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NTIS 바로가기마이크로전자 및 패키징 학회지 = Journal of the Microelectronics and Packaging Society, v.29 no.2, 2022년, pp.91 - 97
전소연 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 이태영 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 박소정 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 이종훈 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문) , 유세훈 (한국생산기술연구원 마이크로조이닝센터 접합적층연구부문)
The wettability and rheological properties of solder paste with the size of the solder powder were evaluated. To formulate the solder paste, three types of solder powder were used: T4 (20~28 ㎛), T5 (15~25 ㎛), and T6 (5~15 ㎛). The viscosities of the T4, T5, and T6 solder pastes a...
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