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NTIS 바로가기한국표면공학회지 = Journal of the Korean institute of surface engineering, v.50 no.3, 2017년, pp.155 - 163
Kim, Dong-Hyun (MSC Co., Ltd.) , Lee, Seong-Jun (MSC Co., Ltd.)
In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid...
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