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NTIS 바로가기한국공작기계학회논문집 = Transactions of the Korean society of machine tool engineers, v.17 no.1, 2008년, pp.137 - 143
김성걸 (서울산업대학교 기계설계자동화공학부) , 김주영 (서울산업대학교 에너지 환경 대학원 나노 아이티 공학과)
Thermal fatigue life prediction for solder joints becomes the most critical issue in present microelectronic packaging industry. And lead-free solder is quickly becoming a reality in electronic manufacturing fields. This trend requires life prediction models for new solder alloy systems. This paper ...
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