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NTIS 바로가기Society for Information Display International Symposium digest of technical papers, v.53 no.1, 2022년, pp.1005 - 1008
Joo, Jiho (Electronics and Telecommunications Research Institute Daejeon Korea) , Choi, Gwang-Mun (Electronics and Telecommunications Research Institute Daejeon Korea) , Lee, Chanmi (Electronics and Telecommunications Research Institute Daejeon Korea) , Kye, In-seok (Electronics and Telecommunications Research Institute Daejeon Korea) , Eom, Yong-Sung (Electronics and Telecommunications Research Institute Daejeon Korea) , Jang, Ki-Seok (Electronics and Telecommunications Research Institute Daejeon Korea) , Hwang, Seok tae (Nexstar technology Corporation Yong-in Korea) , Kim, Jeong Duck (Nexstar technology Corporation Yong-in Korea) , Choi, Kwang-Seong (Electronics and Telecommunications Research Institute Daejeon Korea)
We used simultaneous transfer and bonding (SITRAB) technology to fabricate a full‐color Mini‐LED display on a flexible substrate. SITRAB technology is ETRI's patented technology that integrates transfer and bonding into a single process. We adopted a 25 μm‐thick polyimide fil...
Wu, Tingzhu, Sher, Chin-Wei, Lin, Yue, Lee, Chun-Fu, Liang, Shijie, Lu, Yijun, Huang Chen, Sung-Wen, Guo, Weijie, Kuo, Hao-Chung, Chen, Zhong. Mini-LED and Micro-LED: Promising Candidates for the Next Generation Display Technology. Applied sciences, vol.8, no.9, 1557-.
Liu, Zhaojun, Lin, Chun-Ho, Hyun, Byung-Ryool, Sher, Chin-Wei, Lv, Zhijian, Luo, Bingqing, Jiang, Fulong, Wu, Tom, Ho, Chih-Hsiang, Kuo, Hao-Chung, He, Jr-Hau. Micro-light-emitting diodes with quantum dots in display technology. Light, science & applications, vol.9, no.1, 83-.
Virey, Eric H., Baron, Nicolas, Bouhamri, Zine. 30‐4: MicroLED Display Technology Trends and Intellectual Property Landscape. Society for Information Display International Symposium digest of technical papers, vol.51, no.1, 436-439.
Zhang, J.H, Chan, Y.C, Alam, M.O, Fu, S. Contact resistance and adhesion performance of ACF interconnections to aluminum metallization. Microelectronics reliability, vol.43, no.8, 1303-1310.
Proc. IEEE ECTC Joo Jiho 1309 2020
SID Digest Choi Kwang-Seong 436 30 4 2021
Choi, Gwang-Mun, Jang, Ki-Seok, Choi, Kwang-Seong, Joo, Jiho, Yun, Ho-Gyeong, Lee, Chanmi, Eom, Yong-Sung. Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining. Polymers, vol.13, no.6, 957-.
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