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NTIS 바로가기Composites research = 복합재료, v.35 no.3, 2022년, pp.182 - 187
김남훈 (Department of Mechanical Engineering, Hanbat National University) , 한관희 (Department of Mechanical Engineering, Hanbat National University) , 이민수 (Korea Packaging Integration Association) , 김현호 (Korea Packaging Integration Association) , 신광복 (Department of Mechanical Engineering, Hanbat National University)
In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it i...
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