초록

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Abstract ▼ AI-Helper

The cure behavior of commercial epoxy molding compounds (EMC) commonly used for IC package was studied at constant cure temperatures as well as at constant heating rates using differential scanning calorimetry (DSC), rheometer, and dielectric analyzer (DEA). The cure kinetics were obtained using aut...

The cure behavior of commercial epoxy molding compounds (EMC) commonly used for IC package was studied at constant cure temperatures as well as at constant heating rates using differential scanning calorimetry (DSC), rheometer, and dielectric analyzer (DEA). The cure kinetics were obtained using autocatalytic reaction model according to the Ryan Dutta method after assuming m+n equal to 2. The prediction of reaction rates by the model equation corresponded well to experimental data at all temperatures except for 10$0^{\circ}C$. The phase transitions such as gelation and vitrification occurred during network formation. At each isothermal cure temperature, $T_{g}$ was measured in accordance with cure time, and the vitrification point was attained when $T_{g}$ was equal to $T_{cure}$. The temperature dependence of gel points and vitrification points showed good agreement with Arrhenius relation. DEA using parallel plate electrode was effective for the monitoring of EMC cure. we knew that if the resin systems are materials of comparable quality, $_{gel}$$T_{g}$ is constant regardless of accelerator concentration in TTT (Time-Temperature-Transformation) diagram.

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