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Abstract AI-Helper 아이콘AI-Helper

We design and analyze the n-channel junctionless fin-shaped field-effect transistor (JL FinFET) with 10-nm gate length and compare its performances with those of the conventional bulk-type fin-shaped FET (conventional bulk FinFET). A three-dimensional (3-D) device simulations were performed to optim...

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가설 설정

  • According to Figs. 7(a) and (b), increase of Hfin has little effect on the change in channel electron concentration at the off-state. Therefore, increasing Hfin is a better way to achieve the lower Ioff and S than controlling Wfin in the JL FinFET.
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참고문헌 (22)

  1. T. Skotnicki, J. A. Hutchby, T.-J. King, H.-S. P. Wong, and F. Boeuf, "The end of CMOS scaling: Toward the introduction of new materials and structural changes to improve MOSFET performance," IEEE Circuits Devices Mag., vol. 21, no. 1, pp. 16-26, Jan. 2005. 

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    As channel length scaling of the conventional metal-oxide-semiconductor field-effect transistors (MOSFETs) continues, they encounter several issues closely related with short-channel effects (SCEs) [1-4].

  2. C. Hu, "Device challenges and opportunities," in Proc. VLSI Symp. Technol., Jun. 2004, pp. 4-5. 

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    As channel length scaling of the conventional metal-oxide-semiconductor field-effect transistors (MOSFETs) continues, they encounter several issues closely related with short-channel effects (SCEs) [1-4].

  3. S. Borkar, "Circuit techniques for subthreshold leakage avoidance, control, and tolerance," in IEDM Tech. Dig., pp. 421-424, Dec. 2004. 

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    As channel length scaling of the conventional metal-oxide-semiconductor field-effect transistors (MOSFETs) continues, they encounter several issues closely related with short-channel effects (SCEs) [1-4].

  4. P. K Sahu, S. K. Mohapatra, and K. P. Pradhan, "A Study of SCEs and Analog FOMs in GS-DGMOSFET with Lateral Asymmetric Channel Doping," J. Semicond. Technol. Sci., vol. 13, no. 6, pp. 647-654, Dec. 2013. 

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    As channel length scaling of the conventional metal-oxide-semiconductor field-effect transistors (MOSFETs) continues, they encounter several issues closely related with short-channel effects (SCEs) [1-4].

  5. J.-P. Colinge, C.-W. Lee, A. Afzalian, N. D. Akhavan, R. Yan, I. Ferain, P. Razavi, B. O'Neill, A. Blake, M. White, A.-M. Kelleher, B. McCarthy, and R. Murphy, "Nanowire transistors without junctions," Nat. Nanotechnol., vol. 5, no. 3, pp. 225-229, Mar. 2010. 

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    Thus, the junctionless transistor (JLT) without counter-doped metallurgical junctions has been proposed [5-9].

  6. N. D. Akhavan, I. Ferain, P. Razavi, R. Yu, and J.-P. Colinge, "Improvement of carrier ballisticity in junctionless nanowire transistors," Appl. Phys. Lett., vol. 98, no. 10, pp. 103510-1-103510-3, Mar. 2011. 

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    Thus, the junctionless transistor (JLT) without counter-doped metallurgical junctions has been proposed [5-9].

  7. R. Rios, A. Cappellani, M. Armstrong, A. Budrevich, H. Gomez, R. Pai, N. Rahhal-orabi, and K. Kuhn, "Comparison of junctionless and conventional trigate transistors with Lg down to 26 nm," IEEE Electron Device Lett., vol. 32, no. 9, pp. 1170-1172, Sep. 2011. 

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    Thus, the junctionless transistor (JLT) without counter-doped metallurgical junctions has been proposed [5-9].

    Recently, a comparison study between fabricated JL FinFET and conventional bulk FinFET with Lg of 26 nm has already been performed [7].

  8. S. Gundapaneni, S. Ganguly, and A. Kottantharayil, "Bulk planar junctionless transistor (BPJLT): An attractive device alternative for scaling," IEEE Electron Device Lett., vol. 32, no. 3, pp. 261-263, Mar. 2011. 

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    Thus, the junctionless transistor (JLT) without counter-doped metallurgical junctions has been proposed [5-9].

  9. J. S. Lee, S. Cho, B.-G. Park, J. S. Harris, Jr, and I. M. Kang, "Small-Signal Modeling of Gate-All-Around (GAA) Junctionless (JL) MOSFETs for Sub-millimeter Wave Applications," J. Semicond. Technol. Sci., vol. 12, no. 2, pp. 230-239, Jun. 2012. 

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    Thus, the junctionless transistor (JLT) without counter-doped metallurgical junctions has been proposed [5-9].

  10. C.-H. Park, M.-D. Ko, K.-H. Kim, R.-H. Baek, C.-W. Sohn, C. K. Baek, S. Park, M. J. Deen, Y.-H. Jeong, and J.-S. Lee, "Electrical characteristics of 20-nm junctionless Si nanowire transistors," Solid-State Electron., vol. 73, no. 3, pp. 7-10, Jul. 2012. 

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    This novel feature lets us achieve simple process flow needed for ultra-shallow source/drain junctions and low thermal budgets usually causing incomplete dopant activation after gate stack formation is eliminated [10].

