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NTIS 바로가기한국정밀공학회지 = Journal of the Korean Society for Precision Engineering, v.20 no.5 = no.146, 2003년, pp.29 - 38
김형재 (부산대학교 정밀기계공학과) , 정해도 (부산대학교 정밀정형 및 금형가공 연구소) , 이응숙 (한국기계연구원) , 신영재 (한국기계연구원)
As the design rules in semiconductor manufacturing process become more and more stringent, the higher degree of planarization of device surface is required for a following lithography process. Also, it is great challenge for chemical mechanical polishing to achieve global planarization of 12” wafer ...
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