최소 단어 이상 선택하여야 합니다.
최대 10 단어까지만 선택 가능합니다.
다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro Optics Society, v.22 no.4, 1999년, pp.592 - 601
Lin, Wei (Nokia Res. Center, Irving, TX, USA) , Lee, Y.C.
This paper presents a systematic study of the use of formic acid vapor fluxless soldering with eutectic Pb/Sn solder. The study focused on the solder joint self-aligning process and the final alignment accuracy. The main effect considered was the formic acid vapor concentration. In addition, other effects of solder joint height and background vibration were studied. The self-alignment characteristics of the fluxless soldering process was as good as those using liquid flux at 220°C. 2 μm alignment accuracy could be achieved within 10 s. The most important parameter was the formic acid vapor concentration in the reflow chamber. The effective concentration window was found to be greater than 0.7% in volume.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.