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Micromachines, v.13 no.2, 2022년, pp.258 -
Li, Hongbo (Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China) , Zhang, Chenchen (lihongbo@ime.ac.cn (H.L.)) , Xu, Gaobo (zhangchenchen@ime.ac.cn (C.Z.)) , Ding, Xuefeng (xugaobo@ime.ac.cn (G.X.)) , Ni, Yue (chenguidong@ime.ac.cn (G.C.)) , Chen, Guidong (dpchen@ime.ac.cn (D.C.)) , Chen, Dapeng (Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China) , Zhou, Na (lihongbo@ime.ac.cn (H.L.)) , Mao, Haiyang (zhangchenchen@ime.ac.cn (C.Z.))
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In this article, we present the design, fabrication, and characterization of a thermopile infrared sensor array (TISA) pixel. This TISA pixel is composed of a dual-layer p+/n- poly-Si thermopile with a closed membrane and an n-channel metal oxide semiconductor (NMOS) switch. To address the challenge...
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