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Journal of micromechanics and microengineering.: structures, devices, and systems, v.31 no.9, 2021년, pp.095003 -
Szostak, Katarzyna M , Keshavarz, Meysam , Constandinou, Timothy G
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AbstractAdvancements in miniaturisation and new capabilities of implantable devices impose a need for the development of compact, hermetic, and CMOS-compatible micro packaging methods. Gold-tin-based eutectic bonding presents the potential for achieving low-footprint seals with low permeability to m...
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