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大韓機械學會論文集. Transactions of the Korean Society of Mechanical Engineers. A. A, v.28 no.12 = no.231, 2004년, pp.1856 - 1863
김일호 (한국과학기술원(KAIST)기계공학과) , 박태상 (한국과학기술원(KAIST)기계공학과) , 이순복 (한국과학기술원(KAIST)기계공학과)
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In the last 50 years, lead-contained solder materials have been the most popular interconnect materials used in the electronics industry. Recently, lead-free solders are about to replace lead-contained solders for preventing environmental pollutions. However, the reliability of lead-free solders is ...
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IPC, 2000, A Guide for Assembly of Lead-Free Electronics Draft IV, IPC, Northbrook, pp. 1-21, www.ipc.org
Soldertec, 2003, Second European Lead-Free Soldering Technology Roadrnap, Soldertec, Uxbridge, pp. 1-24, www.lead-free.org.
Schubert, A., Dudek, R, Walter, R., Jung, E., GoIlhardt, A., Michel, B. and Reichl, H., 2002, 'Reliability Assessment of Flip-Chip Assemblies with Lead-free Solder Joints,' 2002 ECTC (2002 Electronic Components and Technology Conference), pp.1246-1255
Lee, S.W., Hoi, B., Lui, W. and Kong, Y.H., 2002, 'Assessment of Board Level Solder Joint Reliability PBGA Assemblies with Lead-Free Solders,' Soldering and Surface Mount Technology, Vol. 14, No.3, pp. 46-50
Syed, A., 2001, 'Reliability and Au Embrittlement of LeadFree Solders for BGA Applications,' 2001 International Symposium on Advanced Packaging Materials, pp 143-147
Tummala, R. R., Rymaszewski, E. J. and Klopfenstein, A. G., 1997, Microselectronics Packaging Handbook part I 2nd edtition, Chapman&Hall, New York, pp. 469-471
Hong, B. Z., 1998, 'Thermal Fatigue Analysis of a CBGA Package with Lead-free Solder Fillets,' Inter Society Conference on Thermal Phenomena, pp. 205-211
Lau, J., Dauksher, W. and Vianco, P., 2003, 'Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders and Joints,' 2003 ECTC (2003 Electronic Components and Technology Conference), pp. 229-236
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