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NTIS 바로가기フォトポリマ-懇話會誌= Journal of photopolymer science and technology, v.22 no.3, 2009년, pp.417 - 422
Ishii, Junichi (Sony Chemical & Information Device Corporation) , Morita, Keisuke (Department of Chemistry, Faculty of Science, Toho University) , Hasegawa, Takatoshi (Department of Chemistry, Faculty of Science, Toho University)
Amide- and triazine-containing diamines were incorporated by copolymerization into a siloxane-containing ultra-low-modulus polyimide (PI) as a novel cover layer material to solve some serious problems in the plating process such as interpenetration of an acidic plating solution into the interface be...
Ishi, Junichi, Sunaga, Tomoyasu, Nomura, Mamiko, Kanaya, Hiroki. Organo-soluble Polyimides and Their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards. フォトポリマ-懇話會誌= Journal of photopolymer science and technology, vol.21, no.1, 107-112.
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Chung, I. S., Park, C. E., Ree, M., Kim, S. Y.. Soluble Polyimides Containing Benzimidazole Rings for Interlevel Dielectrics. Chemistry of materials : a publication of the American Chemical Society, vol.13, no.9, 2801-2806.
Jou, Jwo-Huei, Chen, Lih-Jiuan. Relaxation modulus and thermal expansion coefficient of polyimide films coated on substrates. Applied physics letters, vol.59, no.1, 46-47.
Furukawa, Nobuyuki, Yamada, Yasuharu, Kimura, Yoshiharu. Preparation and stress relaxation properties of thermoplastic polysiloxane- block-polyimides. High performance polymers, vol.8, no.4, 617-630.
Ishii, Junichi, Akamatsu, Tadashi. Organo-Soluble Low CTE Polyimides and their Applications to Photosensitive Cover Layer Materials in Flexible Printed Circuit Boards. High performance polymers, vol.21, no.2, 123-138.
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