  11. D. Hisamoto, W.-C. Lee, J. Kedzierski, H. Takeuchi, K. Asano, C. Kuo, E. Anderson, T.-J. King, J. Bokor, and C. Hu, "FinFET-A selfaligned double-gate MOSFET scalable to 20 nm," IEEE Trans. Electron Devices, vol. 47, no. 12, pp. 2320-2325, Dec. 2000. 

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    In addition, it has higher gate controllability over the channel, which effectively suppresses SCEs and widens the channel width without loss in the foot print as we adopted the fin-shaped channel [11-15].

  12. Y. Omura, H. Konishi, and K. Yoshimoto, "Impact of Fin Aspect Ratio on Short-Channel Control and Drivability of Multiple-Gate SOI MOSFET's," J. Semicond. Technol. Sci., vol. 8, no. 4, pp. 302-310, Dec. 2008. 

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    In addition, it has higher gate controllability over the channel, which effectively suppresses SCEs and widens the channel width without loss in the foot print as we adopted the fin-shaped channel [11-15].

  13. I. J. Park, and C. Shin, "Monte Carlo Simulation Study: the effects of double-patterning versus single-patterning on the line-edge-roughness (LER) in FDSOI Tri-gate MOSFETs," J. Semicond. Technol. Sci., vol. 13, no. 5, pp. 511-515, Oct. 2013. 

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    In addition, it has higher gate controllability over the channel, which effectively suppresses SCEs and widens the channel width without loss in the foot print as we adopted the fin-shaped channel [11-15].

  14. F. Najam, S. Kim, and Y. S. Yu, "Gate All Around Metal Oxide Field Transistor: Surface Potential Calculation Method including Doping and Interface Trap Charge and the Effect of Interface Trap Charge on Subthreshold Slope," J. Semicond. Technol. Sci., vol. 13, no. 5, pp. 530-537, Oct. 2013. 

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    In addition, it has higher gate controllability over the channel, which effectively suppresses SCEs and widens the channel width without loss in the foot print as we adopted the fin-shaped channel [11-15].

  15. B. Lakshmi and R. Srinivasan, "Effect of gate electrode work function in conventional and junctionless FinFETs," Int. J. Phys. Sci., vol. 7, no. 49, pp. 6246-6254, Dec. 2012. 

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    In addition, it has higher gate controllability over the channel, which effectively suppresses SCEs and widens the channel width without loss in the foot print as we adopted the fin-shaped channel [11-15].

  16. SILVACO International, ATLAS User's Manual, Apr. 2012. 

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    A design optimization and device performances are presented through a three-dimensional (3-D) technology computer-aided design (TCAD) simulation tool [16].

    To increase the accuracy of simulation results, multiple models including concentration-dependent mobility model, field-dependent mobility model, gate current model, and structure-dependent (2-D and 3-D) mobility model have been included in the simulations [16].

  17. Process Integration, Devices, and Structures (PIDS) Chapter, International Technology Roadmap for Semiconductors (ITRS), 2012 edition. 

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    The drive voltage (VDD) of 0.65 V was applied to satisfy the low standby power (LSTP) requirements in the most recent technology roadmap [17].

  18. M. Schlosser, K. K. Bhuwalka, M. Sauter, T. Zilbauer, T. Sulima, and I. Eisele, "Fringing-Induced Drain Current Improvement in the Tunnel Field-Effect Transistor With High- ${\kappa}$ Gate Dielectrics," IEEE Trans. Electron Devices, vol. 56, no. 1, pp. 100-108, Jan. 2009. 

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    Vth was defined as the gate voltage (VGS) at drain current (ID) = 10-7 A/μm and it is widely known constant-current method for defining Vth in low-power devices [18].

  19. A. Nandi, A. K. Saxena, and S. Dasgupta, "Design and Analysis of Analog Performance of Dual-k Spacer Underlap N/P-FinFET at 12 nm Gate Length," IEEE Trans. Electron Devices, vol. 60, no. 5, pp. 1529-1535, May. 2013. 

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    The doping concentrations in the n+ source (Nsource)/p- channel (Nch)/n+ drain (Ndrain) were widely used 1.0×1020 cm-3, 1.0×1016 cm-3, and 1.0×1020 cm-3, in sequence [19].

  20. C.-W. Lee, I. Ferain, A. Afzalian, R. Yan, N. D. Akhavan, P. Razavi, and J.-P. Colinge, "Performance estimation of junctionless multigate transistors," Solid-State Electron., vol. 54, no. 2, pp. 97-103, Feb. 2010. 

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    Seeing that the DIBL of JL FinFET is much smaller than that of the conventional bulk FinFET, the SCEs are expected to be suppressed more effectively in the JL FinFET device [20].

  21. S. Cho, K. R. Kim, B.-G. Park, and I. M. Kang, "RF Performance and Small-Signal Parameter Extraction of Junctionless Silicon Nanowire MOSFETs," IEEE Trans. Electron Devices, vol. 58, no. 5, pp. 1388-1396, May. 2011. 

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    Cgs and Cgd are fixed by oxide and channel surface charges in these devices [21].

  22. Y. Tsividis, Operation and Modeling of the MOS Transistor, Oxford University Press, New York, USA, 1999, pp. 467-491, 500-504. 

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    (1) and (2) [22].

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