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NTIS 바로가기전기학회논문지. The Transactions of the Korean Institute of Electrical Engineers. P, v.57 no.4, 2008년, pp.408 - 411
정순원 (ETRI 융합부품.소재연구부문) , 구경완 (호서대학교 국방과학기술학과)
As to this research is new structure of the semiconductor substrate heating apparatus. The fast thermoresponsive according to the direct heating structure of the heating plate layer adhering closely to the floor side of a substrate and the fast heat loss minimization can be accomplished. Moreover, t...
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