Ta(TaC) 필라멘트를 이용한 HF-CVD 법에 의하여 $Si_3N_4$, SiC, WC, $Al_2O_3$를 기판으로 다이아몬드 박막을 증착하고, 그 밀착특성을 평가하였다. 로내의 $CH_4$농도를 10%로 높게 하였을 경우에는 막중에 graphitic(amorphous) carbon이 생성됨을 확인할 수 있었다. 박막을 $12\mu\textrm{m}$ 정도까지 두껍게 하면, WC기판에서는 부분적 박리형상이 관찰되었으나, $Si_3N_4$를 기판으로 하였을 경우에는 안정한 박막을 얻을 수 있었다. Indentation test 결과로부터 grainding에 의한 기판표 처리가 밀착성 향상에 효과적이라는 것을 알 수 있었다. 또 compression topple test에서는 박막의 두께는 밀착성과 반비례의 관계를 가지는 것을 알 수 있었다. 수 있었다.
Ta(TaC) 필라멘트를 이용한 HF-CVD 법에 의하여 $Si_3N_4$, SiC, WC, $Al_2O_3$를 기판으로 다이아몬드 박막을 증착하고, 그 밀착특성을 평가하였다. 로내의 $CH_4$농도를 10%로 높게 하였을 경우에는 막중에 graphitic(amorphous) carbon이 생성됨을 확인할 수 있었다. 박막을 $12\mu\textrm{m}$ 정도까지 두껍게 하면, WC기판에서는 부분적 박리형상이 관찰되었으나, $Si_3N_4$를 기판으로 하였을 경우에는 안정한 박막을 얻을 수 있었다. Indentation test 결과로부터 grainding에 의한 기판표 처리가 밀착성 향상에 효과적이라는 것을 알 수 있었다. 또 compression topple test에서는 박막의 두께는 밀착성과 반비례의 관계를 가지는 것을 알 수 있었다. 수 있었다.
Diamond thin films were deposited on $Si_3N_4$, SiC, TiC and $Al_2O_3$, substrates by the CVD method using Ta(TaC)Filament, and the appearance of the diamond films and their adhesion properties were examined by SEM, optical microscopy, indentation test and compression topple te...
Diamond thin films were deposited on $Si_3N_4$, SiC, TiC and $Al_2O_3$, substrates by the CVD method using Ta(TaC)Filament, and the appearance of the diamond films and their adhesion properties were examined by SEM, optical microscopy, indentation test and compression topple test. Diamond films were deposited at lower $CH_4$ concentration than 5%$CH_4$ for all kinds of the substrate material, but graphitic(amorphous)carbon was observed at 10%$CH_4$. The diamond film of about $12\mu\textrm{m}$ thickness on WC substrate partly peeled off, but the film on $Si_3N_4$ substrate held good adhesion. The indentation test showed that roughly ground surface was very effective for adhesion of diamond films to substrate. The topple test revealed that film thickness was an important factor governing the adhesion of the diamond film.
Diamond thin films were deposited on $Si_3N_4$, SiC, TiC and $Al_2O_3$, substrates by the CVD method using Ta(TaC)Filament, and the appearance of the diamond films and their adhesion properties were examined by SEM, optical microscopy, indentation test and compression topple test. Diamond films were deposited at lower $CH_4$ concentration than 5%$CH_4$ for all kinds of the substrate material, but graphitic(amorphous)carbon was observed at 10%$CH_4$. The diamond film of about $12\mu\textrm{m}$ thickness on WC substrate partly peeled off, but the film on $Si_3N_4$ substrate held good adhesion. The indentation test showed that roughly ground surface was very effective for adhesion of diamond films to substrate. The topple test revealed that film thickness was an important factor governing the adhesion of the diamond film.
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문제 정의
The authors thank Mr. T. Tsutsumoto of the Hiroshi-ma Prefectural Joint Research Center for Advanced Technology for help with the compression topple test.
가설 설정
2) The diamond thin film deposited on ceramic sub-strate tended to flake during cooling after deposition due to thermal stress. Films on TiC and Al2O3 sub-strates flaked much more easily than those on WC, and the film on SiN did not flak at all, even up to 12μm thickness.
4) The applied load for separation of films during the compression topple tests decreases with increasing film thickness.
5) Thermal stress, surface roughness of substrates and film thickness are of great importance to have good adhesion of the diamond film deposited on ceramic sub-strate.
대상 데이터
In this study, optimum conditions for diamond film deposition by the hot filament CVD using Ta (TaC) were obtained for various ceramic substrate materials. Then, the appearances of diamond films deposited on the ceramic substrates were examined.
The other parameters were fixed at constant as seen in Table 1. The ceramic substrates used were SiaNj, SiC, WC, TiC and ALO, The substrate surface was pre-pared by either grinding with a diamond wheel, or pol-ishing with diamond powders.
이론/모형
The residual stresses in the films were measured by means of an X-ray method. The stress in the films with 5μm thickness deposited on WC substrate was found to be about -0.
성능/효과
1) The morphology of the diamond thin films on Si3N4, SiC, WC, TiC and Al2O3 are slightly different, but they commonly show well facetted grains which present a characteristic of diamond synthesized by the CVD process.
3) The indentation test showed surface roughness caused by grinding was very effective for good adhesion of diamond thin film to substrate.
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