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NTIS 바로가기전자통신동향분석 = Electronics and telecommunications trends, v.33 no.6, 2018년, pp.50 - 57
최광성 (ICT 소재연구그룹) , 문석환 (ICT 소재연구그룹) , 엄용성 (ICT 소재연구그룹)
As devices have evolved, traditional flip chip bonding and recently commercialized thermocompression bonding techniques have been limited. Laser-assisted bonding is attracting attention as a technology that satisfies both the requirements of mass production and the yield enhancement of advanced pack...
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K. Seyama et al, "Design and Application of Innovative Multi-Table and Bond Head Drive System on Thermal Compression Bonder with UPH over 2000," IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, May 29-June1, 2018, pp. 392-400.
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C. Kim et al., "Development of Extremely Thin Profile Flip Chip CSP using Laser Assisted Bonding Technology," IEEE CPMT Symp. Japan (ICSJ), Kyoto, Japan, Nov. 20-22, 2017, pp. 45-49.
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W.A. Braganca Jr. et al., "Collective Laser-assisted Bonding Process for 3D TSV Integration with NCP, " ETRI J., 2018, Accepted.
K.-S. Choi et al., "Interconnection Process using Laser and Hybrid Underfill for LED Array Module on PET Substrate," IEEE Electron. Compon. Technol. Conf., San Diego, CA, USA, Mya 29-June 1, 2018, pp. 1561-1567.
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