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9. Vacuum J Li 174 109174 2020 10.1016/j.vacuum.2020.109174 J. Li, T. Luo, H. Wen, J. Deng, M. Wu, Y. Li, G. Wang and Y. Pei, Design and regularity research of MOCVD heating plate based on experiments and simulations, Vacuum, 174 (2020) 109174. 

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15. Journal of the Semiconductor and Display Technology D H Kim 17 3 85 2018 D. H. Kim and K. S. Kim, A study on electrostatic chuck cooling by ceramic dielectric material and coolant path, Journal of the Semiconductor and Display Technology, 17(3) (2018) 85-89. 

16. Journal of the Semiconductor and Display Technology K M Jang 16 3 116 2017 K. M. Jang and K. S. Kim, A study on temperature characteristics according to ceramic material stacking sequence of electrostatic chuck surface, Journal of the Semiconductor and Display Technology, 16(3) (2017) 116-120. 

17. Journal of the Semiconductor and Display Technology K S Lee 10 4 21 2011 K. S. Lee, Coolant path geometry for improved electrostatic chuck temperature variation, Journal of the Semiconductor and Display Technology, 10(4) (2011) 21-23. 

18. Japanese Journal of Applied Physics D H Im 59 SJ SJJD01 2020 10.35848/1347-4065/ab840d D. H. Im, W. S. Min and S. J. Hong, Planar heating chuck to improve temperature uniformity of plasma processing equipment, Japanese Journal of Applied Physics, 59(SJ) (2020) SJJD01. 

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19. Journal of Mechanical Science and Technology H J Lee 35 8 3763 2021 10.1007/s12206-021-0745-3 H. J. Lee and S. H. Lee, Numerical evaluation on surface temperature uniformity of multi-zone and single-zone ceramic heaters with the electrostatic chuck, Journal of Mechanical Science and Technology, 35(8) (2021) 3763-3770. 

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21. Journal of the Semiconductor and Display Technology H C Du 20 2 19 2021 H. C. Du and S. J. Hong, Temperature analysis of electrostatic chuck for cryogenic etch equipment, Journal of the Semiconductor and Display Technology, 20(2) (2021) 19-24. 

22. Journal of the Semiconductor and Display Technology S H Jo 20 2 92 2021 S. H. Jo, J. H. Han, J. O. Kim, H. Han and S. J. Hong, CFD study for the design of coolant path in cryogenic etch chuck, Journal of the Semiconductor and Display Technology, 20(2) (2021) 92-97. 

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