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Journal of applied mechanics, v.79 no.3, 2012년, pp.031022 -
Wang, Shuodao (Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208) , Li, Ming (State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, P. R. C.) , Wu, Jian (Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208) , Kim, Dae-Hyeong (Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P. R. C.) , Lu, Nanshu (School of Chemical and Biological Engineering, Seoul National University, Seoul, 151-744, Korea) , Su, Yewang (Department of Aerospace Engineering and Engineering Mechanics, University of Texas at Austin, Austin, TX 78705) , Kang, Zhan (Department of Civil and Environmental Engineering, Northwestern University, Evanston, IL 60208) , Huang, Yonggang (State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, P. R. C.) , Rogers, John A. (Department of Mechanical Engineering, Northwestern University, Evanston, IL 60208)
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Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der Waals interactions alone, yet provides robust, intimate contact to the skin. Recent advances on this technology wil...
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