초록 ▼

1. 1단계 개발목표
O 접속 공정 시 bump pitch 간 초극 미세 실장 기술 개발
$\bullet$ COG - area array: 50 ${\mu}m$ pitch
- peripheral type: 25 ${\mu}m$ pitch
$\bullet$ COP - peripheral type: 30 ${\mu}m$ pitch 이하
O Bump height deviation: $\pm$ 4

1. 1단계 개발목표
O 접속 공정 시 bump pitch 간 초극 미세 실장 기술 개발
$\bullet$ COG - area array: 50 ${\mu}m$ pitch
- peripheral type: 25 ${\mu}m$ pitch
$\bullet$ COP - peripheral type: 30 ${\mu}m$ pitch 이하
O Bump height deviation: $\pm$ 4% 이하의 균일성 확보
O 패널의 품질에 영향을 미치지 않는 저온 공정 기술개발
$\bullet$ COG: $150^{\circ}C$ 이하
$\bullet$ COP: $120^{\circ}C$ 이하
O 저 저항 접속기술
$\bullet$ COG: 80 $m\Omega/bump$ 이하
$\bullet$ COP: 400 $m\Omega/bump$ 이하
O 패널에 적용하기 위한 신뢰성 확보
$\bullet$ 신뢰성 테스트
1st: high temp storage test ($85^{\circ}C$, 160 hr)
2nd: thermal cycling test ($-40^{\circ}C/85^{\circ}C$, 20 cycle)
3rd: temperature & humidity test ($50^{\circ}C$, 90%, 160 hr)
$\bullet$ 신뢰성 테스트 후 접속저항
- COG: 200 $m\Omega/bump$ 이하
- COP: 500 $m\Omega/bump$ 이하

Abstract ▼

With the continual miniaturization of electronic components and their increasing functionality, the electronics industry has required high speed and excellent performance along with I/O count, and the demand for the various electronic devices has remarkably increased in recent year. Several packages

With the continual miniaturization of electronic components and their increasing functionality, the electronics industry has required high speed and excellent performance along with I/O count, and the demand for the various electronic devices has remarkably increased in recent year. Several packages in specialized assembly such as heat and pressure sensitive electronic components need an alternative manufacturing process. The chip on glass(COG) technique using the ACF is widely used for the low temperature packaging applications, especially for LCD driver IC packaging. However, the COG bonding using the ACF has the disadvantages of poor electrical performance and high bonding pressure. Various interconnecting methods are suggested as an alternative technique. The flip chip technology using low temperature curable NCA can be applied to the package of the temperature sensitive devices such as the LCD`s panel, and the image sensor module of digital cameras. Also, non-conductive adhesive (NCA) is very suitable for fine pitch interconnection of I/O pad, because it does not contain conductive particles. The electrical interconnection between the bump and pad is enabled by the compressive stress created as the adhesive cures and shrinks. NCA process realizes the direct electrical contact and thereby increases the contact area. We developed a reliable and ultra-fine pitch COG bonding technique using Sn/Cu bumps and NCA. Bumps used in this experiment were Sn/Cu double layer bumps which consisted of Sn half-dome formed on Cu columns. Sn/Cu bumps were formed by electroplating and reflowed to form the half-dome shaped Sn bumps. COG bonding was performed between thereflowed Sn/Cu bumps on the oxidized Si wafer and ITO/Au/Cu/Ti/ glass substrate using a thermo-compression bonder. Three types of NCAs were applied during bonding NCA-C contained silica fillers and NCA-B contained fluoropolymer fillers and NCA-A contained no fillers. Bonding temperature was $150^{\circ}C$ for NCA-B and NCA-C, while bonding temperature was $110^{\circ}C$ for NCA-A. The electrical properties of COG joints were evaluated by measuring the contact resistance of each joint through four-point probe method. All joints were successfully bonded and the electrical measurements showed that the average contact resistance of each joint was 29.2 $m\Omega$ for NCA-A, 30.4 $m\Omega$ for NCA-B, 31.1 $m\Omega$ for NCA-C.

목차 Contents

• 표지...1
• 제출문...2
• 보고서 초록...3
• 요약문...6
• SUMMARY...10
• CONTENTS...12
• 목차...13
• 제 1 장 연구 개발과제의 개요...14
• 제 1 절 연구개발의 과학기술, 사회경제적 중요성...14
• 제 2 장 국내외 기술개발 현황...18
• 제 1 절 국내외 연구개발 동향...18
• 제 2 절 현기술상태의 취약성...20
• 제 3 절 연구개발의 목표 및 내용...20
• 제 3 장 연구개발 수행 내용 및 결과...22
• 제 1 절 이론적 배경...22
• 1. 플립 칩 (Flip Chip) 접합 기술...22
• 2. COG (Chip-on-Glass) 접합 방식...25
• 3. 비전도성 접착제(Non Conductive Adhesive; NCA)를 이용한 접합 기술...27
• 4. 본 연구의 추진 전략...30
• 제 2 절 실험 방법...35
• 1. 접합하중 패드종류에 따른 영향 및 Sn 범프 형태와 NVA종류에 따른 NCA trap의 영향...35
• 2. 극 미세피치 COG 접합...51
• 3. 극 미세피치 COP 접합...63
• 제 3 절 연구 내용...65
• 1. Sn 범프 형태와 NCA의 종류에 따른 특성 분석...65
• 2. 접합하중과 패드 종류에 따른 영향 분석...77
• 3. 리플로 Sn 범프와 NCA를 사용한 극 미세피치 COG 접합...81
• 4. 리플로 Sn/Cu 범프와 NCA를 사용한 극 미세피치 COG 접합의 신뢰성...101
• 5. Sn/Cu 범프와 NCA를 사용한 극 미세피치 COP 접합...117
• 6. 전기도금법을 이용한 COG/COP 접속을 위한 미세 범프 형성기술...122
• 제 4 절 연구 결과...187
• 제 4 장 목표달성도...191
• 제 5 장 참고문헌...193
• 제 6 장 연구개발 활용계획서...195