[논문]반도체 공정 칠러 장비의 히터 접속부 전기배선에 대한 열적 특성 분석

김규빈; 김두현; 김성철

doi:10.14346/jkosos.2023.38.3.27

[국내논문] 반도체 공정 칠러 장비의 히터 접속부 전기배선에 대한 열적 특성 분석
Analysis of Thermal Characteristic for Wiring at Heater Connector of Semiconductor Chiller Equipment 원문보기

한국안전학회지 = Journal of the Korean Society of Safety, v.38 no.3, 2023년, pp.27 - 34

김규빈 (SK하이닉스 안전관리팀) , 김두현 (충북대학교 안전공학과) , 김성철 (충북대학교 안전공학과)

Abstract ▼ AI-Helper

With the technological development of the semiconductor industry, the roles of electrical and thermal energy supply and control of semiconductor equipment in ultrafine processes have become very important. However, instances of electrical fires in the chiller heater, which is used for cooling in the semiconductor manufacturing process, are increasing. A fire occurs in combustibles due to high heat at the connection part of the chiller heater, that is, when the number of electrical wires in the connection part is reduced or when the wires are completely disconnected. In this study, the temperature characteristics were compared and analyzed through experiments and 3D simulations. The number of electrical wires, which is the connection part of the chiller heater, was reduced by 90%, 50%, 30%, 10%, and 5%, and the wires were completely disconnected. When the number of electrical wires was reduced by 5%, heat of up to 80℃ was generated, which is a relatively high temperature but insufficient to cause a fire in combustibles. Complete disconnection occurred due to the vibration of the motor and other components, and sparks and arcs were generated, resulting in a rapid increase in temperature to up to 680℃. When completely disconnected, the temperature increase was sufficient to cause a fire in the combustibles covering the terminal block. Therefore, in this study, the causes of electrical fires in chiller heaters were investigated and preventive measures were proposed by analyzing abnormal signals and thermal characteristics caused by the electrical wiring being reduced and completely disconnected.

주제어

표/그림 (21)

그림 Fig. 1. Diagram of semiconductor process and heater heating device.
그림 Fig. 2. Heater connection diagram and insulator.
그림 Fig. 3. Immersion heater power connection configuration.
그림 Fig. 4. Carbonization phenomenon of chiller heater power connection.
표 Table 1. Electric fire and damage status of company A in the semiconductor process
그림 Fig. 5. Inappropriate case of crimp terminal of chiller heater connection.
그림 Fig. 6. Partial disconnection design of conductor.
표 Table 2. Current and thermal imaging instruments
표 Table 3. Test conditions for the electrical Cable(Teflon)
그림 Fig. 7. 3D simulation of conductor(6 types of scenarios).
그림 Fig. 8. Analysis process of 3D thermal analysis program.
표 Table 4. The specifications of electrical wire and Cover materials
그림 Fig. 9. 3D thermal simulation results in steady state.
그림 Fig. 10. Normal_strand 100%.
그림 Fig. 11. Disconnection_strand 90%.
그림 Fig. 12. Disconnection_strand 50%.
그림 Fig. 13. Disconnection_strand 30%.
그림 Fig. 14. Disconnection_strand 10%.
그림 Fig. 15. Disconnection_strand 5%.
그림 Fig. 16. Arc heat change in case of electrical wiring connection failure induction.
그림 Fig. 17. Temperature change according to the ratio of the number of semi-solid lines.

참고문헌 (12)

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상세보기
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