. The method of claim 4, wherein the removing the portion of the graphene sheet comprises applying a plasma etching process to the portion of the graphene sheet. 6. The method of claim 1, wherein the removing the masked portions of the temporary protective metal layer comprises washing the temporary protective metal layer with a potassium iodide solution. 7. A method for patterning graphene comprising: placing a graphene sheet on a wafer;depositing a temporary protective metal layer on the graphene sheet, wherein the temporary protective metal layer protects a patterned graphene portion of the graphene sheet from contamination or harm during packaging and assembly of a graphene-based device comprising the patterned graphene portion;depositing a photoresist layer on the temporary protective metal layer;exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas;etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas the pattern;etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern;patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheets at areas within the etching areas of the pattern;packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain during the packaging and assembly to protect the patterned graphene portion of the graphene-based device;after the packaging and assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in a biosensor application, wherein exposing the mask areas of the patterned graphene portion comprisesremoving the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. 8. The method of claim 7, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises protecting the patterned graphene portion from exposure to air or photoresist residue. 9. The method of claim 7, wherein protecting the mask areas corresponding to the patterned graphene portion from contamination comprises using the temporary protective metal layer to provide thermal protection that protects the patterned graphene portion from exposure to high temperature treatments during one or more packaging and assembly processes. 10. The method of claim 7, wherein the temporary protective metal layer is selected from gold, ruthenium, rhodium, palladium, silver, osmium, iridium, and platinum. 11. The method of claim 7, wherein depositing the temporary protective metal layer is performed using one or more depositing techniques selected from coating techniques, focused ion beam, filament evaporation, sputter deposition, and electrolysis. 12. The method of claim 7, wherein a process step of removing the portions of the photoresist layer within the mask areas directly precedes a next process step, the next process step being the removing the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. 13. The method of claim 12, wherein the process step of removing the portions of the photoresist layer is performed using one or more solvents selected from acetone, isopropanol alcohol, and methyl isopropyl ketone. 14. The method of claim 7, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet. 15. The method of claim 7, further comprising washing an exposed surface of the patterned graphene portion with deionized water after the packaging and the assembly of the graphene-based device to remove any materials left on the exposed surface of the patterned graphene portion. 16. An apparatus comprising: a graphene-based device for a biosensor application comprising a patterned graphene portion protected from contamination or damage during packaging and assembly of the graphene-based device by a temporary protective metal layer that is removed from the patterned graphene portion after the packaging and the assembly of the graphene-based device, wherein the graphene-based device is manufactured according to the following process steps:placing a graphene sheet on a wafer;depositing the temporary protective metal layer on the graphene sheet;depositing a photoresist layer on the temporary protective metal layer;exposing portions of the photoresist layer to a radiation source in accordance with a pattern comprising etching areas and mask areas;etching away the exposed portions of the photoresist layer to expose portions of the temporary protective metal layer within the etching areas of the pattern;etching away the exposed portions of the temporary protective metal layer to expose portions of the graphene sheet within the etching areas of the pattern;patterning portions of the graphene sheet by etching away the exposed portions of the graphene sheet at areas within the etching areas of the pattern;packaging and assembling the graphene-based device while portions of the temporary protective metal layer within the mask areas of the pattern remain to protect the patterned graphene portion of the graphene-based device;after the packaging and the assembling of the graphene-based device, exposing the mask areas of the patterned graphene portion of the graphene-based device for use in the biosensor application, wherein exposing the mask areas of the patterned graphene portion comprisesremoving the portions of the temporary protective metal layer within the mask areas that protected the patterned graphene portion during the packaging and assembly. 17. The apparatus of claim 16, further comprising one or more bottom electrodes spaced apart and disposed directly under the patterned graphene portion, the one or more bottom electrodes comprising a platinum coating on the wafer. 18. The apparatus of claim 16, wherein the graphene-based device is manufactured according to a further process step of removing the portions of the photoresist layer within the mask areas wherein the further process step directly precedes a next process step, the next process step being the process step of removing the portions of the temporary protective metal layer within mask areas that protected the patterned graphene portion during the packaging and assembly. 19. The apparatus of claim 16, wherein removing the portions of the temporary protective metal layer within the mask areas after the packaging and the assembly of the graphene-based device comprises washing the temporary protective metal layer with a potassium iodide solution until the temporary protective metal layer is no longer coated on a surface of the graphene sheet.
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