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NTIS 바로가기大韓機械學會論文集. Transactions of the Korean Society of Mechanical Engineers. A. A, v.28 no.6 = no.225, 2004년, pp.677 - 684
이성철 (포항공과대학교 대학원) , 현충민 (포항공과대학교 대학) , 이형만 (광부품연구센터, 전자부품연구) , 김명진 (광부품연구센터, 전자부품연구) , 김회경 (광부품연구센터, 전자부품연구) , 김기태 (포항공과대학교 기계공학과)
Plastic and creep deformations of solder joints during thermal cycling are the main factors of misalignments and power losses in optical telecommunication components. Furthermore, the increased mismatch between solder Joint-bonded areas may cause severe failure in the components. Darveaux's creep mo...
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Pang, J. H. L., Seetoh, C. W. and Wang, Z. P., 2000, 'CBGA solder joint reliability evaluation based on elastic plastic creep analysis,' ASME J. Electron. Packag., September
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ABAQUS User Mannual, Ver. 6.2, 2001, Hibbitt, Karlsson and Sorensen
Bellcore, 1999, 'GR-1221-CORE, Generic Reliability Assurance Requirements for Passive Optical Components,' Bellcore, Issue 2
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