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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.4, 2022년, pp.15 - 20
이원준 (강원대학교 신소재공학과) , 김태희 (연세대학교 신소재공학과) , 최하령 (연세대학교 신소재공학과) , 김지승 (강원대학교 신소재공학과) , 이홍섭 (경희대학교 정보전자신소재공학과)
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