최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기한국산업보건학회지 = Journal of Korean Society of Occupational and Environmental Hygiene, v.25 no.1, 2015년, pp.36 - 44
최광민 (삼성전자 건강연구소) , 여진희 (삼성전자 건강연구소) , 정명구 (삼성전자 건강연구소) , 김관식 (삼성전자 보건관리팀) , 조수헌 (삼성전자 건강연구소)
Objectives: This study aimed to elucidate the physicochemical properties of silica powder and airborne particles as by-products generated from fabrication processes to reduce unknown risk factors in the semiconductor manufacturing work environment. Materials and Methods: Sampling was conducted at 20...
* AI 자동 식별 결과로 적합하지 않은 문장이 있을 수 있으니, 이용에 유의하시기 바랍니다.
Bhaskar R, Li J, Xu L. A comparative study of particle size dependency of IR and XRD methods for quartz analysis. Am Ind Hyg Assoc J 1989;55:605-609
Choi KM, Kim TH, Kim KS, Kim SG. Hazard identification of powder generated from a chemical vapor deposition process in the semiconductor manufacturing industry. J Occup Environ Hyg 2013;10(1):D1-D5
Ino K, Natori I, Ichikawa A, Vrtis RN, Ohmi T. Plasma enhanced in situ chamber cleaning evaluated by extracted-plasma-parameter analysis. IEEE Transctions on Semiconductor Manufacturing 1996;9(2):230-240
Ji B, Elder DL, Yang JH, Badowski PR, Karwacki EJ. Power dependence of $NF_3$ plasma stability for in situ chamber cleaning. J Appl Phys 2009;95: 84446-84451
Levinshtein ME, Rumyantsev SL, Shur MS. (ed.) Properties of Advanced Semiconductor Materials: GaN, AlN, InN, BN, SiC, SiGe. John Wiley & Sons. ; 2001
Manzione LT. Plastic Packaging of Microelectronics Devices. Van Nostrand Reinhold, New York: 1990
May GS, Spanos CJ. Fundamental of Semiconductor Manufacturing and Process Control. Hoboken, NJ.: John Wiley & Sons, Inc.; 2006. p. 25-81
McGuire GE. (ed) Semiconductor Materials and Process Technology Handbook. Park Ridge, NJ.: Noyes Publications; 1988
Meeks E, Larson RS, Ho P, Apblett C, Han SM, et al. Modeling of $SiO_2$ deposition in high density plasma reactors and comparisons of model predictions with experimental measurements. J Vac Sci Technol A 1998;16(2):544-563
Napierska D, Thomassen L, Lison D, Martens J, Hoet PH. The nanosilica hazard: another variable entity. Particle and Fibre Toxicology 2010;7:39
National Institute for Occupational Safety and Health (NIOSH): Silica, Crystalline, by XRD: Method 7500. In NIOSH Manual of Analytical Methods (NMAM), Fourth edition issue 4; 2003
Nishi Y, Doering R.(ed.) Handbook of semiconductor manufacturing technology. CRC Press; 2000
Parks CG, Conrad K, Cooper GS. Occupational exposure to crystalline silica and autoimmune disease. Environ. Health Perspect 1999;107 (Suppl. 5):793-802
Sayes CM, Wahi R. Wahi PA, Kurian et al. Correlating nanoscale titania structure with toxicity: A cytotoxicity and inflammatory response study with human dermal fibroblasts and human lung epithelial cells. Toxicol Sci 2006;92(1):174-185
Wolf S, Tauber RN. Silicon Processing. Lattice, Sunset Beach, CA: 1986
Whyte W. Cleanroom Technology - fundamentals of design, testing and operation. Chichester, U.K.: John Wiley & Sons, Inc.; 2001. Chapter 1:1-8
Yang H, Liu C, Yang D, Zhang H, Xi Zhuge. Comparative study of cytotoxicity, oxidative stress and genotoxicity induced by four typical nanomaterials: the role of particle size, shape and composition. J Appl Toxicol 2009;29(1):69-78
Zhang H, Dunphy DR, Jiang X, Meng H, Sun B et al. Process pathway dependence of amorphous silica nanoparticle toxicity: colloidal vs pyrolytic. J Am Chem Soc 2012;134(38):15790-15804
*원문 PDF 파일 및 링크정보가 존재하지 않을 경우 KISTI DDS 시스템에서 제공하는 원문복사서비스를 사용할 수 있습니다.
오픈액세스 학술지에 출판된 논문
※ AI-Helper는 부적절한 답변을 할 수 있습니다.