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NTIS 바로가기한국기계가공학회지 = Journal of the Korean Society of Manufacturing Process Engineers, v.19 no.3, 2020년, pp.22 - 28
박기원 (인천대학교 대학원 기계공학과) , 김은영 (인천대학교 대학원 기계공학과) , 박동삼 (인천대학교 기계공학과)
This paper investigates the effects of retaining ring materials, particularly PPS and PEEK, used in the CMP process, on wafer polishing and ring wear. CMP can be performed using bonded type retaining rings made with PPS or injection molding type retaining rings made with PEEK. In this study, after p...
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