In this work, thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assemblies having various chip and substrate thicknesses for thin chip-on-board (COB) packages were investigated. In order to analyze T/C reliability, shear strains of six flip chip assemblies ...
In this work, thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assemblies having various chip and substrate thicknesses for thin chip-on-board (COB) packages were investigated. In order to analyze T/C reliability, shear strains of six flip chip assemblies were calculated using Suhir's model. In addition, correlation of shear strain with die warpage was attempted. The thicknesses of the chips used were 180μm and 480μm. The thicknesses of the substrates were 120, 550, and 980μm. Thus, six combinations of flip chip assemblies were prepared for the T/C reliability test. During the T/C reliability test, the 180μm thick chip assemblies showed more stable contact resistance changes than the 480μm thick chip assemblies did for all three substrates. The 550μm thick substrate assemblies, which had the lowest CTE among three substrates, showed the best T/C reliability performance for a given chip thickness. In order to investigate what the T/C reliability performance results from, die warpages of six assemblies were measured using Twyman-Green interferometry. In addition, shear strains of the flip chip assemblies were calculated using measured material properties of ACF and substrates through Suhir's 2-D model. T/C reliability of the flip chip assemblies was independent of die warpages; it was, however, in proportion to calculated shear strain. The result was closely related with material properties of the substrates. The T/C reliability of the ACF flip chip assemblies was concluded to be dominatingly dependent on the induced shear strains of ACF layers.
In this work, thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assemblies having various chip and substrate thicknesses for thin chip-on-board (COB) packages were investigated. In order to analyze T/C reliability, shear strains of six flip chip assemblies were calculated using Suhir's model. In addition, correlation of shear strain with die warpage was attempted. The thicknesses of the chips used were 180μm and 480μm. The thicknesses of the substrates were 120, 550, and 980μm. Thus, six combinations of flip chip assemblies were prepared for the T/C reliability test. During the T/C reliability test, the 180μm thick chip assemblies showed more stable contact resistance changes than the 480μm thick chip assemblies did for all three substrates. The 550μm thick substrate assemblies, which had the lowest CTE among three substrates, showed the best T/C reliability performance for a given chip thickness. In order to investigate what the T/C reliability performance results from, die warpages of six assemblies were measured using Twyman-Green interferometry. In addition, shear strains of the flip chip assemblies were calculated using measured material properties of ACF and substrates through Suhir's 2-D model. T/C reliability of the flip chip assemblies was independent of die warpages; it was, however, in proportion to calculated shear strain. The result was closely related with material properties of the substrates. The T/C reliability of the ACF flip chip assemblies was concluded to be dominatingly dependent on the induced shear strains of ACF layers.
참고문헌 (17)
Mater Technol Liu 10 11/12 247 1995 10.1080/10667857.1995.11752642 An overview of advances in conductive adhesive joining technology for electronics applications
Adv Electron Pack Yim 1999 1 367 1999 Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump
Feil M, Adler C, Hemmetzberger D, Konig M, Bock K. The challenge of ultra thin chip assembly. In: Proc 54th electron comp technol conf; 2004. p. 35-40.
Microelectron Reliab Jokinen 42 1913 2002 10.1016/S0026-2714(02)00100-2 Anisotropic conductive film flip chip joining using thin chips
J Elect Pack Kwon 127 2 86 2005 10.1115/1.1846062 Thermal cycling reliability and delamination of anisotropic conductive adhesives flip chip on organic substrates with emphasis on the thermal deformation
Microelectron Reliab Kwon 46 589 2006 10.1016/j.microrel.2005.06.014 Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: an experimental study
IEEE Trans Comp Pack Tech Jang 31 3 559 2008 10.1109/TCAPT.2008.2001129 Effects of thermal cycling on material properties of nonconductive pastes (NCPs) and the relationship between material properties and warpage behavior during thermal cycling
J Macromol Sci Part B: Phys Li 36 3 357 1997 10.1080/00222349708212389 Studies on relaxation and thermal expansion behavior of polysiloxane-modified epoxy resin
IEEE Trans Comp Pack Technol Tsai 27 3 568 2004 10.1109/TCAPT.2004.831817 Investigation of thermomechanical behaviors of flip chip bga packages during manufacturing process and thermal cycling
Solder Surf Mt Tech Frisk 18 4 28 2006 10.1108/09540910610717884 The effects of chip and substrate thickness on the reliability of ACA bonded flip chip joints
Suhir E. Die attachment and its influence on thermal stresses in the die and the attachment. In: Proc IEEE/EIA 37th electronic components conf; 1987. p. 143-8.
J Electron Pack Tsai 126 115 2004 10.1115/1.1648056 A note on Suhir’s solution of thermal stresses for a die-substrate assembly
IEEE Trans Comp Pack Manuf Technol A Nysaether 21 281 1998 10.1109/95.705476 Measurement of solder bump lifetime as a function of underfill material properties
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