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NTIS 바로가기한국산학기술학회논문지 = Journal of the Korea Academia-Industrial cooperation Society, v.21 no.12, 2020년, pp.261 - 267
The demand for faster, lighter, and thinner portable electronic devices has brought about a change in semiconductor packaging technology. In response, a stacked chip-scale package(SCSP) is used widely in the assembly industry. One of the key materials for SCSP is a die-attach film (DAF). Excellent f...
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