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A flip-chip bonding device (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the s

A flip-chip bonding device (100) is provided with: a bonding tool (10) that includes a base (11), and an island (13) that vacuum-sucks, to a surface (14) thereof, a semiconductor die (70) having protruding electrodes (72, 73) that are disposed on both the surfaces; and a heater (20) that heats the semiconductor die (70) vacuum-sucked to the island (13). The flip-chip bonding device heats the semiconductor die (70), bonds the protruding electrode (73) of the semiconductor die (70) to a protruding electrode (82) of a semiconductor die (80), and seals, using a non-conductive film (NCF) (75), a gap between the semiconductor die (70) and the semiconductor die (80). A plurality of continuously vacuum-sucking holes (15) are provided in the base (11), said continuously vacuum-sucking holes being at positions adjacent to the outer peripheral surface of the island (13). Consequently, in this electronic component mounting device that seals between the semiconductor dice using the resin, contamination of the bonding tool is suppressed.

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