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제안 방법
- In this study we examine and analyze electrochemical ion migration (ECM) according to the changing thickness of the NiCr alloy, which constitutes the seed layer of sputtered FCCL and is a necessary raw material in FPCB of 50 µm pitch and under.
- However, to check the reliability of electronic device parts, highly integrated circuits, which are loaded like smartphones, can be improper. In this study, ECM defects in microcircuits, a sample of a circuit pattern width for which reliability evaluation is possible. In contrast, the water drop test (using only distilled water) is dealt with in the IPC standard size.
- The water drop test was conducted to study ECM (Fig. 1). The environment consisted of 100% humidity of ion water and a voltage bias (1 V, 2 V, and 3 V).
- 05, this means that there is no significant influence by thickness but there is an influence from bias volts. To determine the effect that NiCr particles (which form residues in the area between the circuits) have on dendrite growth, the density difference of dendrites was checked by microscope and SEM.
대상 데이터
- The dendrites grew on the specimen relative to the thickness of the NiCr seed layer in the 3 V condition where growth occurred rapidly. The dendrites were analyzed using EDX (JSM7000F, JEOL).
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