[논문]Effects of alloying elements in high reliability copper wire bond material for high temperature applications

Eto, M.; Araki, N.; Yamada, T.; Klengel, R.; Klengel, S.; Petzold, M.; Sugiyama, M.; Fujimoto, S.

doi:10.1016/j.microrel.2020.113819

Effects of alloying elements in high reliability copper wire bond material for high temperature applications

Microelectronics reliability, v.114, 2020년, pp.113819 -

Eto, M. (Nippon Micrometal Corporation) , Araki, N. (Nippon Micrometal Corporation) , Yamada, T. (Nippon Micrometal Corporation) , Klengel, R. (Fraunhofer Institute for Microstructure of Materials and Systems IMWS) , Klengel, S. (Fraunhofer Institute for Microstructure of Materials and Systems IMWS) , Petzold, M. (Fraunhofer Institute for Microstructure of Materials and Systems IMWS) , Sugiyama, M. (Osaka University) , Fujimoto, S. (Osaka University)

Abstract ▼ AI-Helper

Abstract Recently, a shift from Au bonding wire to Cu bonding wire is expected for automotive application. Palladium coated copper (PCC) wire is strong candidate since it is widely used in LSI packages owing to its high performance and low cost. In order to apply PCC wire to automotive devices, long-term reliability specific to automobiles including stable operation under harsh environment with high temperature and humidity is required. However, pitting corrosion at the wedge bond portion was reported with PCC wire under high temperature storage life (HTSL) test. Depending on the surrounding environment such as mold compound, it is difficult for conventional PCC wire to achieve the target of automotive application. A newly developed PCC wire (EX1R) has thus developed. By using additive element in Cu core, halide induced interface corrosion and also pitting corrosion can be prevented successfully. In this paper, effect of additive element on the corrosion resistance will be discussed. The result shows that additive element forms protective passivation layer on the intermetallic compound (IMC) and Cu surface. Thereby, EX1R improves bond reliability even under severe reliability test condition. Highlights Effects of alloying elements in copper wire material Performance of bond reliability under high temperature environment Enhancing Cu wire bond reliability using alloying elements

참고문헌 (14)

Microelectron. Reliab. Yu 51 119 2011 10.1016/j.microrel.2010.04.022 Cu wire bond microstructure analysis and failure mechanism

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Microelectron. Reliab. Hang 48 416 2008 10.1016/j.microrel.2007.06.008 Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging

상세보기
Su 2012 Proc 2012 IEEE 62nd Electronic Components and Technology Conf An evaluation of effects of molding compound properties on reliability of Cu wire components
Microelectron. Reliab. Uno 51 148 2011 10.1016/j.microrel.2010.03.006 Bond reliability under humid environment for coated copper wire and bare copper wire

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Qin 2013 Proc 2012 IEEE 63rd Electronic Components and Technology Conf Molded reliability study for different Cu wire bonding configurations
Lee 2016 Proc 2016 IEEE 63th Electronic Components and Technology Conf Copper ball voids for Pd-Cu wires: affecting factors and methods of controlling
Vanessa 2018 2018 IEEE 38th International Electronics Manufacturing Technology Conf Mold compound and copper wire selection for quad-flat packages with high density leadframe in automotive applications
Chia 2017 2016 IEEE 37th International Electronics Manufacturing Technology Conf Palladium coated copper wire wedge integrity to withstand extended high temperature storage stress test
Microelectron. Reliab. Krinke 54 1995 2014 10.1016/j.microrel.2014.07.097 High temperature degradation of palladium coated copper bond wires

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Eto 2017 2017 IEEE 21st European Microelectron and Packaging Conf Newly developed high reliability palladium coated Cu wire for automotive application
Eto 2017 2017 IEEE 67th Electronic Components and Technology Conf Thermal bond reliability of high reliability new palladium-coated copper wire
Klengel 2019 2019 IEEE 69th Electronic Components and Technology Conf A new reliable, corrosion resistant gold-palladium coated copper wire material
Klengel 2019 2019 IEEE 22nd European Microelectron and Packaging Conf Influence of copper wire material to corrosion resistant packages and systems for high temperature applications
Lorenz 2019 2019 IEEE 22nd European Microelectron and Packaging Conf Investigation of mechanical and microstructure properties of a new, corrosion resistant gold-palladium coated copper bonding wire

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Effects of alloying elements in high reliability copper wire bond material for high temperature applications

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