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NTIS 바로가기반도체공학회 논문지 = Transactions on semiconductor engineering, v.2 no.2, 2024년, pp.1 - 9
황소희 (Department of Chemistry, Hannam University) , 임진아 (Department of Chemistry, Hannam University) , 김운중 (Department of Chemistry, Hannam University)
CMP (Chemical Mechanical Polishing) processes have become essential for creating multilayered component structures in semiconductor manufacturing. Typically, the slurry composition in CMP processes involves a balance of three components such as ceria, dispersant, and deionized water. In this study, ...
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