[논문]티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성

한재호; 김동현

doi:10.5695/jsse.2022.55.2.102

[국내논문] 티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성
Deposition behavior of cyanide-free electroless Au plating solution using thiomalic acid as complexing agent and aminoethanethiol as reducing agent and characteristics of plated Au film 원문보기

한국표면공학회지 = Journal of the Korean institute of surface engineering, v.55 no.2, 2022년, pp.102 - 119

Abstract ▼ AI-Helper

Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.

주제어

표/그림 (23)

표 Table. 1. Composition of immersion type Au plating solution and plating conditions.
표 Table. 2. Composition of autocatalytic Au plating solution and plating conditions.
그림 Fig. 1. Relation between plating time and thickness of immersion type electroless Au plating film.
표 Table. 3. The test conditions of solder ball bonding strength.
그림 Fig. 2. Effect of component concentration and plating conditions on deposition rate of immersion type Au plating solution. (a)Effect of Au⁺ ion concentration. (b)Effect of TMA concentration. (c)Effect of bath pH. (d)Effect of bath temperature.
그림 Fig. 3. Changes in deposition rate and concentration of dissolved Ni ions in immersion type Au plating solution according to the used time in continuous plating.
그림 Fig. 4. Relation between plating time and thickness of autocatalytic electroless Au plating film.
그림 Fig. 5. Effect of component concentration and plating conditions on deposition rate of autocatalytic Au plating solution. (a) Effect of Au+ ion concentration. (b) Effect of TMA concentration. (c) Effect of AET concentration. (d) Effect of bath temperature. (e) Effect of bath pH.
그림 Fig. 6. Process for preparing thiomalic acid-gold (Aurous thiomalate) salt solution.
표 Table. 4. Changes in NH_3aq concentration in immersion type Au plating solution.
표 Table. 6. Relationship between color change of immersion type Au plating solution and high-temperature storage time.
표 Table. 5. Color change of plating solution according to NH_3aq concentration change in immersion type Au plating solution.
그림 Fig. 7. Effect of NH_3aq concentration on Au deposited amount and TMA concentration in immersion type Au plating solution after 6 hours of plating time.
그림 Fig. 8. Concentration changes of Au⁺ ions and Ni²⁺ ions in continuous plating performed without replenishment of consumed components.
그림 Fig. 9. Stability of autocatalytic Au plating bath in continuous plating.
그림 Fig. 10. Liquid level of molten solder.
그림 Fig. 11. Method of measuring solder wettability by meniscograph.
그림 Fig. 12. Effect of Au plating thickness on zero crossing time and wetting force.
그림 Fig. 13. Schematic diagram of solder ball bonding strength tester.
그림 Fig. 14. Effect of Au plating thickness on solder ball bonding strength.
그림 Fig. 15. Cross-sectional SEM images of bonding interface and distribution of some elements at various thicknesses of electrolessly plated Au films.
그림 Fig. 16. SEM images of plating films obtained from various different electroless Ni-P plating baths.
그림 Fig. 17. Comparison of solder ball bonding strength of electroless Au plating film on Ni-P plating film of various underlayers.

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