Laser machining method adjusting focus shift depending on type and level of contamination of external optical system before laser machining
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B23K-026/70
B23K-026/06
B23K-026/046
B23K-026/066
B23K-026/064
G01J-001/42
출원번호
16104271
(2018-08-17)
등록번호
10946484
(2021-03-16)
우선권정보
JP-JP2017-160490 (2017-08-23)
발명자
/ 주소
Izumi, Takashi
출원인 / 주소
Fanuc Corporation
대리인 / 주소
RatnerPrestia
인용정보
피인용 횟수 :
0인용 특허 :
0
초록▼
A laser machining method includes, before laser machining: calculating the amount of focus movement on the basis of a first measurement value measured with the external optical system warmed up and being the amount of energy of a laser beam passing through a small-diameter hole and a first reference
A laser machining method includes, before laser machining: calculating the amount of focus movement on the basis of a first measurement value measured with the external optical system warmed up and being the amount of energy of a laser beam passing through a small-diameter hole and a first reference value (database D1) predetermined depending on the type of contamination of the external optical system in relation to the first measurement value; and compensating the focus position in laser machining on the basis of the calculated amount of focus movement.
대표청구항▼
1. A laser machining method executed by a laser machining device configured to perform laser machining to a workpiece after measuring an amount of focus movement due to contamination of an optical system to compensate a focus position, the laser machining method comprising, before laser machining: (
1. A laser machining method executed by a laser machining device configured to perform laser machining to a workpiece after measuring an amount of focus movement due to contamination of an optical system to compensate a focus position, the laser machining method comprising, before laser machining: (a) issuing a command to emit a laser beam with a high power to the extent used for laser machining, toward a laser beam elimination part capable of eliminating the laser beam in order to warm up an external optical system configured to guide a laser beam from a laser oscillator to concentrate the laser beam on a surface of a workpiece;(b) after the external optical system is warmed up, issuing a command to adjust a focus position on a surface of a plate disposed in a position different from a position of the laser beam elimination part and having a small-diameter hole and a command to align an optical axis of the laser beam with a center of the small-diameter hole;(c) in a state where the external optical system is warmed up, issuing a command to emit a laser beam with a low power to the extent that the plate is not melted or deformed;(d) in a state where the external optical system is warmed up, measuring an amount of energy of the laser beam passing through the small-diameter hole as a first measurement value;(e) calculating an amount of focus movement on a basis of the first measurement value measured in a state where the external optical system is warmed up and a first reference value predetermined depending on a type of contamination of the external optical system in relation to the first measurement value; and(f) compensating a focus position in laser machining on a basis of the calculated amount of focus movement. 2. The laser machining method of claim 1, further comprising: (m) before the external optical system is warmed up, issuing a command to adjust a focus position on the surface of the plate having the small-diameter hole and a command to align an optical axis of a laser beam with the center of the small-diameter hole;(n) before the external optical system is warmed up, issuing a command to emit a laser beam with a low power to the extent that the plate is not melted or deformed;(o) in a state where the external optical system is not warmed up, measuring an amount of energy of the laser beam passing through the small-diameter hole as a second measurement value; and(p) determining contamination of a window in the external optical system on a basis of the second measurement value measured in a state where the external optical system is not warmed up and a second reference value predetermined depending on a type of contamination of the external optical system. 3. The laser machining method of claim 1, further comprising (q) after the focus position is compensated, determining whether a compensation amount is correct by repeating step (a) of warming up the external optical system to step (f) of compensating the focus position. 4. The laser machining method of claim 3, further comprising (r), in a case where the compensation amount is not correct after step (q) of repeating, increasing a power condition in laser machining. 5. A laser machining method executed by a laser machining device configured to perform laser machining on a workpiece after measuring an amount of focus movement due to contamination of an optical system to compensate a focus position, the laser machining method comprising, before laser machining: (a) issuing a command to emit a laser beam with a high power to the extent used for laser machining toward a laser beam elimination part capable of eliminating the laser beam in order to warm up an external optical system configured to guide a laser beam from a laser oscillator to concentrate the laser beam on a surface of a workpiece;(b) after the external optical system is warmed up, issuing a command to adjust a focus position on a surface of a plate disposed in a position different from a position of the laser beam elimination part and having a small-diameter hole and a command to align an optical axis of the laser beam with a center of the small-diameter hole;(c) in a state where the external optical system is warmed up, issuing a command to emit a laser beam with a low power to the extent that the plate is not melted or deformed;(d) in a state where the external optical system is warmed up, measuring an amount of energy of the laser beam passing through the small-diameter hole as a first measurement value;(g) issuing a command to move the focus position to an upward position and a downward position from the surface of the plate;(h) issuing a command to emit a laser beam with the low power in a state where the focus position is adjusted to each of the upward position and the downward position;(i) measuring an amount of energy of the laser beam passing through the small-diameter hole as a third measurement value in a state where the focus position is adjusted to each of the upward position and the downward position;(j) generating a graph including the first measurement value measured in a state where the focus position is adjusted on the surface of the plate, and the third measurement value measured in a state where the focus position is adjusted to each of the upward position and the downward position from the surface of the plate, the graph being based on a type and level of contamination of the external optical system;(k) calculating a focus position from the graph and calculating an amount of focus movement on a basis of a difference between the calculated focus position and the focus position commanded to adjust on the surface of the plate; and(f) compensating a focus position in laser machining on a basis of the calculated amount of focus movement. 6. A laser machining method executed by a laser machining device configured to perform laser machining to a workpiece after measuring an amount of focus movement due to contamination of an optical system to compensate a focus position, the laser machining method comprising, before laser machining: (a) issuing a command to emit a laser beam with a high power to the extent used for laser machining toward a laser beam elimination part capable of eliminating the laser beam in order to warm up an external optical system configured to guide a laser beam from a laser oscillator to concentrate the laser beam on a surface of a workpiece;(b) after the external optical system is warmed up, issuing a command to adjust a focus position on a surface of a plate disposed in a position different from a position of the laser beam elimination part, having a small-diameter hole, and capable of absorbing a laser beam, and a command to align an optical axis of the laser beam with a center of the small-diameter hole;(c) in a state where the external optical system is warmed up, issuing a command to emit a laser beam with a low power to the extent that the plate is not melted or deformed;(d) in a state where the external optical system is warmed up, measuring an amount of energy of the laser beam passing through the small-diameter hole as a first measurement value;(s) in a state where the external optical system is warmed up, measuring an amount of energy of the laser beam absorbed by the plate as a second measurement value;(t) determining whether the external optical system is contaminated by comparing the first measurement value being the amount of energy of the laser beam passing through the small-diameter hole with a first reference value predetermined depending on a type of contamination of the external optical system;(u) determining contamination of only a window in the external optical system by comparing the second measurement value being the amount of energy of the laser beam absorbed by the plate with a second reference value predetermined depending on the type of contamination of the external optical system;(v) determining contamination of only a lens in the external optical system by comparing the first measurement value being the amount of energy of the laser beam passing through the small-diameter hole with a third reference value predetermined depending on the type of contamination of the external optical system and less than the first reference value;(w) in a case where only the lens in the external optical system is contaminated, calculating an amount of focus movement on a basis of the second measurement value being the amount of energy of the laser beam absorbed by the plate, a fourth reference value predetermined depending on a contamination level of the external optical system, and an amount of focus movement predetermined depending on the fourth reference value; and(f) compensating a focus position in laser machining on a basis of the calculated amount of focus movement.
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