Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantage...
Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.
Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.
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제안 방법
To improve fluidity and minimize the reduction of thermal conductivity of the EMC, fused silica can be considered as a small size filler because it has low porosity and spherical shape. In this study, to improve the fluidity of an AIN filled EMC, 2 jUm fused silica was used as a small size filler in a binary mixture of fillers. Properties such as the spiral flow, thermal conductivity, CTE, flexural strength, elastic modulus, and dielectric properties of EMC were evaluated as a function of the volume fraction of small size silica in the binary mixture of fillers.
Filler: Even though AIN filler leads to improvements in terms of thermal conductivity, thermal expansion and mechanical properties of EMC, it can also cause reduction of the moldability and the flowability. This study tried to suggest the proper combination of fillers considering fluidity, thermal conductivity, thermal expansion, and dielectric characteristics of the resulting EMCs. The mean particle size of an AIN (granule type) filler was 23 μm (ART Co.
대상 데이터
, DMA 7e) was used to measure the flexural strength and elastic modulus of cured EMC. The sample size was 20 X 5 X 3 mm. Stress-strain property was measured using a 3-point bending apparatus with a static force scan mode (0.
이론/모형
The measurement of thermal diffusivity (5) was carried out by a laser flash method (Sinku-Riko Co. Model TC-7000) at room temperature. The specific heat (C) was measured by a DSC (Perkin-Elmer Co, Pyris I).
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