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NTIS 바로가기CIRP annals ... manufacturing technology, v.47 no.1, 1998년, pp.27 - 30
Niemeier, J. , Seliger, G.
The expenditure for planning and setting-up of automated facilities for single point soldering is currently very high, since adjusting of process parameters is based on the operator's experience. A process model has been developed which describes the process of single point soldering and al...
Baehr 1996 Warme- und Stoffubertragung
Annals of the CIRP Feldmann 44 1 19 1995 10.1016/S0007-8506(07)62266-5 Direct Soldering of Electronic Components on Molded Devices
Hirt 377 1997 SMT ES&S Hybrid 1997 Partielle Lottechnologie als Erganzung der Reflowmassenlottechnik
Menzel 1995 Entwicklung einer flexiblen und effektiven Montagetechnik fur elektronische Bauqruppen
Annals of the CIRP Mengel 41/1/1992 29 1992 10.1016/S0007-8506(07)61145-7 Application of Advanced Data Processing Technology for Integrated Inspection in Electronical Assembly
Nicolics 96 1996 DSV-Bericht: Weichloten in Forschung und Praxis Automatische Qualitatssicherung wahrend des Laserlotens von Fine-Pitch-Bauelementen
Saile, P., 1993: Verbesserung der Warmezufuhr beim Reflowloten mit Hilfe der Computersimulation. Dissertation TU Munchen. Lehrstuhl fur Fugetechnik
Seliger 303 1996 New light-soldering-system integrates the assembly and soldering of SMD-components
Whalley, D.C., Ogunjimi, A.O., Conway P.P., Williams D.J., 1991, A Process Model of the infra-red reflow Soldering of Printed Circuit Board Assem-blies. IEEE/CHMT 91 IEMT Symposium: 122-125
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