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A Composite of Metal and Polymer Films: Thin Nickel Film Coated on a Polypropylene Film after Atmospheric Plasma Induced Surface Modification 원문보기

Transactions on electrical and electronic materials, v.12 no.3, 2011년, pp.110 - 114  

Song, Ho-Shik (Department of Physics, Yonsei University) ,  Choi, Jin-Moon (University College, Yonsei University) ,  Kim, Tae-Wan (Department of Physics, Hongik University)

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Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good ...

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제안 방법

  • In this research, the surfaces of films of PP, which is not easily etched by chemical agents due to its high resistance to chemical solvents, bases, and acids and has good mechanical strength, were modified by the environmentally friendly process of atmospheric DBDs in air at room temperature for electroless plating. The modified surfaces kept their state for a long time; within the scope of this study, they maintained their surface properties for 20 days.
  • The cross-sectional images were taken by SEM to see how well the plating is fused into the surface of PP film. The adhesion strength of the metallic films on the PP films was examined by the thermal shock test and the cross-cutting and peel test. We have found a method to produce a composite material of nickel (Ni) and PP films with high quality.
  • The adhesion strength tests showed such strong supportive results that the method developed in this study to make a composite of metal and polymer films can be applied to the FPCB industry.
  • This can be processed in air at atmospheric pressure with dielectric barrier discharges (DBDs). The morphological changes of the samples were observed using scanning electron microscope (SEM) and the wettability of the sample surface was deduced from the static contact angle measurement to understand the adhesion mechanism of the coated metallic film on PP film, before and after plasma treatment. The cross-sectional images were taken by SEM to see how well the plating is fused into the surface of PP film.
  • (2) The cross-cutting and peel tests with 3M tape (3M 810D standard) [9] were done on the plated surfaces. The peel test was done after cutting lines approximately 1 mm apart with a sharp cutting tool on the metallic side of the plated sample and other cutting lines at the same spacing but perpendicular to the former were made.
  • Thus in this study, the continuous processing time and the idle time were determined by preliminary experiments to ensure only the surface of PP film is modified physically and/or chemically. Then, the controller was programmed to generate plasma on the PP film surfaces with the total plasma treatment times, 10 seconds, 20 seconds, 30 seconds, 60 seconds, 90 seconds, and 120 seconds (we as denote 10 s, 20 s, 30 s, 60 s, 90 s, and 120 s, respectively).
  • In conclusion, we have shown that the Ni films coated by electroless plating on the surfaces of PP films treated with atmospheric DBDs in air at room temperature had high adhesion strength. This study developed a process to fabricate a composite of metal and polymer films. The process is environmentally friendly and can be applied to the FPCB industry.
  • Plasma treatment of the polymer over a long successive period could result in physically and chemically irrecoverable damage to the polymer. Thus in this study, the continuous processing time and the idle time were determined by preliminary experiments to ensure only the surface of PP film is modified physically and/or chemically. Then, the controller was programmed to generate plasma on the PP film surfaces with the total plasma treatment times, 10 seconds, 20 seconds, 30 seconds, 60 seconds, 90 seconds, and 120 seconds (we as denote 10 s, 20 s, 30 s, 60 s, 90 s, and 120 s, respectively).
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참고문헌 (9)

  1. D. R. J. White and M. Mardiguian, Electromagnetic Shielding (Interference Control Technologies, Gainesville, 1988) chap.12-13. 

  2. S. Celozzi, R. Araneo, and G. Lovat, Electromagnetic Shielding (Wiley-Intersciences, Hoboken, 2008) p. 30-37. 

  3. C. D. Craver and C. E. Carraher, Applied Polymer Science: 21st Century (Elsevier, Amsterdam, 2000) p. 659-676. 

  4. P. Bahadur and N. V. Sastry, Principles of Polymer Science, 2nd ed. (Alpha Science International, Oxford, 2005) p. 61-81. 

  5. G. O. Mallory and J. B. Hajdu, Electroless Plating: Fundamentals and Applications (American Electroplaters and Surface Finishers Society, Orlando, 1990) p. 377-399. 

  6. N. V. Mandich and G. A. Krulik, Trans. Inst. Met. Finish. 70, 111 (1992). 

  7. D. H. Kang, J. C. Choi, J. M. Choi, and T. W. Kim, Trans. Electr. Electron. Mater. 11, 174 (2010) [DOI: 10.4313/TEEM.2010.11.4.174]. 

  8. R. Hippler, Low Temperature Plasma Physics: Fundamental Aspects and Applications (Wiley-VCH, Berlin, 2001) p. 331-335. 

  9. L. A. C. Teixeira and M. C. Santini, J. Mater. Process. Technol. 170, 37 (2005) [DOI: 10.1016/j.jmatprotec.2005.04.075]. 

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