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참고문헌 (14)

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2. Grujicic, M., Zhao, C. L., and Dusel, E. C., "The effect of thermal contact resistance on heat management in the electronic packaging," Applied Surface Science, Vol. 246, pp. 290-302, 2005. 

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3. Mahajan, R., "Thermal Interface Materials: A Brief Review of Design Characteristics and Materials," Electronics Cooling, Vol. 2, No. 1, 2004. 

4. Madhusudana, C. V., "Accuracy in thermal contact conductance experiments -The effects of heat loss to the surroundings," International Communications in Heat and Mass Transfer, Vol. 27, No. 6, pp. 877-891, 2000. 

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5. Bahrami, M., Yovanovich, M. M., and Culham, J. R., "Thermal Joint Resistance of Conforming Rough Surfaces with Gas-filled Gaps," Journal of Thermophysics and Heat Transfer, Vol. 18, No. 3, pp. 318-325, 2004. 

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6. Sarvar, F., Whalley, D. C., and Conway, P. P., "Thermal Interface Materials - A Review of the State of the Art," 1st Electronics Systemintegration Technology Conference, Vol. 2, pp. 1292-1302, 2006. 

7. Savija, I., Culham, J. R., and Yovanovich, M. M., "Effective thermophysical properties of thermal interface materials: Part 1 definitions and models," proc. of International Electronic Packaging Technical Conference and Exhibition, Documet ID: IPACK2003-35088, 2003. 

8. Hanson, K., "ASTM D 5470 TIM Material Testing," IEEE 22nd Annual Semiconductor Thermal Measurement and Management Symposium, pp. 50- 53, 2006. 

9. Gwinn, J. P., Saini, M., and Webb, R. L., "Apparatus for Accurate Measurement of Interface Resistance of High Performance Thermal Interface Materials," The 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 644-650, 2002. 

10. Kearns, D., "Improving Accuracy and Flexibility of ASTM D 5470 for High Performance Thermal Interface Materials," 19th IEEE Semiconductor Thermal Measurement and Management Symposium, pp. 129-133, 2003. 

11. ASTM D5470-01, "Standard Test Method for Thermal Transmission Properties of Thin Thermally Conductive Solid Electrical Insulation Materials," 2001. 

12. Bahram, M., Yavanovich, M. M., and Culham, J. R., "Thermal contact resistance at low contact pressure: Effect of elastic deformation," International Journal of Heat and Mass Transfer, Vol. 48, No. 16, pp. 3284- 3293, 2005. 

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13. Kim, J. K., Nakayama, W., and Lee, S. K., "Characterization of a thermal interface material with heat spreader," J. Korean Soc. Precis. Eng., Vol. 26, No. 1, pp. 91-98, 2010. 

14. Kim, J. K., Nam, S.-K., Nakayama, W., and Lee, S. -K., "Compact Thermal Network Model of the Thermal Interface Material Measurement Apparatus With Multi-Dimensional Heat Flow," IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 1, No. 8, pp. 1186- 1194, 2011. 

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