Eom, Yong-Sung
(Convergence Components and Materials Research Laboratory, ETRI)
,
Choi, Kwang-Seong
(Convergence Components and Materials Research Laboratory, ETRI)
,
Moon, Seok-Hwan
(Convergence Components and Materials Research Laboratory, ETRI)
,
Park, Jun-Hee
(LED Pack Co.)
,
Lee, Jong-Hyun
(Department of Materials Science & Engineering, Seoul National University of Technology)
,
Moon, Jong-Tae
(Convergence Components and Materials Research Laboratory, ETRI)
As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using a...
As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.
As an isotropic conductive adhesive, that is, a hybrid Cu paste composed of Cu powder, solder powder, and a fluxing resin system, has been quantitatively characterized. The mechanism of an electrical connection based on a novel concept of electrical conduction is experimentally characterized using an analysis of a differential scanning calorimeter and scanning electron microscope energy-dispersive X-ray spectroscopy. The oxide on the metal surface is sufficiently removed with an increase in temperature, and intermetallic compounds between the Cu and melted solder are simultaneously generated, leading to an electrical connection. The reliability of the hybrid Cu paste is experimentally identified and compared with existing Ag paste. As an example of a practical application, the hybrid Cu paste is used for LED packaging, and its electrical and thermal performances are compared with the commercialized Ag paste. In the present research, it is proved that, except the optical function, the electrical and thermal performances are similar to pre-existing Ag paste. The hybrid Cu paste could be used as an isotropic conductive adhesive due to its low production cost.
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성능/효과
Before the reliability test, the electrical resistances were 42 mΩ for the commercial Ag paste and 41 mΩ for the hybrid Cu paste with the volumetric mixing ratio of 20% Cu, 25% solder, and 70% the fluxing resin. After 1 week (168 h), which means a reliability condition of JEDEC level 1, the electrical resistance of the commercial Ag paste and hybrid Cu paste were increased up to 45 mΩ (7%) and 46 mΩ (12%), respectively.
In conclusion, the hybrid Cu paste using a novel concept for a conductive mechanism may be widely used instead of the commercial Ag paste in the near future because its physical and economical competitiveness, with the exception of its optical performance, are almost compatible with existing Ag paste.
후속연구
6(a). However, a further in-depth study concerning the intermetallic compound will not be conducted because the accurate identification of the intermetallic composition is out of the scope of the present research.
참고문헌 (11)
H. Wolfson and G. Elliott, "Electrically Conducting Cements Containing Epoxy Resins and Silver," U.S. Patent 2774747, 1956.
D. Lu, Q.K. Tong, and C.P. Wong, "Conductivity Mechanisms of Isotropic Conductive Adhesives (ICAs)," IEEE Trans. Electron. Packag. Manuf., vol. 22, no. 3, 1999, pp. 223-227.
H. Jiang et al, "Ultra High Conductivity of Isotropic Conductive Adhesives," Electron. Compon. Technol. Conf., 2006, pp. 485-490.
Y.-S. Eom et al., "Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film," Microelectron. Eng., vol. 85, no. 2, 2008, pp. 327-331.
Y.-S. Eom et al., "Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder," Microelectron. Eng., vol. 85, no. 11, 2008, pp. 2202-2206.
Y.-S. Eom et al., "Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder," ETRI J., vol. 32, no. 3, June 2010, pp. 414-421.
J.-W. Baek et al., "Chemo-rheological Characteristic of a Selfassembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder," Microelectron. Eng., vol. 87, no. 10, 2010, pp. 1968-1972 .
K.-S. Jang et al., "Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing," J. Nanosci. Nanotechnol., vol. 9, no. 12, 2009, pp. 7461-7466.
K.-S. Choi et al., "Novel Maskless Bumping for 3D Integration," ETRI J., vol. 32, no. 2, Apr. 2010, pp. 342-344.
W.F. Gale and T.C. Totemeier, Smithells Metals Reference Book, 8th ed., Butterworth-Heinemann, vol. 1, 2004, p. 11.
H.-W. Miao and J.-G. Duh, "Microstructure Evolution in Sn-Bi and Sn-Bi-Cu Solder Joints under Thermal Aging," Materials Chemistry and Physics, vol. 71, no. 3, 2001, pp. 255-271.
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