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NTIS 바로가기Thin solid films, v.727, 2021년, pp.138680 -
Park, Yoonsoo (Department of Physics, Sungkyunkwan University) , Lim, Hyuna (Department of Physics, Sungkyunkwan University) , Kwon, Sungyool (Dielectric Deposition Product Division, Applied Materials Korea,) , Ban, Wonjin (Research and Development TEAM, SK Hynix) , Jang, Seonhee (Corresponding author.) , Jung, Donggeun (Department of Physics, Sungkyunkwan University)
Abstract In semiconductor industry, SiCOH films with low dielectric constant (relative dielectric constant k ≤ 4.0) have been widely used as inter-metal dielectric (IMD) materials in the interconnects of semiconductor chips, to reduce a resistance-capacitance delay. In this study, copolymerized ...
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